JP2013140874A5 - - Google Patents
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- Publication number
- JP2013140874A5 JP2013140874A5 JP2012000500A JP2012000500A JP2013140874A5 JP 2013140874 A5 JP2013140874 A5 JP 2013140874A5 JP 2012000500 A JP2012000500 A JP 2012000500A JP 2012000500 A JP2012000500 A JP 2012000500A JP 2013140874 A5 JP2013140874 A5 JP 2013140874A5
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- metallized layer
- metal lid
- electronic device
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000919 ceramic Substances 0.000 claims 7
- 239000002184 metal Substances 0.000 claims 7
- 229910052751 metal Inorganic materials 0.000 claims 7
- 239000000758 substrate Substances 0.000 claims 7
- 230000002093 peripheral effect Effects 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 238000005219 brazing Methods 0.000 claims 1
- 238000010894 electron beam technology Methods 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
- 238000005304 joining Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012000500A JP2013140874A (ja) | 2012-01-05 | 2012-01-05 | 電子デバイス、セラミック基板、製造方法、及び圧電発振器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012000500A JP2013140874A (ja) | 2012-01-05 | 2012-01-05 | 電子デバイス、セラミック基板、製造方法、及び圧電発振器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013140874A JP2013140874A (ja) | 2013-07-18 |
| JP2013140874A5 true JP2013140874A5 (enExample) | 2015-01-29 |
Family
ID=49038079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012000500A Withdrawn JP2013140874A (ja) | 2012-01-05 | 2012-01-05 | 電子デバイス、セラミック基板、製造方法、及び圧電発振器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2013140874A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015039133A (ja) * | 2013-08-19 | 2015-02-26 | 日本特殊陶業株式会社 | パッケージ |
| JP7406331B2 (ja) * | 2019-09-27 | 2023-12-27 | 太陽誘電株式会社 | 電子デバイス、モジュールおよびウエハ |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01217948A (ja) * | 1988-02-26 | 1989-08-31 | Hitachi Ltd | 気密封止型半導体装置 |
| JPH0741159Y2 (ja) * | 1988-10-07 | 1995-09-20 | 日本特殊陶業株式会社 | 気密封止型セラミックパッケージ |
| JPH03286556A (ja) * | 1990-04-03 | 1991-12-17 | Fujitsu Ltd | 半導体装置の封止構造 |
| JP2841259B2 (ja) * | 1992-10-30 | 1998-12-24 | 日本特殊陶業株式会社 | 半導体素子用セラミック容器 |
| JPH11126850A (ja) * | 1997-10-24 | 1999-05-11 | Kyocera Corp | 電子装置 |
| JP2000012721A (ja) * | 1998-06-25 | 2000-01-14 | Kyocera Corp | 電子部品収納用容器 |
| JP2000286353A (ja) * | 1999-03-30 | 2000-10-13 | Kyocera Corp | 半導体素子収納用パッケージ |
| JP2002164453A (ja) * | 2000-11-29 | 2002-06-07 | Kyocera Corp | 半導体素子収納用パッケージ |
| JP2005268257A (ja) * | 2004-03-16 | 2005-09-29 | Kyocera Corp | 電子部品収納用パッケージおよび電子装置 |
| JP2007227802A (ja) * | 2006-02-24 | 2007-09-06 | Kyocera Corp | 電子部品搭載用部材 |
| JP2010008172A (ja) * | 2008-06-25 | 2010-01-14 | Panasonic Electric Works Co Ltd | 半導体装置 |
| JP2011139024A (ja) * | 2009-12-04 | 2011-07-14 | Seiko Epson Corp | パッケージ、および、それを用いた振動デバイス |
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2012
- 2012-01-05 JP JP2012000500A patent/JP2013140874A/ja not_active Withdrawn