JP2012531036A5 - - Google Patents
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- JP2012531036A5 JP2012531036A5 JP2012516070A JP2012516070A JP2012531036A5 JP 2012531036 A5 JP2012531036 A5 JP 2012531036A5 JP 2012516070 A JP2012516070 A JP 2012516070A JP 2012516070 A JP2012516070 A JP 2012516070A JP 2012531036 A5 JP2012531036 A5 JP 2012531036A5
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- green body
- ceramic powder
- slip
- item
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims description 74
- 239000000919 ceramic Substances 0.000 claims description 53
- 239000000843 powder Substances 0.000 claims description 26
- 239000000203 mixture Substances 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 12
- 238000005245 sintering Methods 0.000 claims description 12
- 239000002131 composite material Substances 0.000 claims description 11
- 239000011230 binding agent Substances 0.000 claims description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 8
- 229910052451 lead zirconate titanate Inorganic materials 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 8
- 238000000227 grinding Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 229920005596 polymer binder Polymers 0.000 claims description 5
- 239000002491 polymer binding agent Substances 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 4
- KLJXHCVMGMBXOQ-UHFFFAOYSA-N [Nb].[Sc] Chemical compound [Nb].[Sc] KLJXHCVMGMBXOQ-UHFFFAOYSA-N 0.000 claims description 4
- 229910002113 barium titanate Inorganic materials 0.000 claims description 4
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 4
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 claims description 4
- 239000002270 dispersing agent Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical group [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims description 4
- 229910052758 niobium Inorganic materials 0.000 claims description 4
- 239000010955 niobium Substances 0.000 claims description 4
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000002861 polymer material Substances 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- 239000004094 surface-active agent Substances 0.000 claims description 4
- 238000003754 machining Methods 0.000 claims description 2
- 238000007373 indentation Methods 0.000 claims 1
- 238000002156 mixing Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US21869009P | 2009-06-19 | 2009-06-19 | |
| US61/218,690 | 2009-06-19 | ||
| PCT/US2010/001778 WO2010147675A1 (en) | 2009-06-19 | 2010-06-21 | Method for manufacturing a piezoelectric ceramic body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012531036A JP2012531036A (ja) | 2012-12-06 |
| JP2012531036A5 true JP2012531036A5 (enExample) | 2013-08-08 |
Family
ID=43356673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012516070A Pending JP2012531036A (ja) | 2009-06-19 | 2010-06-21 | 圧電性セラミック本体を製造する方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US8703040B2 (enExample) |
| EP (1) | EP2443679A4 (enExample) |
| JP (1) | JP2012531036A (enExample) |
| KR (1) | KR20120046177A (enExample) |
| CN (1) | CN102484200B (enExample) |
| CA (1) | CA2765941A1 (enExample) |
| WO (1) | WO2010147675A1 (enExample) |
Families Citing this family (64)
