KR20120046177A - 압전 세라믹체를 제조하는 방법 - Google Patents

압전 세라믹체를 제조하는 방법 Download PDF

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Publication number
KR20120046177A
KR20120046177A KR1020127001356A KR20127001356A KR20120046177A KR 20120046177 A KR20120046177 A KR 20120046177A KR 1020127001356 A KR1020127001356 A KR 1020127001356A KR 20127001356 A KR20127001356 A KR 20127001356A KR 20120046177 A KR20120046177 A KR 20120046177A
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South Korea
Prior art keywords
ceramic
slip
mold
cutting
green body
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Withdrawn
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KR1020127001356A
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English (en)
Korean (ko)
Inventor
데 리우푸
루이스 레니에르
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소나베이션, 인크.
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Application filed by 소나베이션, 인크. filed Critical 소나베이션, 인크.
Publication of KR20120046177A publication Critical patent/KR20120046177A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H10N30/8536—Alkaline earth metal based oxides, e.g. barium titanates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/084—Shaping or machining of piezoelectric or electrostrictive bodies by moulding or extrusion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/092—Forming composite materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/093—Forming inorganic materials
    • H10N30/097—Forming inorganic materials by sintering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H10N30/8548—Lead-based oxides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H10N30/8548—Lead-based oxides
    • H10N30/8554—Lead-zirconium titanate [PZT] based
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Transducers For Ultrasonic Waves (AREA)
KR1020127001356A 2009-06-19 2010-06-21 압전 세라믹체를 제조하는 방법 Withdrawn KR20120046177A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US21869009P 2009-06-19 2009-06-19
US61/218,690 2009-06-19

Publications (1)

Publication Number Publication Date
KR20120046177A true KR20120046177A (ko) 2012-05-09

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Family Applications (1)

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KR1020127001356A Withdrawn KR20120046177A (ko) 2009-06-19 2010-06-21 압전 세라믹체를 제조하는 방법

Country Status (7)

Country Link
US (2) US8703040B2 (enExample)
EP (1) EP2443679A4 (enExample)
JP (1) JP2012531036A (enExample)
KR (1) KR20120046177A (enExample)
CN (1) CN102484200B (enExample)
CA (1) CA2765941A1 (enExample)
WO (1) WO2010147675A1 (enExample)

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WO2019027268A1 (ko) * 2017-08-04 2019-02-07 ㈜포인트엔지니어링 압전 소재 기둥 및 그 제조방법
KR20230075332A (ko) * 2021-11-22 2023-05-31 한국전자통신연구원 얽힘 광자쌍 생성 장치

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US10891461B2 (en) 2017-05-22 2021-01-12 Invensense, Inc. Live fingerprint detection utilizing an integrated ultrasound and infrared sensor
US10474862B2 (en) 2017-06-01 2019-11-12 Invensense, Inc. Image generation in an electronic device using ultrasonic transducers
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Publication number Priority date Publication date Assignee Title
KR20160054782A (ko) * 2014-11-07 2016-05-17 포항공과대학교 산학협력단 전극 삽입형 분말사출성형을 이용한 적층형 압전소자 제조방법 및 그에 의해 제조된 적층형 압전 소자
WO2019027268A1 (ko) * 2017-08-04 2019-02-07 ㈜포인트엔지니어링 압전 소재 기둥 및 그 제조방법
KR20230075332A (ko) * 2021-11-22 2023-05-31 한국전자통신연구원 얽힘 광자쌍 생성 장치

Also Published As

Publication number Publication date
EP2443679A4 (en) 2013-10-09
JP2012531036A (ja) 2012-12-06
US8703040B2 (en) 2014-04-22
CA2765941A1 (en) 2010-12-23
EP2443679A1 (en) 2012-04-25
CN102484200A (zh) 2012-05-30
US20140339459A1 (en) 2014-11-20
WO2010147675A1 (en) 2010-12-23
US20110010904A1 (en) 2011-01-20
CN102484200B (zh) 2015-11-25

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Patent event date: 20120117

Patent event code: PA01051R01D

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WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid