JP2012513899A5 - - Google Patents

Download PDF

Info

Publication number
JP2012513899A5
JP2012513899A5 JP2011544602A JP2011544602A JP2012513899A5 JP 2012513899 A5 JP2012513899 A5 JP 2012513899A5 JP 2011544602 A JP2011544602 A JP 2011544602A JP 2011544602 A JP2011544602 A JP 2011544602A JP 2012513899 A5 JP2012513899 A5 JP 2012513899A5
Authority
JP
Japan
Prior art keywords
flexible web
cleaning layer
major surface
particles
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011544602A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012513899A (ja
JP5551713B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2009/069803 external-priority patent/WO2010078414A2/en
Publication of JP2012513899A publication Critical patent/JP2012513899A/ja
Publication of JP2012513899A5 publication Critical patent/JP2012513899A5/ja
Application granted granted Critical
Publication of JP5551713B2 publication Critical patent/JP5551713B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011544602A 2008-12-31 2009-12-30 デバイスのコンポーネントの製造方法、及びその結果として得られるコンポーネント及びデバイス Expired - Fee Related JP5551713B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14197308P 2008-12-31 2008-12-31
US61/141,973 2008-12-31
PCT/US2009/069803 WO2010078414A2 (en) 2008-12-31 2009-12-30 Method of producing a component of a device, and the resulting components and devices

Publications (3)

Publication Number Publication Date
JP2012513899A JP2012513899A (ja) 2012-06-21
JP2012513899A5 true JP2012513899A5 (https=) 2013-02-21
JP5551713B2 JP5551713B2 (ja) 2014-07-16

Family

ID=42310597

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011544602A Expired - Fee Related JP5551713B2 (ja) 2008-12-31 2009-12-30 デバイスのコンポーネントの製造方法、及びその結果として得られるコンポーネント及びデバイス

Country Status (7)

Country Link
US (3) US8753712B2 (https=)
EP (1) EP2382650B1 (https=)
JP (1) JP5551713B2 (https=)
KR (1) KR101597860B1 (https=)
CN (1) CN102326233B (https=)
BR (1) BRPI0923756A2 (https=)
WO (1) WO2010078414A2 (https=)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8753712B2 (en) * 2008-12-31 2014-06-17 3M Innovative Properties Company Method of producing a component of a device, and the resulting components and devices
KR101147988B1 (ko) * 2010-07-13 2012-05-24 포항공과대학교 산학협력단 물리적 박리 방법을 이용한 플렉서블 전자소자의 제조방법, 플렉서블 전자소자 및 플렉서블 기판
DE102013000400B4 (de) * 2013-01-11 2015-07-16 Curt Niebling Verfahren und Vorrichtung zur Transferlaminierung
JP6023737B2 (ja) * 2014-03-18 2016-11-09 信越化学工業株式会社 ウエハ加工体、ウエハ加工用仮接着材、及び薄型ウエハの製造方法
US10190004B2 (en) * 2014-03-27 2019-01-29 Skudo Group Pty Ltd Peelable coating
GB201407956D0 (en) * 2014-05-06 2014-06-18 Isis Innovation Vacuum deposited modification of polymer surfaces
JP6426936B2 (ja) * 2014-07-31 2018-11-21 東京エレクトロン株式会社 基板洗浄方法および記憶媒体
JP6371253B2 (ja) * 2014-07-31 2018-08-08 東京エレクトロン株式会社 基板洗浄システム、基板洗浄方法および記憶媒体
DE112015004366A5 (de) * 2014-09-26 2017-06-08 Heliatek Gmbh Verfahren zum aufbringen einer schutzschicht, schutzschicht selbst und halbfabrikat mit einer schutzschicht
US10276469B2 (en) * 2015-04-17 2019-04-30 Taiwan Semiconductor Manufacturing Co., Ltd Method for forming semiconductor device structure
US11242198B2 (en) * 2015-11-10 2022-02-08 Simplehuman, Llc Household goods with antimicrobial coatings and methods of making thereof
KR101905560B1 (ko) * 2016-03-08 2018-11-21 현대자동차 주식회사 연료전지용 막-전극 어셈블리의 제조장치 및 방법
IL262529B2 (en) 2016-05-30 2023-06-01 Landa Labs 2012 Ltd A method for creating a multi-layered product
GB201609463D0 (en) * 2016-05-30 2016-07-13 Landa Labs 2012 Ltd Method of manufacturing a multi-layer article
CN107618693A (zh) * 2016-07-15 2018-01-23 戴宇 对表面产生效应的装置、方法及其批量应用的装置和方法
DE102017108496B4 (de) * 2017-04-21 2023-06-29 Windmöller & Hölscher Kg Verfahren und Vorrichtungen sowie System zum Auf- und Abwickeln eines Wickels
JP2021514827A (ja) * 2018-02-23 2021-06-17 インターナショナル テスト ソリューションズ, インコーポレイテッド フレキシブル電子回路ウェブロールを自動的に清浄化するための新規材料及びハードウエア
CN108941061B (zh) * 2018-05-18 2021-02-05 中国人民解放军国防科技大学 光学元件的定量化清洁装置及方法
JP7227758B2 (ja) * 2018-05-31 2023-02-22 株式会社Screenホールディングス 基板処理方法および基板処理装置
CN108910141B (zh) * 2018-08-27 2024-01-12 广东利元亨智能装备股份有限公司 一种抚平装置
CN110045866A (zh) * 2019-03-06 2019-07-23 苏州蓝沛光电科技有限公司 刮涂残留物的去除方法
KR102723091B1 (ko) * 2019-12-19 2024-10-29 에프. 호프만-라 로슈 아게 복수의 분석 테스트 스트립을 제조하는 방법 및 시스템
WO2022118289A1 (en) * 2020-12-04 2022-06-09 3M Innovative Properties Company Laminates for cleaning substrate surfaces and methods of use thereof
EP4248272B1 (en) * 2020-12-21 2024-02-28 3M Innovative Properties Company Arrayed structured replication articles and methods
WO2023118185A1 (en) * 2021-12-20 2023-06-29 Nicoventures Trading Limited A method of manufacturing a product comprising aerosol generating material
CN114497408A (zh) * 2022-02-11 2022-05-13 吉林大学 一种纸基有机电致发光器件及其制备方法

