JP2013115083A5 - - Google Patents

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Publication number
JP2013115083A5
JP2013115083A5 JP2011257128A JP2011257128A JP2013115083A5 JP 2013115083 A5 JP2013115083 A5 JP 2013115083A5 JP 2011257128 A JP2011257128 A JP 2011257128A JP 2011257128 A JP2011257128 A JP 2011257128A JP 2013115083 A5 JP2013115083 A5 JP 2013115083A5
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JP
Japan
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heat
semiconductor element
conductive material
substrate
radiator
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Ceased
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JP2011257128A
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English (en)
Japanese (ja)
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JP2013115083A (ja
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Priority to JP2011257128A priority Critical patent/JP2013115083A/ja
Priority claimed from JP2011257128A external-priority patent/JP2013115083A/ja
Priority to US13/668,623 priority patent/US20130134574A1/en
Priority to CN2012104688562A priority patent/CN103137574A/zh
Publication of JP2013115083A publication Critical patent/JP2013115083A/ja
Publication of JP2013115083A5 publication Critical patent/JP2013115083A5/ja
Ceased legal-status Critical Current

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JP2011257128A 2011-11-25 2011-11-25 半導体装置及びその製造方法 Ceased JP2013115083A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011257128A JP2013115083A (ja) 2011-11-25 2011-11-25 半導体装置及びその製造方法
US13/668,623 US20130134574A1 (en) 2011-11-25 2012-11-05 Semiconductor device and method for fabricating the same
CN2012104688562A CN103137574A (zh) 2011-11-25 2012-11-19 半导体器件及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011257128A JP2013115083A (ja) 2011-11-25 2011-11-25 半導体装置及びその製造方法

Publications (2)

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JP2013115083A JP2013115083A (ja) 2013-06-10
JP2013115083A5 true JP2013115083A5 (enExample) 2014-09-18

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JP2011257128A Ceased JP2013115083A (ja) 2011-11-25 2011-11-25 半導体装置及びその製造方法

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US (1) US20130134574A1 (enExample)
JP (1) JP2013115083A (enExample)
CN (1) CN103137574A (enExample)

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