JP2013140874A - 電子デバイス、セラミック基板、製造方法、及び圧電発振器 - Google Patents
電子デバイス、セラミック基板、製造方法、及び圧電発振器 Download PDFInfo
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- JP2013140874A JP2013140874A JP2012000500A JP2012000500A JP2013140874A JP 2013140874 A JP2013140874 A JP 2013140874A JP 2012000500 A JP2012000500 A JP 2012000500A JP 2012000500 A JP2012000500 A JP 2012000500A JP 2013140874 A JP2013140874 A JP 2013140874A
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- Prior art keywords
- ceramic substrate
- metal lid
- metallized layer
- piezoelectric
- electronic device
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- 239000000919 ceramic Substances 0.000 title claims abstract description 135
- 239000000758 substrate Substances 0.000 title claims abstract description 121
- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 119
- 239000002184 metal Substances 0.000 claims abstract description 119
- 239000000463 material Substances 0.000 claims abstract description 73
- 238000005219 brazing Methods 0.000 claims abstract description 26
- 230000002093 peripheral effect Effects 0.000 claims abstract description 21
- 238000005304 joining Methods 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 27
- 229910052802 copper Inorganic materials 0.000 claims description 27
- 239000010949 copper Substances 0.000 claims description 27
- 238000010894 electron beam technology Methods 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000003466 welding Methods 0.000 abstract description 20
- 238000001816 cooling Methods 0.000 abstract description 5
- 238000007789 sealing Methods 0.000 abstract description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 20
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 16
- 229910052709 silver Inorganic materials 0.000 description 16
- 239000004332 silver Substances 0.000 description 16
- 239000010408 film Substances 0.000 description 11
- 229910052759 nickel Inorganic materials 0.000 description 10
- 239000013078 crystal Substances 0.000 description 8
- 229910000833 kovar Inorganic materials 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 238000005253 cladding Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000005284 excitation Effects 0.000 description 5
- 238000001465 metallisation Methods 0.000 description 5
- 239000010453 quartz Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 235000014676 Phragmites communis Nutrition 0.000 description 4
- 230000003139 buffering effect Effects 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 229910000906 Bronze Inorganic materials 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000010974 bronze Substances 0.000 description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 244000273256 Phragmites communis Species 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000005555 metalworking Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012000500A JP2013140874A (ja) | 2012-01-05 | 2012-01-05 | 電子デバイス、セラミック基板、製造方法、及び圧電発振器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012000500A JP2013140874A (ja) | 2012-01-05 | 2012-01-05 | 電子デバイス、セラミック基板、製造方法、及び圧電発振器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013140874A true JP2013140874A (ja) | 2013-07-18 |
| JP2013140874A5 JP2013140874A5 (enExample) | 2015-01-29 |
Family
ID=49038079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012000500A Withdrawn JP2013140874A (ja) | 2012-01-05 | 2012-01-05 | 電子デバイス、セラミック基板、製造方法、及び圧電発振器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2013140874A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015039133A (ja) * | 2013-08-19 | 2015-02-26 | 日本特殊陶業株式会社 | パッケージ |
| JP2021057667A (ja) * | 2019-09-27 | 2021-04-08 | 太陽誘電株式会社 | 電子デバイス、モジュールおよびウエハ |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01217948A (ja) * | 1988-02-26 | 1989-08-31 | Hitachi Ltd | 気密封止型半導体装置 |
| JPH0252444U (enExample) * | 1988-10-07 | 1990-04-16 | ||
| JPH03286556A (ja) * | 1990-04-03 | 1991-12-17 | Fujitsu Ltd | 半導体装置の封止構造 |
| JPH06151628A (ja) * | 1992-10-30 | 1994-05-31 | Ngk Spark Plug Co Ltd | 半導体素子用セラミック容器 |
| JPH11126850A (ja) * | 1997-10-24 | 1999-05-11 | Kyocera Corp | 電子装置 |
| JP2000012721A (ja) * | 1998-06-25 | 2000-01-14 | Kyocera Corp | 電子部品収納用容器 |
| JP2000286353A (ja) * | 1999-03-30 | 2000-10-13 | Kyocera Corp | 半導体素子収納用パッケージ |
| JP2002164453A (ja) * | 2000-11-29 | 2002-06-07 | Kyocera Corp | 半導体素子収納用パッケージ |
| JP2005268257A (ja) * | 2004-03-16 | 2005-09-29 | Kyocera Corp | 電子部品収納用パッケージおよび電子装置 |
| JP2007227802A (ja) * | 2006-02-24 | 2007-09-06 | Kyocera Corp | 電子部品搭載用部材 |
| JP2010008172A (ja) * | 2008-06-25 | 2010-01-14 | Panasonic Electric Works Co Ltd | 半導体装置 |
| JP2011139024A (ja) * | 2009-12-04 | 2011-07-14 | Seiko Epson Corp | パッケージ、および、それを用いた振動デバイス |
-
2012
- 2012-01-05 JP JP2012000500A patent/JP2013140874A/ja not_active Withdrawn
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01217948A (ja) * | 1988-02-26 | 1989-08-31 | Hitachi Ltd | 気密封止型半導体装置 |
| JPH0252444U (enExample) * | 1988-10-07 | 1990-04-16 | ||
| JPH03286556A (ja) * | 1990-04-03 | 1991-12-17 | Fujitsu Ltd | 半導体装置の封止構造 |
| JPH06151628A (ja) * | 1992-10-30 | 1994-05-31 | Ngk Spark Plug Co Ltd | 半導体素子用セラミック容器 |
| JPH11126850A (ja) * | 1997-10-24 | 1999-05-11 | Kyocera Corp | 電子装置 |
| JP2000012721A (ja) * | 1998-06-25 | 2000-01-14 | Kyocera Corp | 電子部品収納用容器 |
| JP2000286353A (ja) * | 1999-03-30 | 2000-10-13 | Kyocera Corp | 半導体素子収納用パッケージ |
| JP2002164453A (ja) * | 2000-11-29 | 2002-06-07 | Kyocera Corp | 半導体素子収納用パッケージ |
| JP2005268257A (ja) * | 2004-03-16 | 2005-09-29 | Kyocera Corp | 電子部品収納用パッケージおよび電子装置 |
| JP2007227802A (ja) * | 2006-02-24 | 2007-09-06 | Kyocera Corp | 電子部品搭載用部材 |
| JP2010008172A (ja) * | 2008-06-25 | 2010-01-14 | Panasonic Electric Works Co Ltd | 半導体装置 |
| JP2011139024A (ja) * | 2009-12-04 | 2011-07-14 | Seiko Epson Corp | パッケージ、および、それを用いた振動デバイス |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015039133A (ja) * | 2013-08-19 | 2015-02-26 | 日本特殊陶業株式会社 | パッケージ |
| JP2021057667A (ja) * | 2019-09-27 | 2021-04-08 | 太陽誘電株式会社 | 電子デバイス、モジュールおよびウエハ |
| JP7406331B2 (ja) | 2019-09-27 | 2023-12-27 | 太陽誘電株式会社 | 電子デバイス、モジュールおよびウエハ |
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