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1918382A1 (de) 1969-04-11 1970-10-22 Porsche Kg Einrichtung an Brennkraftmaschinen zum Verhindern des Ausstroemens von Brennstoff aus dem Gemischbildungssystem in die Atmosphaere
US3711176A (en) 1971-01-14 1973-01-16 Dow Chemical Co Highly reflective thermoplastic bodies for infrared, visible or ultraviolet light
DE2603290B2 (de) * 1976-01-29 1978-04-20 Claus 6000 Frankfurt Hilgenstock Verfahren zum Reinigen von Metall-, Glas- oder Kunststoffoberflachen, insbesondere von Schallplatten
US4341687A (en) 1979-09-25 1982-07-27 Tokyo Shibaura Denki Kabushiki Kaisha Peelable film-forming urethane/isocyanate paints
US5120369A (en) 1982-04-15 1992-06-09 The United States Of America As Represented By The Secretary Of The Navy Hazardous material removal using strippable coatings
JPH0268176A (ja) 1988-08-31 1990-03-07 Dainippon Printing Co Ltd 剥離性保護コーティングフィルム
DE69126889T2 (de) * 1990-06-08 1998-01-08 Minnesota Mining & Mfg Wiederverarbeitbarer klebstoff für elektronische anwendungen
US5103337A (en) 1990-07-24 1992-04-07 The Dow Chemical Company Infrared reflective optical interference film
JPH04349984A (ja) * 1991-05-27 1992-12-04 Taiyo Kogyo Kk 膜材の清掃方法
US5262193A (en) 1991-10-15 1993-11-16 Minnesota Mining And Manufacturing Company Ultrasonically assisted coating method
EP0627991A1 (en) 1992-02-25 1994-12-14 The Dow Chemical Company All-polymeric ultraviolet reflecting film
JPH06225848A (ja) 1993-02-01 1994-08-16 Tootaru Service:Kk 建造物外壁表面の清掃方法
JPH06299321A (ja) 1993-02-19 1994-10-25 Toppan Printing Co Ltd 金属あるいは金属酸化物被覆フィルムの製造装置
US5411787A (en) * 1993-10-19 1995-05-02 Minnesota Mining And Manufacturing Company Water based transparent image recording sheet
AU1866395A (en) 1993-12-21 1995-07-10 Minnesota Mining And Manufacturing Company Multilayered optical film
US5882774A (en) 1993-12-21 1999-03-16 Minnesota Mining And Manufacturing Company Optical film
JP2823813B2 (ja) 1994-05-06 1998-11-11 鹿島建設株式会社 剥離性ポリマー膜による壁面汚れの剥離方法
JP3046918B2 (ja) 1994-10-17 2000-05-29 クレオール株式会社 塗装面の洗浄方法
JP3107030B2 (ja) 1997-03-14 2000-11-06 鹿島建設株式会社 構造物表面の洗浄方法
US5902678A (en) 1997-04-01 1999-05-11 Nitto Denko Corporation Pressure-sensitive adhesive or pressure-sensitive adhesive tape for foreign-matter removal
US5753563A (en) 1997-07-30 1998-05-19 Chartered Semiconductor Manufacturing Ltd. Method of removing particles by adhesive
US6071597A (en) 1997-08-28 2000-06-06 3M Innovative Properties Company Flexible circuits and carriers and process for manufacture
US20010008169A1 (en) * 1998-06-30 2001-07-19 3M Innovative Properties Company Fine pitch anisotropic conductive adhesive
JP2000042470A (ja) * 1998-07-31 2000-02-15 Teijin Ltd プラスチックフィルムの製造方法及びその装置
US6086798A (en) 1998-12-17 2000-07-11 Abante Corporation Method for removing contaminant from surface of mold die
US6492738B2 (en) * 1999-09-02 2002-12-10 Micron Technology, Inc. Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer
US6495266B1 (en) * 1999-11-12 2002-12-17 Exxonmobil Oil Corporation Films with improved blocking resistance and surface properties
US7204890B2 (en) 2000-01-31 2007-04-17 Henkel Kommanditgesellschaft Auf Aktien Process for removing fine particulate soil from hard surfaces
JP2001338441A (ja) * 2000-05-25 2001-12-07 Sony Corp 光学記録媒体の製造方法および光学記録媒体の製造装置
US6553689B2 (en) 2000-09-24 2003-04-29 3M Innovative Properties Company Vapor collection method and apparatus
US7143528B2 (en) 2000-09-24 2006-12-05 3M Innovative Properties Company Dry converting process and apparatus
US7032324B2 (en) 2000-09-24 2006-04-25 3M Innovative Properties Company Coating process and apparatus
EP1337349B1 (de) * 2000-12-01 2011-03-09 Henkel AG & Co. KGaA Vorrichtung zum geregelten auftragen von kleb- und/oder dichtstoffen
US6436851B1 (en) 2001-01-05 2002-08-20 Taiwan Semiconductor Manufacturing Co., Ltd. Method for spin coating a high viscosity liquid on a wafer
US6776171B2 (en) 2001-06-27 2004-08-17 International Business Machines Corporation Cleaning of semiconductor wafers by contaminate encapsulation
US20030072948A1 (en) 2001-10-03 2003-04-17 3M Innovative Properties Company Dry-peelable temporary protective coatings
GB0208506D0 (en) 2002-04-12 2002-05-22 Dupont Teijin Films Us Ltd Film coating
JP4383077B2 (ja) * 2003-03-31 2009-12-16 大日本印刷株式会社 ガスバリア性基板
US7018713B2 (en) 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US20070200147A1 (en) * 2004-08-04 2007-08-30 Fujifilm Corporation Method For Manufacturing An Optical Film, Apparatus For Manufacturing The Same Optical Film, Polarizing Plate And Image Display Device
JP2006119186A (ja) 2004-10-19 2006-05-11 Hitachi Maxell Ltd 画面保護シート
US20070126158A1 (en) * 2005-12-01 2007-06-07 3M Innovative Properties Company Method of cleaning polymeric mold
DE102006035644A1 (de) * 2006-07-31 2008-02-14 Advanced Micro Devices, Inc., Sunnyvale Verfahren zum Reduzieren der Kontamination durch Vorsehen einer zu entfernenden Polymerschutzschicht während der Bearbeitung von Mikrostrukturen
JP2008135661A (ja) * 2006-11-29 2008-06-12 Hitachi High-Technologies Corp 半導体処理装置の清浄化方法
KR20080051961A (ko) 2006-12-07 2008-06-11 한국전자통신연구원 플렉시블 기판의 세정 방법
US8753712B2 (en) * 2008-12-31 2014-06-17 3M Innovative Properties Company Method of producing a component of a device, and the resulting components and devices
WO2010078233A2 (en) 2008-12-31 2010-07-08 3M Innovative Properties Company Substrate with planarizing coating and method of making same