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| US9421018B2 (en) * | 2011-11-21 | 2016-08-23 | Smith & Nephew, Inc. | Methods of designing molds for machining cost reduction |
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| US20130342488A1 (en) * | 2012-06-26 | 2013-12-26 | Kent Displays Incorporated | Cholesteric liquid crystal writing tablet erased by a piezoelectric transducer |
| US9618405B2 (en) | 2014-08-06 | 2017-04-11 | Invensense, Inc. | Piezoelectric acoustic resonator based sensor |
| US9511994B2 (en) | 2012-11-28 | 2016-12-06 | Invensense, Inc. | Aluminum nitride (AlN) devices with infrared absorption structural layer |
| US10726231B2 (en) | 2012-11-28 | 2020-07-28 | Invensense, Inc. | Integrated piezoelectric microelectromechanical ultrasound transducer (PMUT) on integrated circuit (IC) for fingerprint sensing |
| US9114977B2 (en) | 2012-11-28 | 2015-08-25 | Invensense, Inc. | MEMS device and process for RF and low resistance applications |
| US10497747B2 (en) | 2012-11-28 | 2019-12-03 | Invensense, Inc. | Integrated piezoelectric microelectromechanical ultrasound transducer (PMUT) on integrated circuit (IC) for fingerprint sensing |
| CN103779272B (zh) * | 2013-01-11 | 2017-06-20 | 北京纳米能源与系统研究所 | 晶体管阵列及其制备方法 |
| CN205115306U (zh) | 2014-09-30 | 2016-03-30 | 苹果公司 | 陶瓷部件 |
| US10071539B2 (en) | 2014-09-30 | 2018-09-11 | Apple Inc. | Co-sintered ceramic for electronic devices |
| KR101630606B1 (ko) * | 2014-11-07 | 2016-06-15 | 포항공과대학교 산학협력단 | 전극 삽입형 분말사출성형을 이용한 적층형 압전소자 제조방법 및 그에 의해 제조된 적층형 압전 소자 |
| US10207387B2 (en) | 2015-03-06 | 2019-02-19 | Apple Inc. | Co-finishing surfaces |
| US20170019731A1 (en) * | 2015-07-14 | 2017-01-19 | Lockheed Martin Corporation | Monolithic ceramic transducers with embedded electrodes |
| US9928398B2 (en) | 2015-08-17 | 2018-03-27 | Invensense, Inc. | Always-on sensor device for human touch |
| US10216233B2 (en) | 2015-09-02 | 2019-02-26 | Apple Inc. | Forming features in a ceramic component for an electronic device |
| US10422772B1 (en) | 2015-10-20 | 2019-09-24 | Sonavation, Inc. | Acoustic sensing through a barrier |
| US10445547B2 (en) | 2016-05-04 | 2019-10-15 | Invensense, Inc. | Device mountable packaging of ultrasonic transducers |
| US10670716B2 (en) | 2016-05-04 | 2020-06-02 | Invensense, Inc. | Operating a two-dimensional array of ultrasonic transducers |
| US10325915B2 (en) | 2016-05-04 | 2019-06-18 | Invensense, Inc. | Two-dimensional array of CMOS control elements |
| US10656255B2 (en) | 2016-05-04 | 2020-05-19 | Invensense, Inc. | Piezoelectric micromachined ultrasonic transducer (PMUT) |
| US10315222B2 (en) | 2016-05-04 | 2019-06-11 | Invensense, Inc. | Two-dimensional array of CMOS control elements |
| US10600403B2 (en) | 2016-05-10 | 2020-03-24 | Invensense, Inc. | Transmit operation of an ultrasonic sensor |
| US10706835B2 (en) | 2016-05-10 | 2020-07-07 | Invensense, Inc. | Transmit beamforming of a two-dimensional array of ultrasonic transducers |
| US10562070B2 (en) | 2016-05-10 | 2020-02-18 | Invensense, Inc. | Receive operation of an ultrasonic sensor |
| US10632500B2 (en) | 2016-05-10 | 2020-04-28 | Invensense, Inc. | Ultrasonic transducer with a non-uniform membrane |
| US10441975B2 (en) | 2016-05-10 | 2019-10-15 | Invensense, Inc. | Supplemental sensor modes and systems for ultrasonic transducers |
