JP2012521704A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2012521704A5 JP2012521704A5 JP2012501381A JP2012501381A JP2012521704A5 JP 2012521704 A5 JP2012521704 A5 JP 2012521704A5 JP 2012501381 A JP2012501381 A JP 2012501381A JP 2012501381 A JP2012501381 A JP 2012501381A JP 2012521704 A5 JP2012521704 A5 JP 2012521704A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cmut array
- cavity
- cmut
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 10
- 238000000034 method Methods 0.000 claims 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 4
- 229910052710 silicon Inorganic materials 0.000 claims 4
- 239000010703 silicon Substances 0.000 claims 4
- 239000004020 conductor Substances 0.000 claims 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 1
- 229920005591 polysilicon Polymers 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0905255A GB0905255D0 (en) | 2009-03-26 | 2009-03-26 | Cmut array |
| GB0905256.4 | 2009-03-26 | ||
| GB0905256A GB0905256D0 (en) | 2009-03-26 | 2009-03-26 | Ultrasound transducer backing layer |
| GB0905255.6 | 2009-03-26 | ||
| GB0909296A GB0909296D0 (en) | 2009-05-28 | 2009-05-28 | Ultrasound transsducer damping layer |
| GB0909296.6 | 2009-05-28 | ||
| PCT/GB2010/000583 WO2010109205A2 (en) | 2009-03-26 | 2010-03-26 | Cmut array |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012521704A JP2012521704A (ja) | 2012-09-13 |
| JP2012521704A5 true JP2012521704A5 (enExample) | 2013-05-16 |
| JP5744002B2 JP5744002B2 (ja) | 2015-07-01 |
Family
ID=42308937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012501381A Expired - Fee Related JP5744002B2 (ja) | 2009-03-26 | 2010-03-26 | Cmutアレイ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20120074509A1 (enExample) |
| EP (4) | EP2411163B1 (enExample) |
| JP (1) | JP5744002B2 (enExample) |
| CN (1) | CN102427890A (enExample) |
| DK (1) | DK2411163T3 (enExample) |
| ES (1) | ES2416182T3 (enExample) |
| WO (1) | WO2010109205A2 (enExample) |
Families Citing this family (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103350064B (zh) * | 2007-04-27 | 2016-12-28 | 株式会社日立制作所 | 静电容量式超声波传感器以及超声波摄像装置 |
| FI124354B (fi) * | 2011-04-04 | 2014-07-15 | Okmetic Oyj | Menetelmä yhden tai useamman polykiteisen piikerroksen pinnoittamiseksi substraatille |
| AU2012326218B2 (en) | 2011-10-17 | 2017-03-09 | Butterfly Network, Inc. | Transmissive imaging and related apparatus and methods |
| US9220415B2 (en) * | 2011-10-25 | 2015-12-29 | Andreas Mandelis | Systems and methods for frequency-domain photoacoustic phased array imaging |
| WO2013089648A1 (en) * | 2011-12-16 | 2013-06-20 | Agency For Science, Technology And Research | Capacitive micromachined ultrasonic transducer arrangement and method of fabricating the same |
| JP2013226389A (ja) * | 2012-03-31 | 2013-11-07 | Canon Inc | 探触子及びその製造方法、及びそれを用いた被検体情報取得装置 |
| BR112014029547A2 (pt) * | 2012-05-31 | 2017-06-27 | Koninklijke Philips Nv | placa sendo subdividida e separavel em uma pluralidade de matrizes, método de fabricação de uma placa e método de fabricação de uma matriz |
| US9012324B2 (en) * | 2012-08-24 | 2015-04-21 | United Microelectronics Corp. | Through silicon via process |
| KR101851569B1 (ko) | 2012-11-28 | 2018-04-24 | 삼성전자주식회사 | 초음파 변환기 및 그 제조방법 |
