JP2015050228A5 - - Google Patents
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- Publication number
- JP2015050228A5 JP2015050228A5 JP2013179272A JP2013179272A JP2015050228A5 JP 2015050228 A5 JP2015050228 A5 JP 2015050228A5 JP 2013179272 A JP2013179272 A JP 2013179272A JP 2013179272 A JP2013179272 A JP 2013179272A JP 2015050228 A5 JP2015050228 A5 JP 2015050228A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- power semiconductor
- solder
- bonded
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 46
- 229910000679 solder Inorganic materials 0.000 claims 15
- 239000000919 ceramic Substances 0.000 claims 13
- 239000000758 substrate Substances 0.000 claims 13
- 238000004519 manufacturing process Methods 0.000 claims 10
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims 1
- 229910017755 Cu-Sn Inorganic materials 0.000 claims 1
- 229910017927 Cu—Sn Inorganic materials 0.000 claims 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- 229910007570 Zn-Al Inorganic materials 0.000 claims 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims 1
- 235000019253 formic acid Nutrition 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 229910000765 intermetallic Inorganic materials 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013179272A JP6069135B2 (ja) | 2013-08-30 | 2013-08-30 | 電力用半導体装置及びその製造方法、並びに、そのための半田 |
| PCT/JP2014/069108 WO2015029638A1 (ja) | 2013-08-30 | 2014-07-17 | 電力用半導体装置及びその製造方法、並びに、そのための半田 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013179272A JP6069135B2 (ja) | 2013-08-30 | 2013-08-30 | 電力用半導体装置及びその製造方法、並びに、そのための半田 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015050228A JP2015050228A (ja) | 2015-03-16 |
| JP2015050228A5 true JP2015050228A5 (enExample) | 2016-02-04 |
| JP6069135B2 JP6069135B2 (ja) | 2017-02-01 |
Family
ID=52586213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013179272A Active JP6069135B2 (ja) | 2013-08-30 | 2013-08-30 | 電力用半導体装置及びその製造方法、並びに、そのための半田 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6069135B2 (enExample) |
| WO (1) | WO2015029638A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017183222A1 (ja) | 2016-04-21 | 2017-10-26 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| JP7139862B2 (ja) | 2018-10-15 | 2022-09-21 | 株式会社デンソー | 半導体装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040241039A1 (en) * | 2000-10-27 | 2004-12-02 | H-Technologies Group | High temperature lead-free solder compositions |
| JP2002252351A (ja) * | 2001-02-26 | 2002-09-06 | Sanyo Electric Co Ltd | 半導体装置 |
| JP2009060746A (ja) * | 2007-09-03 | 2009-03-19 | Sumitomo Electric Ind Ltd | コネクタユニット |
| JP5523680B2 (ja) * | 2008-05-29 | 2014-06-18 | 株式会社東芝 | 接合体、半導体装置および接合体の製造方法 |
| DE102010044709B4 (de) * | 2010-09-08 | 2015-07-02 | Vincotech Holdings S.à.r.l. | Leistungshalbleitermodul mit Metallsinterverbindungen sowie Herstellungsverfahren |
| JP5675525B2 (ja) * | 2011-07-28 | 2015-02-25 | 日産自動車株式会社 | 半導体装置の製造方法及び半導体装置 |
| JP2013033891A (ja) * | 2011-08-03 | 2013-02-14 | Hitachi Ltd | 半導体装置及びその製造方法 |
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2013
- 2013-08-30 JP JP2013179272A patent/JP6069135B2/ja active Active
-
2014
- 2014-07-17 WO PCT/JP2014/069108 patent/WO2015029638A1/ja not_active Ceased