Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
  • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
  • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
  • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
  • B06B1/0292—Electrostatic transducers, e.g. electret-type
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
  • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
  • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
  • H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
  • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Mechanical Engineering (AREA)
• Transducers For Ultrasonic Waves (AREA)
• Ultra Sonic Daignosis Equipment (AREA)
• Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
• Bipolar Transistors (AREA)
• Pressure Sensors (AREA)
• Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Applications Claiming Priority (4)

Publications (1)

Family

ID=42308937

Family Applications (1)

Country Status (7)

Families Citing this family (47)

Family Cites Families (20)

• 2010
  • 2010-03-26 WO PCT/GB2010/000583 patent/WO2010109205A2/en not_active Ceased
  • 2010-03-26 DK DK10714943.7T patent/DK2411163T3/da active
  • 2010-03-26 US US13/259,809 patent/US20120074509A1/en not_active Abandoned
  • 2010-03-26 EP EP20130167734 patent/EP2662153A1/en not_active Withdrawn
  • 2010-03-26 CN CN2010800225984A patent/CN102427890A/zh active Pending
  • 2010-03-26 ES ES10714943T patent/ES2416182T3/es active Active
  • 2010-03-26 EP EP10714943.7A patent/EP2411163B1/en not_active Not-in-force
  • 2010-03-26 JP JP2012501381A patent/JP5744002B2/ja not_active Expired - Fee Related
  • 2010-03-26 EP EP20130167735 patent/EP2659987A1/en not_active Withdrawn
  • 2010-03-26 EP EP13167736.1A patent/EP2669019A1/en not_active Ceased

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