| CA2898608C (en) * | 2013-01-18 | 2022-01-11 | Yale University | Methods for making a superconducting device with at least one enclosure |
| WO2014163728A2 (en) | 2013-01-18 | 2014-10-09 | Yale University | Superconducting device with at least one enclosure |
| US9499392B2 (en) | 2013-02-05 | 2016-11-22 | Butterfly Network, Inc. | CMOS ultrasonic transducers and related apparatus and methods |
| EP2969914B1 (en) | 2013-03-15 | 2020-01-01 | Butterfly Network Inc. | Complementary metal oxide semiconductor (cmos) ultrasonic transducers and methods for forming the same |
| CA2903479C (en) | 2013-03-15 | 2023-10-10 | Butterfly Network, Inc. | Monolithic ultrasonic imaging devices, systems and methods |
| US9667889B2 (en) | 2013-04-03 | 2017-05-30 | Butterfly Network, Inc. | Portable electronic devices with integrated imaging capabilities |
| WO2015013245A2 (en) | 2013-07-23 | 2015-01-29 | Butterfly Network, Inc. | Interconnectable ultrasound transducer probes and related methods and apparatus |
| JP6678102B2 (ja) | 2013-10-15 | 2020-04-08 | イェール ユニバーシティーYale University | 低雑音ジョセフソン接合系方向性増幅器 |
| KR20150046637A (ko) * | 2013-10-22 | 2015-04-30 | 삼성전자주식회사 | 광음향 이미지와 초음파 이미지를 위한 광대역 초음파 프로브 |
| JP6621745B2 (ja) * | 2013-11-22 | 2019-12-18 | サニーブルック ヘルス サイエンシーズ センター | 空間的にセグメント化された表面を有するバッキングを有する超音波トランスデューサ |
| KR20150065067A (ko) * | 2013-12-04 | 2015-06-12 | 삼성전자주식회사 | 정전용량 미세가공 초음파 변환기 및 그 제조방법 |
| US9948254B2 (en) | 2014-02-21 | 2018-04-17 | Yale University | Wireless Josephson bifurcation amplifier |
| EP3132441B1 (en) * | 2014-04-18 | 2020-11-25 | Butterfly Network, Inc. | Architecture of single substrate ultrasonic imaging devices, related apparatuses |
| WO2015161164A1 (en) | 2014-04-18 | 2015-10-22 | Butterfly Network, Inc. | Ultrasonic imaging compression methods and apparatus |
| KR102237662B1 (ko) | 2014-04-18 | 2021-04-09 | 버터플라이 네트워크, 인크. | 상보적 금속 산화물 반도체(cmos) 웨이퍼들 내의 초음파 트랜스듀서들 및 관련 장치 및 방법들 |
| US9067779B1 (en) | 2014-07-14 | 2015-06-30 | Butterfly Network, Inc. | Microfabricated ultrasonic transducers and related apparatus and methods |
| WO2016106153A1 (en) * | 2014-12-21 | 2016-06-30 | Chirp Microsystems, Inc. | Piezoelectric micromachined ultrasonic transducers with low stress sensitivity and methods of fabrication |
| CN107251250A (zh) | 2015-02-27 | 2017-10-13 | 耶鲁大学 | 制造量子放大器的技术及相关系统和方法 |
| WO2016138406A1 (en) | 2015-02-27 | 2016-09-01 | Yale University | Josephson junction-based circulators and related systems and methods |
| JP6894378B2 (ja) | 2015-02-27 | 2021-06-30 | イェール ユニバーシティーYale University | 平面キュービットを非平面共振器に連結するための技術ならびに関連する系および方法 |
| US10693566B2 (en) | 2015-04-17 | 2020-06-23 | Yale University | Wireless Josephson parametric converter |
| US10427188B2 (en) | 2015-07-30 | 2019-10-01 | North Carolina State University | Anodically bonded vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT) |
| US9987661B2 (en) | 2015-12-02 | 2018-06-05 | Butterfly Network, Inc. | Biasing of capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods |
| JP6883870B2 (ja) | 2016-01-15 | 2021-06-09 | イェール ユニバーシティーYale University | 2キュービット量子状態の操作のための技術ならびに関連のある系および方法 |
| CN106998522B (zh) * | 2016-01-25 | 2023-07-28 | 中国科学院苏州纳米技术与纳米仿生研究所 | 微电容超声传感器 |
| FR3060844B1 (fr) | 2016-12-15 | 2018-12-14 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif microelectronique acoustique |
