JP2013110274A - 半導体集積素子 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 347
- 239000012792 core layer Substances 0.000 claims abstract description 74
- 210000001503 joint Anatomy 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims description 53
- 150000001875 compounds Chemical class 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 27
- 230000003287 optical effect Effects 0.000 claims description 25
- 239000010410 layer Substances 0.000 abstract description 162
- 230000002159 abnormal effect Effects 0.000 abstract description 7
- 230000006866 deterioration Effects 0.000 abstract description 5
- 230000008569 process Effects 0.000 description 21
- 238000004519 manufacturing process Methods 0.000 description 19
- 238000005253 cladding Methods 0.000 description 18
- 238000005530 etching Methods 0.000 description 12
- 230000004888 barrier function Effects 0.000 description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 6
- 230000007423 decrease Effects 0.000 description 6
- 239000002019 doping agent Substances 0.000 description 6
- 238000002161 passivation Methods 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 125000006850 spacer group Chemical group 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000001459 lithography Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 229910000042 hydrogen bromide Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 238000000927 vapour-phase epitaxy Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
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- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0265—Intensity modulators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/12097—Ridge, rib or the like
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12004—Combinations of two or more optical elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
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- H01S5/00—Semiconductor lasers
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- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34306—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength longer than 1000nm, e.g. InP based 1300 and 1500nm lasers
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Abstract
【解決手段】
半導体集積素子1は、半導体レーザ素子部2と半導体光変調素子部4とを備えている。半導体レーザ素子部2の第1の導波路22としてリッジ導波路を採用すると共に、半導体光変調素子部4の第3の導波路42としてハイメサ導波路を採用しているので、各素子部2,4の特性を確保できる。半導体集積素子1は、半導体レーザ素子部2と半導体光変調素子部4との間に半導体導波部3をさらに備えている。半導体導波部3のコア層304は、半導体レーザ素子部2の活性層204と一体に形成されており、半導体光変調素子部4のコア層404がバットジョイント接合されている。このため、その接合部の異常成長部P1に電流が流入することに起因して信頼性が低下することを抑制できる。
【選択図】図3
Description
Claims (4)
- 所定の方向に順に配列された第1の部分、第2の部分及び第3の部分を有する基板と、
前記第1の部分の上に設けられ、第1の導波路を有する発光素子部と、
前記第2の部分の上に設けられ、第2の導波路を有する導波部と、
前記第3の部分の上に設けられ、第3の導波路を有する光変調素子部と、
を備え、
前記第1の導波路は、III−V族化合物半導体からなり光を発生するための第1のコア層を含む基部と、前記基部の上に設けられ前記所定の方向に延びるリッジ部とを有し、
前記第2の導波路は、III−V族化合物半導体からなる第2のコア層を含み前記所定の方向に延びる第1のストライプメサを有し、
前記第3の導波路は、III−V族化合物半導体からなり光を変調するための第3のコア層を含み前記所定の方向に延びる第2のストライプメサを有し、
前記基板の前記第1の部分は、前記所定の方向に交差する方向に順に配列された第1の領域、第2の領域、及び第3の領域を含み、
前記基部及び前記第1のコア層は、前記第1の領域、前記第2の領域、及び前記第3の領域の上に設けられ、
前記リッジ部は、前記第2の領域、及び前記基部の上に設けられ、
前記第1のストライプメサの一端は、前記基部及び前記リッジ部に接続され、
前記第1のストライプメサの他端は、前記第2のストライプメサに接続され、
前記第2のコア層は、前記第1のコア層と一体に形成されており、
前記第3のコア層は、バットジョイント法により前記第2のコア層に接合されている、
ことを特徴とする半導体集積素子。 - 前記第3のコア層は、Alを含むIII−V族化合物半導体からなる、ことを特徴とする請求項1に記載の半導体集積素子。
- 前記リッジ部の幅は、前記所定の方向に沿って第1の幅で略一定であり、
前記第2のストライプメサの幅は、前記第1の幅よりも狭い第2の幅で前記所定の方向に沿って略一定であり、
前記第1のストライプメサは、前記一端を含む第1のメサ領域と、前記他端を含む第2のメサ領域とからなり、
前記第1のメサ領域の幅は、前記所定の方向に沿って前記第1の幅から前記第2の幅まで狭まっており、