Similar Documents

Publication Publication Date Title
JP2012513899A5 (https=)
JP5551713B2 (ja) デバイスのコンポーネントの製造方法、及びその結果として得られるコンポーネント及びデバイス
US20100330788A1 (en) Thin wafer handling structure and method
CN102150269B (zh) 用于制造固态成像装置的方法
CN103342356B (zh) 一种金属箔基底石墨烯的转移方法
CN112194120B (zh) 使用极化的铁电聚合物无缺陷地直接干法层离cvd石墨烯
JP2005085705A5 (https=)
KR20220075241A (ko) 쉬운 조립을 위한 초소형 또는 초박형 개별 컴포넌트의 구성
CN104669734A (zh) 一种具有多层使用层的保护膜及其制备方法
TWI307804B (https=)
JP6055494B2 (ja) レーザーダイシング方法
CN115642077B (zh) 利用有机薄膜快速去除颗粒的方法和装置
JP2006060196A5 (https=)
KR101175892B1 (ko) 절연 필름 구조체 및 이의 제조 방법
TW201946210A (zh) 膠膜剝離裝置
KR102365285B1 (ko) 제품 기판을 코팅하기 위한 방법 및 장치
JP7592673B2 (ja) 保護テープ及びその製造方法
JP4775799B2 (ja) 金属薄膜転写材料用シートの製造方法
CN103702513A (zh) 适用于单面柔性线路板的承载膜及其制备方法和应用
JP4274313B2 (ja) 大型ペリクル用成膜基板及び大型ペリクル膜の製造方法
JP2007217091A (ja) 表面処理装置および表面処理方法
JPH0897179A (ja) 半導体ウエハに付着した異物の除去用粘着テ―プおよびラベルと除去方法
TW202007532A (zh) 用於軟性顯示器之透明聚醯亞胺複合膜及其製造方法
JP2005043707A (ja) 大型ペリクル用成膜基板及びその用途