| US10196261B2 (en) | 2017-03-08 | 2019-02-05 | Butterfly Network, Inc. | Microfabricated ultrasonic transducers and related apparatus and methods |
| TW201908021A (zh) | 2017-06-21 | 2019-03-01 | 美商蝴蝶網路公司 | 具有電性隔離的電極部分的個別單元的微加工超音波換能器 |
| WO2019099013A1 (en) | 2017-11-16 | 2019-05-23 | Chirp Microsystems, Inc. | Piezoelectric micromachined ultrasonic transducer with a patterned membrane structure |
| WO2019118442A1 (en) | 2017-12-11 | 2019-06-20 | Yale University | Superconducting nonlinear asymmetric inductive element and related systems and methods |
| WO2019213388A1 (en) * | 2018-05-03 | 2019-11-07 | Butterfly Network, Inc. | Pressure port for ultrasonic transducer on cmos sensor |
| US11223355B2 (en) | 2018-12-12 | 2022-01-11 | Yale University | Inductively-shunted transmon qubit for superconducting circuits |
| CA3125986A1 (en) | 2019-01-17 | 2020-07-23 | Yale University | Josephson nonlinear circuit |
| EP3708263B1 (en) | 2019-03-14 | 2023-08-30 | IMEC vzw | Flexible ultrasound array |
| EP3909692A1 (en) * | 2020-05-14 | 2021-11-17 | Koninklijke Philips N.V. | An ultrasound transducer and a tiled array of ultrasound transducers |
| FR3114255B1 (fr) * | 2020-09-18 | 2023-05-05 | Moduleus | Transducteur CMUT |
| WO2022272217A1 (en) * | 2021-06-23 | 2022-12-29 | Boston Scientific Scimed, Inc. | Ultrasound transducer |
| FR3135858B1 (fr) * | 2022-05-23 | 2025-04-18 | Vermon | Transducteur CMUT et procédé de fabrication d’un transducteur CMUT |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01312485A (ja) * | 1988-06-13 | 1989-12-18 | Agency Of Ind Science & Technol | 静電容量型超音波トランスデューサ |
| US5267221A (en) * | 1992-02-13 | 1993-11-30 | Hewlett-Packard Company | Backing for acoustic transducer array |
| JP3512500B2 (ja) * | 1994-12-26 | 2004-03-29 | 株式会社東芝 | 超音波トランスジューサとその製造方法 |
| US5648941A (en) * | 1995-09-29 | 1997-07-15 | Hewlett-Packard Company | Transducer backing material |
| US6266857B1 (en) * | 1998-02-17 | 2001-07-31 | Microsound Systems, Inc. | Method of producing a backing structure for an ultrasound transceiver |
| US6430109B1 (en) * | 1999-09-30 | 2002-08-06 | The Board Of Trustees Of The Leland Stanford Junior University | Array of capacitive micromachined ultrasonic transducer elements with through wafer via connections |
| US6467138B1 (en) * | 2000-05-24 | 2002-10-22 | Vermon | Integrated connector backings for matrix array transducers, matrix array transducers employing such backings and methods of making the same |
| AU2003247287A1 (en) * | 2002-05-23 | 2003-12-12 | Schott Ag | Glass material for use at high frequencies |
| US6958255B2 (en) * | 2002-08-08 | 2005-10-25 | The Board Of Trustees Of The Leland Stanford Junior University | Micromachined ultrasonic transducers and method of fabrication |
| US7321181B2 (en) * | 2004-04-07 | 2008-01-22 | The Board Of Trustees Of The Leland Stanford Junior University | Capacitive membrane ultrasonic transducers with reduced bulk wave generation and method |
| US7545075B2 (en) * | 2004-06-04 | 2009-06-09 | The Board Of Trustees Of The Leland Stanford Junior University | Capacitive micromachined ultrasonic transducer array with through-substrate electrical connection and method of fabricating same |
| WO2005120355A1 (ja) * | 2004-06-07 | 2005-12-22 | Olympus Corporation | 静電容量型超音波トランスデューサ |