前記第2のメサ領域の幅は、前記所定の方向に沿って前記第2の幅で略一定である、ことを特徴とする請求項1又は2に記載の半導体集積素子。 - 前記リッジ部は、第1のリッジ領域と、前記第1のリッジ領域から前記第1のストライプメサの前記一端まで延在する第2のリッジ領域とからなり、
前記第1のリッジ領域の幅は、前記所定の方向に沿って第1の幅で略一定であり、
前記第2のリッジ領域の幅は、前記第1の幅から第2の幅まで前記所定の方向に沿って狭まっており、
前記第1のストライプメサは、前記一端を含む第1のメサ領域と、前記他端を含む第2のメサ領域とからなり、
前記第1のメサ領域の幅は、前記第2の幅から第3の幅まで前記所定の方向に沿って狭まっており、
前記第2のメサ領域の幅は、前記所定の方向に沿って前記第3の幅で略一定であり、
前記第2のストライプメサの幅は、前記所定の方向に沿って前記第3の幅で略一定である、ことを特徴とする請求項1又は2に記載の半導体集積素子。
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JP2011254141A JP5957856B2 (ja) | 2011-11-21 | 2011-11-21 | 半導体集積素子 |
US13/680,437 US9235002B2 (en) | 2011-11-21 | 2012-11-19 | Integrated semiconductor device |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018079112A1 (ja) * | 2016-10-27 | 2018-05-03 | 三菱電機株式会社 | 半導体光導波路及び光集積素子 |
JP2022516453A (ja) * | 2018-12-28 | 2022-02-28 | 南京郵電大学 | ホモ集積の赤外線フォトニックチップ及びその製造方法 |
Families Citing this family (1)
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GB2555398B (en) * | 2016-10-24 | 2020-04-08 | Toshiba Kk | An optoelectronic system and method for its fabrication |
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JPH09293927A (ja) * | 1996-04-26 | 1997-11-11 | Nippon Telegr & Teleph Corp <Ntt> | 光集積形半導体レーザ |
JP2002374035A (ja) * | 2000-06-08 | 2002-12-26 | Nichia Chem Ind Ltd | 半導体レーザ素子及びその製造方法 |
JP2008066703A (ja) * | 2006-08-10 | 2008-03-21 | Mitsubishi Electric Corp | 光導波路、半導体光集積素子及びその製造方法 |
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JPH07263655A (ja) | 1994-03-18 | 1995-10-13 | Fujitsu Ltd | 光集積回路およびその製造方法 |
JP2842292B2 (ja) * | 1994-09-16 | 1998-12-24 | 日本電気株式会社 | 半導体光集積装置および製造方法 |
KR20020077567A (ko) * | 2001-04-02 | 2002-10-12 | 한국전자통신연구원 | 광모드 크기 변환기가 결합된 레이저 및 그 제조 방법 |
EP1610426B1 (en) * | 2003-03-31 | 2014-01-08 | Nippon Telegraph And Telephone Corporation | Optical semiconductor device and optical semiconductor integrated circuit |
JP2005286192A (ja) * | 2004-03-30 | 2005-10-13 | Sumitomo Electric Ind Ltd | 光集積素子 |
JP4080503B2 (ja) | 2005-10-03 | 2008-04-23 | 中部日本マルコ株式会社 | 非接触コネクタ |
JP2008053501A (ja) * | 2006-08-25 | 2008-03-06 | Opnext Japan Inc | 集積光デバイスおよびその製造方法 |
JP2008198944A (ja) * | 2007-02-15 | 2008-08-28 | Fujitsu Ltd | 半導体光集積素子 |
JP5047704B2 (ja) * | 2007-06-20 | 2012-10-10 | 日本オクラロ株式会社 | 光集積素子 |
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- 2011-11-21 JP JP2011254141A patent/JP5957856B2/ja active Active
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- 2012-11-19 US US13/680,437 patent/US9235002B2/en active Active
Patent Citations (4)
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JPH09293927A (ja) * | 1996-04-26 | 1997-11-11 | Nippon Telegr & Teleph Corp <Ntt> | 光集積形半導体レーザ |
JP2002374035A (ja) * | 2000-06-08 | 2002-12-26 | Nichia Chem Ind Ltd | 半導体レーザ素子及びその製造方法 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018079112A1 (ja) * | 2016-10-27 | 2018-05-03 | 三菱電機株式会社 | 半導体光導波路及び光集積素子 |
JP6324645B1 (ja) * | 2016-10-27 | 2018-05-16 | 三菱電機株式会社 | 半導体光導波路及び光集積素子 |
CN109891283A (zh) * | 2016-10-27 | 2019-06-14 | 三菱电机株式会社 | 半导体光波导以及光集成元件 |
US10985532B2 (en) | 2016-10-27 | 2021-04-20 | Mitsubishi Electric Corporation | Semiconductor optical waveguide and optical integrated element |
CN109891283B (zh) * | 2016-10-27 | 2021-08-17 | 三菱电机株式会社 | 半导体光波导以及光集成元件 |
JP2022516453A (ja) * | 2018-12-28 | 2022-02-28 | 南京郵電大学 | ホモ集積の赤外線フォトニックチップ及びその製造方法 |
JP7182814B2 (ja) | 2018-12-28 | 2022-12-05 | 南京郵電大学 | ホモ集積の赤外線フォトニックチップ及びその製造方法 |
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