JP2013145964A - 圧電デバイス及び圧電デバイスの製造方法 - Google Patents

圧電デバイス及び圧電デバイスの製造方法 Download PDF

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Publication number
JP2013145964A
JP2013145964A JP2012005433A JP2012005433A JP2013145964A JP 2013145964 A JP2013145964 A JP 2013145964A JP 2012005433 A JP2012005433 A JP 2012005433A JP 2012005433 A JP2012005433 A JP 2012005433A JP 2013145964 A JP2013145964 A JP 2013145964A
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JP
Japan
Prior art keywords
cover body
metal cover
piezoelectric device
ceramic
vibrating piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012005433A
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English (en)
Japanese (ja)
Other versions
JP2013145964A5 (enrdf_load_stackoverflow
Inventor
Makoto Yamashita
誠 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
Original Assignee
Nihon Dempa Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Dempa Kogyo Co Ltd filed Critical Nihon Dempa Kogyo Co Ltd
Priority to JP2012005433A priority Critical patent/JP2013145964A/ja
Publication of JP2013145964A publication Critical patent/JP2013145964A/ja
Publication of JP2013145964A5 publication Critical patent/JP2013145964A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2012005433A 2012-01-13 2012-01-13 圧電デバイス及び圧電デバイスの製造方法 Pending JP2013145964A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012005433A JP2013145964A (ja) 2012-01-13 2012-01-13 圧電デバイス及び圧電デバイスの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012005433A JP2013145964A (ja) 2012-01-13 2012-01-13 圧電デバイス及び圧電デバイスの製造方法

Publications (2)

Publication Number Publication Date
JP2013145964A true JP2013145964A (ja) 2013-07-25
JP2013145964A5 JP2013145964A5 (enrdf_load_stackoverflow) 2015-02-12

Family

ID=49041556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012005433A Pending JP2013145964A (ja) 2012-01-13 2012-01-13 圧電デバイス及び圧電デバイスの製造方法

Country Status (1)

Country Link
JP (1) JP2013145964A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2016111047A1 (ja) * 2015-01-08 2017-08-10 株式会社村田製作所 圧電振動部品の製造方法
WO2017208747A1 (ja) * 2016-05-31 2017-12-07 株式会社村田製作所 圧電振動素子搭載用の集合基板及びその製造方法、並びに、圧電振動子の製造方法
WO2018070221A1 (ja) * 2016-10-11 2018-04-19 株式会社村田製作所 圧電振動子及びその製造方法
JP2022191029A (ja) * 2021-06-15 2022-12-27 株式会社トランストロン 取付構造
JPWO2022269970A1 (enrdf_load_stackoverflow) * 2021-06-23 2022-12-29
US11736089B2 (en) 2016-09-08 2023-08-22 Murata Manufacturing Co., Ltd. Quartz crystal resonator unit and method of manufacturing the same

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56116723U (enrdf_load_stackoverflow) * 1980-02-04 1981-09-07
JPH06132766A (ja) * 1992-10-20 1994-05-13 Rohm Co Ltd 圧電発振子
JP2007173975A (ja) * 2005-12-19 2007-07-05 Nippon Dempa Kogyo Co Ltd 水晶デバイス
JP2008060991A (ja) * 2006-08-31 2008-03-13 Kyocera Kinseki Corp 圧電デバイス
JP2009302311A (ja) * 2008-06-13 2009-12-24 Yamaha Corp 半導体装置用パッケージ、半導体装置、並びにマイクロフォンパッケージ
JP2011009808A (ja) * 2009-06-23 2011-01-13 Nippon Dempa Kogyo Co Ltd 水晶振動子
JP2011066651A (ja) * 2009-09-17 2011-03-31 Kyocera Kinseki Corp 圧電デバイス
JP2011147054A (ja) * 2010-01-18 2011-07-28 Seiko Epson Corp 電子装置、および、電子装置の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56116723U (enrdf_load_stackoverflow) * 1980-02-04 1981-09-07
JPH06132766A (ja) * 1992-10-20 1994-05-13 Rohm Co Ltd 圧電発振子
JP2007173975A (ja) * 2005-12-19 2007-07-05 Nippon Dempa Kogyo Co Ltd 水晶デバイス
JP2008060991A (ja) * 2006-08-31 2008-03-13 Kyocera Kinseki Corp 圧電デバイス
JP2009302311A (ja) * 2008-06-13 2009-12-24 Yamaha Corp 半導体装置用パッケージ、半導体装置、並びにマイクロフォンパッケージ
JP2011009808A (ja) * 2009-06-23 2011-01-13 Nippon Dempa Kogyo Co Ltd 水晶振動子
JP2011066651A (ja) * 2009-09-17 2011-03-31 Kyocera Kinseki Corp 圧電デバイス
JP2011147054A (ja) * 2010-01-18 2011-07-28 Seiko Epson Corp 電子装置、および、電子装置の製造方法

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2016111047A1 (ja) * 2015-01-08 2017-08-10 株式会社村田製作所 圧電振動部品の製造方法
CN108604888B (zh) * 2016-05-31 2019-08-27 株式会社村田制作所 压电振动元件搭载用的集合基板以及其制造方法、压电振子的制造方法
WO2017208747A1 (ja) * 2016-05-31 2017-12-07 株式会社村田製作所 圧電振動素子搭載用の集合基板及びその製造方法、並びに、圧電振動子の製造方法
JP6315418B1 (ja) * 2016-05-31 2018-04-25 株式会社村田製作所 圧電振動素子搭載用の集合基板及びその製造方法、並びに、圧電振動子の製造方法
CN108604888A (zh) * 2016-05-31 2018-09-28 株式会社村田制作所 压电振动元件搭载用的集合基板以及其制造方法、压电振子的制造方法
US11736089B2 (en) 2016-09-08 2023-08-22 Murata Manufacturing Co., Ltd. Quartz crystal resonator unit and method of manufacturing the same
US11722111B2 (en) 2016-10-11 2023-08-08 Murata Manufacturing Co., Ltd. Piezoelectric resonator unit and method of manufacturing the same
JPWO2018070221A1 (ja) * 2016-10-11 2019-07-04 株式会社村田製作所 圧電振動子及びその製造方法
CN109804560B (zh) * 2016-10-11 2023-03-14 株式会社村田制作所 压电振子及其制造方法
CN109804560A (zh) * 2016-10-11 2019-05-24 株式会社村田制作所 压电振子及其制造方法
WO2018070221A1 (ja) * 2016-10-11 2018-04-19 株式会社村田製作所 圧電振動子及びその製造方法
JP2022191029A (ja) * 2021-06-15 2022-12-27 株式会社トランストロン 取付構造
JP7614029B2 (ja) 2021-06-15 2025-01-15 株式会社トランストロン 取付構造
JPWO2022269970A1 (enrdf_load_stackoverflow) * 2021-06-23 2022-12-29
WO2022269970A1 (ja) * 2021-06-23 2022-12-29 株式会社村田製作所 圧電振動子及び圧電振動子の製造方法
JP7454141B2 (ja) 2021-06-23 2024-03-22 株式会社村田製作所 圧電振動子及び圧電振動子の製造方法

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