JP2013102041A5 - - Google Patents
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- Publication number
- JP2013102041A5 JP2013102041A5 JP2011244539A JP2011244539A JP2013102041A5 JP 2013102041 A5 JP2013102041 A5 JP 2013102041A5 JP 2011244539 A JP2011244539 A JP 2011244539A JP 2011244539 A JP2011244539 A JP 2011244539A JP 2013102041 A5 JP2013102041 A5 JP 2013102041A5
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- temperature control
- plasma
- set temperature
- unloading
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011244539A JP5933222B2 (ja) | 2011-11-08 | 2011-11-08 | 温度制御方法、制御装置及びプラズマ処理装置 |
| KR1020147012222A KR102015679B1 (ko) | 2011-11-08 | 2012-10-30 | 온도 제어 방법, 제어 장치 및 플라즈마 처리 장치 |
| US14/354,649 US10254774B2 (en) | 2011-11-08 | 2012-10-30 | Temperature control method, control apparatus, and plasma processing apparatus |
| PCT/JP2012/078077 WO2013069510A1 (ja) | 2011-11-08 | 2012-10-30 | 温度制御方法、制御装置及びプラズマ処理装置 |
| TW101140597A TWI557797B (zh) | 2011-11-08 | 2012-11-01 | 溫度控制方法、控制裝置及電漿處理裝置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011244539A JP5933222B2 (ja) | 2011-11-08 | 2011-11-08 | 温度制御方法、制御装置及びプラズマ処理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013102041A JP2013102041A (ja) | 2013-05-23 |
| JP2013102041A5 true JP2013102041A5 (enExample) | 2014-12-25 |
| JP5933222B2 JP5933222B2 (ja) | 2016-06-08 |
Family
ID=48289888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011244539A Active JP5933222B2 (ja) | 2011-11-08 | 2011-11-08 | 温度制御方法、制御装置及びプラズマ処理装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10254774B2 (enExample) |
| JP (1) | JP5933222B2 (enExample) |
| KR (1) | KR102015679B1 (enExample) |
| TW (1) | TWI557797B (enExample) |
| WO (1) | WO2013069510A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6159172B2 (ja) * | 2013-06-26 | 2017-07-05 | 東京エレクトロン株式会社 | 温度制御方法及びプラズマ処理装置 |
| JP6287018B2 (ja) * | 2013-10-04 | 2018-03-07 | 富士通株式会社 | 可視化方法、表示方法、情報処理装置、可視化プログラム及び表示プログラム |
| WO2020031224A1 (ja) * | 2018-08-06 | 2020-02-13 | 株式会社日立ハイテクノロジーズ | プラズマ処理方法およびプラズマアッシング装置 |
| JP2021042409A (ja) * | 2019-09-09 | 2021-03-18 | 東京エレクトロン株式会社 | プラズマ処理装置及び温度制御方法 |
| JP7394668B2 (ja) * | 2020-03-13 | 2023-12-08 | 東京エレクトロン株式会社 | 温度制御方法およびプラズマ処理装置 |
| WO2021255812A1 (ja) | 2020-06-16 | 2021-12-23 | 株式会社日立ハイテク | プラズマ処理装置およびプラズマ処理方法 |
| JP7561575B2 (ja) * | 2020-11-02 | 2024-10-04 | 東京エレクトロン株式会社 | レシピ更新方法 |
| US20250027202A1 (en) * | 2023-07-21 | 2025-01-23 | Applied Materials, Inc. | Methods of adjusting uniformity, and related apparatus and systems, for semiconductor manufacturing |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5089441A (en) * | 1990-04-16 | 1992-02-18 | Texas Instruments Incorporated | Low-temperature in-situ dry cleaning process for semiconductor wafers |
| JPH08158071A (ja) * | 1994-12-05 | 1996-06-18 | Sumitomo Metal Ind Ltd | プラズマプロセス装置 |
| JPH08288230A (ja) * | 1995-04-18 | 1996-11-01 | Kokusai Electric Co Ltd | 電気炉の加熱制御装置 |
| US5589041A (en) * | 1995-06-07 | 1996-12-31 | Sony Corporation | Plasma sputter etching system with reduced particle contamination |
| JPH09260474A (ja) * | 1996-03-22 | 1997-10-03 | Sony Corp | 静電チャックおよびウエハステージ |
| JP3245369B2 (ja) * | 1996-11-20 | 2002-01-15 | 東京エレクトロン株式会社 | 被処理体を静電チャックから離脱する方法及びプラズマ処理装置 |
| JP3577951B2 (ja) * | 1998-05-29 | 2004-10-20 | 株式会社日立製作所 | 枚葉式真空処理方法及び装置 |
| JP2000021964A (ja) * | 1998-07-06 | 2000-01-21 | Ngk Insulators Ltd | 静電チャックのパーティクル発生低減方法および半導体製造装置 |
| US7139083B2 (en) * | 2000-09-20 | 2006-11-21 | Kla-Tencor Technologies Corp. | Methods and systems for determining a composition and a thickness of a specimen |
| US6921724B2 (en) * | 2002-04-02 | 2005-07-26 | Lam Research Corporation | Variable temperature processes for tunable electrostatic chuck |
| KR100770128B1 (ko) * | 2005-07-26 | 2007-10-24 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
| US7723648B2 (en) | 2006-09-25 | 2010-05-25 | Tokyo Electron Limited | Temperature controlled substrate holder with non-uniform insulation layer for a substrate processing system |
| US7960297B1 (en) * | 2006-12-07 | 2011-06-14 | Novellus Systems, Inc. | Load lock design for rapid wafer heating |
| US20080237184A1 (en) | 2007-03-30 | 2008-10-02 | Mamoru Yakushiji | Method and apparatus for plasma processing |
| US8194384B2 (en) * | 2008-07-23 | 2012-06-05 | Tokyo Electron Limited | High temperature electrostatic chuck and method of using |
| JP4611409B2 (ja) * | 2008-09-03 | 2011-01-12 | 晃俊 沖野 | プラズマ温度制御装置 |
| JP6219251B2 (ja) * | 2014-09-17 | 2017-10-25 | 東芝メモリ株式会社 | 半導体製造装置 |
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2011
- 2011-11-08 JP JP2011244539A patent/JP5933222B2/ja active Active
-
2012
- 2012-10-30 KR KR1020147012222A patent/KR102015679B1/ko active Active
- 2012-10-30 WO PCT/JP2012/078077 patent/WO2013069510A1/ja not_active Ceased
- 2012-10-30 US US14/354,649 patent/US10254774B2/en active Active
- 2012-11-01 TW TW101140597A patent/TWI557797B/zh active