JPWO2022269970A1 - - Google Patents
Info
- Publication number
- JPWO2022269970A1 JPWO2022269970A1 JP2023529464A JP2023529464A JPWO2022269970A1 JP WO2022269970 A1 JPWO2022269970 A1 JP WO2022269970A1 JP 2023529464 A JP2023529464 A JP 2023529464A JP 2023529464 A JP2023529464 A JP 2023529464A JP WO2022269970 A1 JPWO2022269970 A1 JP WO2022269970A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021104126 | 2021-06-23 | ||
JP2021104126 | 2021-06-23 | ||
PCT/JP2022/003222 WO2022269970A1 (ja) | 2021-06-23 | 2022-01-28 | 圧電振動子及び圧電振動子の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2022269970A1 true JPWO2022269970A1 (enrdf_load_stackoverflow) | 2022-12-29 |
JP7454141B2 JP7454141B2 (ja) | 2024-03-22 |
Family
ID=84543737
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023529464A Active JP7454141B2 (ja) | 2021-06-23 | 2022-01-28 | 圧電振動子及び圧電振動子の製造方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP7454141B2 (enrdf_load_stackoverflow) |
WO (1) | WO2022269970A1 (enrdf_load_stackoverflow) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012140936A1 (ja) * | 2011-04-11 | 2012-10-18 | 株式会社村田製作所 | 電子部品及び電子部品の製造方法 |
JP2013062712A (ja) * | 2011-09-14 | 2013-04-04 | Nippon Dempa Kogyo Co Ltd | 表面実装水晶振動子及びその製造方法 |
JP2013145964A (ja) * | 2012-01-13 | 2013-07-25 | Nippon Dempa Kogyo Co Ltd | 圧電デバイス及び圧電デバイスの製造方法 |
JP2015070386A (ja) * | 2013-09-27 | 2015-04-13 | 京セラクリスタルデバイス株式会社 | 水晶デバイス |
JP2015186095A (ja) * | 2014-03-25 | 2015-10-22 | 京セラクリスタルデバイス株式会社 | 水晶デバイス |
WO2016190090A1 (ja) * | 2015-05-27 | 2016-12-01 | 株式会社村田製作所 | 圧電振動素子搭載用基板並びに圧電振動子及びその製造方法 |
JP2019062259A (ja) * | 2017-09-25 | 2019-04-18 | 日本電波工業株式会社 | セラミックパッケージ及びその製造方法、並びに圧電デバイス及び圧電デバイスの製造方法 |
-
2022
- 2022-01-28 JP JP2023529464A patent/JP7454141B2/ja active Active
- 2022-01-28 WO PCT/JP2022/003222 patent/WO2022269970A1/ja active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012140936A1 (ja) * | 2011-04-11 | 2012-10-18 | 株式会社村田製作所 | 電子部品及び電子部品の製造方法 |
JP2013062712A (ja) * | 2011-09-14 | 2013-04-04 | Nippon Dempa Kogyo Co Ltd | 表面実装水晶振動子及びその製造方法 |
JP2013145964A (ja) * | 2012-01-13 | 2013-07-25 | Nippon Dempa Kogyo Co Ltd | 圧電デバイス及び圧電デバイスの製造方法 |
JP2015070386A (ja) * | 2013-09-27 | 2015-04-13 | 京セラクリスタルデバイス株式会社 | 水晶デバイス |
JP2015186095A (ja) * | 2014-03-25 | 2015-10-22 | 京セラクリスタルデバイス株式会社 | 水晶デバイス |
WO2016190090A1 (ja) * | 2015-05-27 | 2016-12-01 | 株式会社村田製作所 | 圧電振動素子搭載用基板並びに圧電振動子及びその製造方法 |
JP2019062259A (ja) * | 2017-09-25 | 2019-04-18 | 日本電波工業株式会社 | セラミックパッケージ及びその製造方法、並びに圧電デバイス及び圧電デバイスの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP7454141B2 (ja) | 2024-03-22 |
WO2022269970A1 (ja) | 2022-12-29 |
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