| KR100618287B1 (ko) * | 2004-08-24 | 2006-08-31 | 삼신이노텍 주식회사 | 블루투스를 이용한 펜타입의 휴대용 무선통신 단말기 |
| ITRM20050093A1 (it) * | 2005-03-04 | 2006-09-05 | Consiglio Nazionale Ricerche | Procedimento micromeccanico superficiale di fabbricazione di trasduttori ultracustici capacitivi microlavorati e relativo trasduttore ultracustico capacitivo microlavorato. |
| CN101193711B (zh) * | 2005-06-07 | 2010-12-29 | 皇家飞利浦电子股份有限公司 | 用于超声传感器组件的多器件衬块 |
| US20070180916A1 (en) * | 2006-02-09 | 2007-08-09 | General Electric Company | Capacitive micromachined ultrasound transducer and methods of making the same |
| JP4804961B2 (ja) * | 2006-03-03 | 2011-11-02 | オリンパスメディカルシステムズ株式会社 | 超音波振動子及びそれを搭載した体腔内超音波診断装置 |
| US7741686B2 (en) * | 2006-07-20 | 2010-06-22 | The Board Of Trustees Of The Leland Stanford Junior University | Trench isolated capacitive micromachined ultrasonic transducer arrays with a supporting frame |
| US7843022B2 (en) * | 2007-10-18 | 2010-11-30 | The Board Of Trustees Of The Leland Stanford Junior University | High-temperature electrostatic transducers and fabrication method |
| JP5108100B2 (ja) * | 2008-06-17 | 2012-12-26 | 株式会社日立製作所 | 半導体装置の製造方法 |
-
2010
- 2010-03-26 EP EP10714943.7A patent/EP2411163B1/en not_active Not-in-force
- 2010-03-26 DK DK10714943.7T patent/DK2411163T3/da active
- 2010-03-26 WO PCT/GB2010/000583 patent/WO2010109205A2/en not_active Ceased
- 2010-03-26 EP EP20130167734 patent/EP2662153A1/en not_active Withdrawn
- 2010-03-26 EP EP20130167735 patent/EP2659987A1/en not_active Withdrawn
- 2010-03-26 US US13/259,809 patent/US20120074509A1/en not_active Abandoned
- 2010-03-26 JP JP2012501381A patent/JP5744002B2/ja not_active Expired - Fee Related
- 2010-03-26 ES ES10714943T patent/ES2416182T3/es active Active
- 2010-03-26 EP EP13167736.1A patent/EP2669019A1/en not_active Ceased
- 2010-03-26 CN CN2010800225984A patent/CN102427890A/zh active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2012521704A5 (enExample) | ||
| JP2012085239A5 (enExample) | ||
| CN112005378A (zh) | 显示基板及其制备方法 | |
| WO2010109205A3 (en) | Wafer bond cmut array with conductive vias | |
| WO2012143784A8 (en) | Semiconductor device and manufacturing method thereof | |
| JP2016518739A5 (enExample) | ||
| JP2013511142A5 (enExample) | ||
| JP2009033145A5 (enExample) | ||
| JP2017516428A5 (enExample) | ||
| JP2011151121A5 (enExample) | ||
| JP2011054949A5 (ja) | 半導体装置 | |
| WO2013055307A3 (en) | Backplane reinforcement and interconnects for solar cells | |
| WO2011061043A3 (en) | Grid-line-free contact for a photovoltaic cell | |
| WO2006138671A3 (en) | Photovoltaic wire | |
| JP2009194322A5 (enExample) | ||
| JP2009003434A5 (enExample) | ||
| JP2011517123A5 (enExample) | ||
| EP2423950A3 (en) | Via-less thin film resistor with a dielectric cap and manufacturing method thereof | |
| JP2009278072A5 (enExample) | ||
| WO2009028578A3 (en) | Semiconductor device including semiconductor constituent and manufacturing method thereof | |
| JP2009049393A5 (enExample) | ||
| JP2011045040A5 (enExample) | ||
| EP2230686A3 (en) | Method of manufacturing semiconductor device | |
| WO2012012569A3 (en) | Multi-sensor integrated circuit device | |
| EP2031653A3 (en) | Semiconductor device having multiple element formation regions and manufacturing method thereof |