JP2012523683A - 冷却配置を有するディテクタモジュール、および該ディテクタモジュールを含むリソグラフィ装置 - Google Patents
冷却配置を有するディテクタモジュール、および該ディテクタモジュールを含むリソグラフィ装置 Download PDFInfo
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
- G03F7/706—Aberration measurement
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
Abstract
【選択図】 図5
Description
本願は、2009年4月13日に出願された米国仮出願第61/168,712号の優先権を主張し、その全体を、参照することにより本明細書に組み込むものとする。
Claims (16)
- 光子放射を感知するための少なくとも1つのディテクタ(30)と、
前記少なくとも1つのディテクタ(30)に結合された電子回路(40)と、
底部(62、72)と、前記底部(62、72)から延在する少なくとも部分的に円筒形の部分(64、74)とをそれぞれ有する第1および第2の本体(60、70)を有するハウジング(50)と、
を含み、
前記第1の本体(60)の前記少なくとも部分的に円筒形の部分(64)は、前記第2の本体(70)の前記少なくとも部分的に円筒形の部分(74)に熱的に結合し、
前記第1の本体(60)の前記少なくとも部分的に円筒形の部分(64)は、前記第2の本体(70)の前記底部(72)に向かって延在し、
前記電子回路(40)は、前記ハウジング(50)内に配置される、ディテクタモジュール(20;21;22)。 - 前記第1の本体(60)の前記少なくとも部分的に円筒形の部分(64)は、前記第1の本体(60)の前記少なくとも部分的に円筒形の部分(64)の外表面(65)と前記第2の本体(70)の前記少なくとも部分的に円筒形の部分(74)の内表面(75)との間に配置された接着層(52)によって、前記第2の本体(70)の前記少なくとも部分的に円筒形の部分(74)に熱的に結合される、請求項1に記載のディテクタモジュール(22)。
- 前記第1の本体(60)の前記少なくとも部分的に円筒形の部分(64)は、前記第1の本体(60)の前記円筒形の部分(64)が前記第2の本体(70)の前記少なくとも部分的に円筒形の部分(74)内に固定されることにより、前記第2の本体(70)の前記少なくとも部分的に円筒形の部分(74)に熱的に結合される、請求項1に記載のディテクタモジュール(21)。
- 前記ハウジング(50)はセラミック材料を含む、請求項1に記載のディテクタモジュール(20;21;22)。
- 前記セラミック材料はSiCを含む、請求項4に記載のディテクタモジュール(20;21;22)。
- 前記本体のうちの一方(70)の前記底部(72)の外表面(73)が、基板(80)上に形成された格子(82)を担持し、前記格子(82)は、前記底部(72)における開口部(76)の上方に配置され、前記ディテクタ(30)は、前記格子(82)の反対側で前記ハウジング(50)内に配置される、請求項1に記載のディテクタモジュール(20)。
- 前記本体のうちの1つ(70)の前記底部(72)の外表面(73)が、前記ディテクタ(30)を担持する、請求項1に記載のディテクタモジュール(21;22)。
- 前記第1の本体(60)および前記第2の本体(70)のうちの一方の前記底部(62)は、ヒートシンク(110)の反対側に配置される、請求項1に記載のディテクタモジュール(30)。
- 第1の熱接触面(112)を有するヒートシンク(110)と、
第2の熱接触面(63)を有する、請求項8に記載のディテクタモジュール(20)と、
弾性壁(120)と、
を含む冷却配置であって、
前記第1の熱接触面(112)および前記第2の熱接触面(63)は互いに面して、間隙(140)を画定し、
前記弾性壁(120)は、前記間隙(140)を少なくとも含む空間を囲む囲いの一部であり、
前記冷却配置は、前記空間と前記冷却配置の環境との間に圧力差を維持する機構を含む、冷却配置。 - 前記囲まれた空間内にガスを与える機構を含む、請求項9に記載の冷却配置。
- 前記弾性壁(120)はベローズである、請求項10に記載の冷却配置。
- 前記弾性壁(120)は、前記ヒートシンク(110)を囲む、請求項9に記載の冷却配置。
- 前記弾性壁(120)は、前記オブジェクトおよび前記ヒートシンク(110)のうち少なくとも一方に取り付けられた第1の端部(122)と、前記弾性壁内(120)の張力によって、前記オブジェクト(20)および前記ヒートシンクのうちのもう一方に押し付けられる封止リング(130)が設けられた第2の端部(124)とを有する、請求項9に記載の冷却配置。
- 前記封止リング(130)には開口部(132)が設けられている、請求項13に記載の冷却配置。
- EUV放射源と、
真空チャンバと、を含み、
前記真空チャンバ内には、
前記放射源からの電磁放射をオブジェクト面に誘導して前記オブジェクト面を照明するように構成された結像システム(M4、M3)と、
前記オブジェクト面内に位置決めされた第1の格子(13;13a;13b)と、
前記第1の格子の像を焦点面上に投影するように構成された投影光学システム(M1、M6;PO)と、
前記投影像を受けるように構成された、請求項1に記載のディテクタモジュール(20)と、
が配置される、リソグラフィシステム。 - 前記ディテクタモジュール(20)の前記第1の本体(60)の前記底部(62)は、前記投影光学システム(M1、M6;PO)に面する、請求項15に記載のリソグラフィシステム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16871209P | 2009-04-13 | 2009-04-13 | |
US61/168,712 | 2009-04-13 | ||
PCT/EP2010/051901 WO2010118902A1 (en) | 2009-04-13 | 2010-02-16 | Detector module with a cooling arrangement, and lithographic apparatus comprising said detector module |
Publications (3)
Publication Number | Publication Date |
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JP2012523683A true JP2012523683A (ja) | 2012-10-04 |
JP2012523683A5 JP2012523683A5 (ja) | 2013-04-04 |
JP5732448B2 JP5732448B2 (ja) | 2015-06-10 |
Family
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Application Number | Title | Priority Date | Filing Date |
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JP2012503932A Active JP5732448B2 (ja) | 2009-04-13 | 2010-02-16 | 冷却配置を有するディテクタモジュール、および該ディテクタモジュールを含むリソグラフィ装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9081309B2 (ja) |
JP (1) | JP5732448B2 (ja) |
KR (1) | KR101689209B1 (ja) |
CN (1) | CN102388344B (ja) |
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WO2010118902A1 (en) | 2010-10-21 |
JP5732448B2 (ja) | 2015-06-10 |
US20120075607A1 (en) | 2012-03-29 |
KR101689209B1 (ko) | 2017-01-02 |
TWI421483B (zh) | 2014-01-01 |
NL2004242A (en) | 2010-10-14 |
US9081309B2 (en) | 2015-07-14 |
TW201104233A (en) | 2011-02-01 |
CN102388344B (zh) | 2014-05-14 |
KR20120022945A (ko) | 2012-03-12 |
CN102388344A (zh) | 2012-03-21 |
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