| US11673165B2 (en) | 2016-05-10 | 2023-06-13 | Invensense, Inc. | Ultrasonic transducer operable in a surface acoustic wave (SAW) mode |
| US10452887B2 (en) | 2016-05-10 | 2019-10-22 | Invensense, Inc. | Operating a fingerprint sensor comprised of ultrasonic transducers |
| US10539539B2 (en) | 2016-05-10 | 2020-01-21 | Invensense, Inc. | Operation of an ultrasonic sensor |
| US10408797B2 (en) | 2016-05-10 | 2019-09-10 | Invensense, Inc. | Sensing device with a temperature sensor |
| KR101850127B1 (ko) * | 2017-03-16 | 2018-04-19 | 주식회사 베프스 | 초음파 지문 센서 제조 방법 |
| US10891461B2 (en) | 2017-05-22 | 2021-01-12 | Invensense, Inc. | Live fingerprint detection utilizing an integrated ultrasound and infrared sensor |
| US10474862B2 (en) | 2017-06-01 | 2019-11-12 | Invensense, Inc. | Image generation in an electronic device using ultrasonic transducers |
| US10643052B2 (en) | 2017-06-28 | 2020-05-05 | Invensense, Inc. | Image generation in an electronic device using ultrasonic transducers |
| CN111065613B (zh) * | 2017-06-30 | 2022-06-21 | 奥卢大学 | 陶瓷复合材料 |
| US10542628B2 (en) | 2017-08-02 | 2020-01-21 | Apple Inc. | Enclosure for an electronic device having a shell and internal chassis |
| WO2019027268A1 (ko) * | 2017-08-04 | 2019-02-07 | ㈜포인트엔지니어링 | 압전 소재 기둥 및 그 제조방법 |
| US10997388B2 (en) | 2017-12-01 | 2021-05-04 | Invensense, Inc. | Darkfield contamination detection |
| US10984209B2 (en) | 2017-12-01 | 2021-04-20 | Invensense, Inc. | Darkfield modeling |
| US10936841B2 (en) | 2017-12-01 | 2021-03-02 | Invensense, Inc. | Darkfield tracking |
| US11151355B2 (en) | 2018-01-24 | 2021-10-19 | Invensense, Inc. | Generation of an estimated fingerprint |
| US10755067B2 (en) | 2018-03-22 | 2020-08-25 | Invensense, Inc. | Operating a fingerprint sensor comprised of ultrasonic transducers |
| CN109648687B (zh) * | 2018-12-24 | 2020-09-01 | 西安文理学院 | 一种复合生物压电陶瓷成型装置及其成型方法 |
| US10936843B2 (en) | 2018-12-28 | 2021-03-02 | Invensense, Inc. | Segmented image acquisition |
| CN109721371A (zh) * | 2019-02-18 | 2019-05-07 | 武汉理工大学 | 一种压电陶瓷阵列的制备方法 |
| US11188735B2 (en) | 2019-06-24 | 2021-11-30 | Invensense, Inc. | Fake finger detection using ridge features |
| CN110265544A (zh) * | 2019-06-24 | 2019-09-20 | 京东方科技集团股份有限公司 | 压电传感器及制备方法、进行指纹识别的方法及电子设备 |
| US11216681B2 (en) | 2019-06-25 | 2022-01-04 | Invensense, Inc. | Fake finger detection based on transient features |
| US11176345B2 (en) | 2019-07-17 | 2021-11-16 | Invensense, Inc. | Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness |
| US11216632B2 (en) | 2019-07-17 | 2022-01-04 | Invensense, Inc. | Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness |
| US11232549B2 (en) | 2019-08-23 | 2022-01-25 | Invensense, Inc. | Adapting a quality threshold for a fingerprint image |
| US11392789B2 (en) | 2019-10-21 | 2022-07-19 | Invensense, Inc. | Fingerprint authentication using a synthetic enrollment image |
| CN115551650A (zh) | 2020-03-09 | 2022-12-30 | 应美盛公司 | 具有非均匀厚度的接触层的超声指纹传感器 |
| US11243300B2 (en) | 2020-03-10 | 2022-02-08 | Invensense, Inc. | Operating a fingerprint sensor comprised of ultrasonic transducers and a presence sensor |
| US11328165B2 (en) | 2020-04-24 | 2022-05-10 | Invensense, Inc. | Pressure-based activation of fingerprint spoof detection |
| US11995909B2 (en) | 2020-07-17 | 2024-05-28 | Tdk Corporation | Multipath reflection correction |
| US12174295B2 (en) | 2020-08-07 | 2024-12-24 | Tdk Corporation | Acoustic multipath correction |
| US12416807B2 (en) | 2021-08-20 | 2025-09-16 | Tdk Corporation | Retinal projection display system |
| US12260050B2 (en) | 2021-08-25 | 2025-03-25 | Tdk Corporation | Differential receive at an ultrasonic transducer |
| CN113707802B (zh) * | 2021-08-27 | 2022-10-21 | 成都汇通西电电子有限公司 | 一种矩阵致动器结构及其制备方法 |
| KR102825062B1 (ko) * | 2021-11-22 | 2025-06-26 | 한국전자통신연구원 | 얽힘 광자쌍 생성 장치 |
| KR102675960B1 (ko) * | 2023-08-01 | 2024-06-17 | 국방과학연구소 | 압전센서 |
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| US5329496A (en) * | 1992-10-16 | 1994-07-12 | Duke University | Two-dimensional array ultrasonic transducers |
| US5340510A (en) * | 1993-04-05 | 1994-08-23 | Materials Systems Incorporated | Method for making piezoelectric ceramic/polymer composite transducers |
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| US5818149A (en) * | 1996-03-25 | 1998-10-06 | Rutgers, The State University Of New Jersey | Ceramic composites and methods for producing same |
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| US6361735B1 (en) * | 1999-09-01 | 2002-03-26 | General Electric Company | Composite ceramic article and method of making |
| JP3997729B2 (ja) * | 2001-06-15 | 2007-10-24 | ブラザー工業株式会社 | 圧電アクチュエータ及びその圧電アクチュエータを用いたインクジェットヘッド並びにそれらの製造方法 |
| US7132057B2 (en) * | 2003-10-15 | 2006-11-07 | Piezotech, Llc | Compositions for high power piezoelectric ceramics |
| US20050156362A1 (en) * | 2003-11-29 | 2005-07-21 | Joe Arnold | Piezoelectric device and method of manufacturing same |
| JP2005286444A (ja) * | 2004-03-29 | 2005-10-13 | Casio Electronics Co Ltd | 超音波トランスデューサ |
| US7494602B2 (en) * | 2005-04-11 | 2009-02-24 | Piezotech, Llc | Compositions for high power piezoelectric ceramics |
| JP4563866B2 (ja) * | 2005-05-17 | 2010-10-13 | 日本特殊陶業株式会社 | セラミック積層体の製造方法 |
| US7622853B2 (en) * | 2005-08-12 | 2009-11-24 | Scimed Life Systems, Inc. | Micromachined imaging transducer |
| CN100537475C (zh) * | 2006-02-27 | 2009-09-09 | 西北工业大学 | 钛酸铋钠—钛酸铋钾无铅压电织构陶瓷及其制备方法 |
| US20100239751A1 (en) * | 2009-03-23 | 2010-09-23 | Sonavation, Inc. | Sea of Pillars |
| US20110003522A1 (en) * | 2009-05-15 | 2011-01-06 | Liang Chen | Bio-based aqueous binder for fiberglass insulation materials and non-woven mats |
| JP5616291B2 (ja) * | 2010-06-11 | 2014-10-29 | ローム アンド ハース カンパニーＲｏｈｍ Ａｎｄ Ｈａａｓ Ｃｏｍｐａｎｙ | ジアルデヒドから製造された５−および６−員環式エナミン化合物からの速硬化性熱硬化性物質 |
-
2010
- 2010-06-21 WO PCT/US2010/001778 patent/WO2010147675A1/en not_active Ceased
- 2010-06-21 CN CN201080032563.9A patent/CN102484200B/zh not_active Expired - Fee Related
- 2010-06-21 KR KR1020127001356A patent/KR20120046177A/ko not_active Withdrawn
- 2010-06-21 EP EP10789879.3A patent/EP2443679A4/en not_active Withdrawn
- 2010-06-21 JP JP2012516070A patent/JP2012531036A/ja active Pending
- 2010-06-21 CA CA2765941A patent/CA2765941A1/en not_active Abandoned
- 2010-06-21 US US12/819,518 patent/US8703040B2/en active Active
-
2014
- 2014-04-21 US US14/257,966 patent/US20140339459A1/en not_active Abandoned
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