TWI307804B - - Google Patents
Download PDFInfo
- Publication number
- TWI307804B TWI307804B TW95127338A TW95127338A TWI307804B TW I307804 B TWI307804 B TW I307804B TW 95127338 A TW95127338 A TW 95127338A TW 95127338 A TW95127338 A TW 95127338A TW I307804 B TWI307804 B TW I307804B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- adhesive
- connecting body
- optical member
- optical
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 105
- 230000003287 optical effect Effects 0.000 claims description 48
- 239000000853 adhesive Substances 0.000 claims description 24
- 230000001070 adhesive effect Effects 0.000 claims description 24
- 239000011521 glass Substances 0.000 claims description 22
- 238000005488 sandblasting Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000007788 liquid Substances 0.000 description 11
- 238000005530 etching Methods 0.000 description 9
- 239000002245 particle Substances 0.000 description 6
- 239000012467 final product Substances 0.000 description 5
- 230000002411 adverse Effects 0.000 description 4
- 239000006059 cover glass Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052770 Uranium Inorganic materials 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Optical Filters (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Joining Of Glass To Other Materials (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005226706A JP2007039287A (ja) | 2005-08-04 | 2005-08-04 | 基板の面取り方法及び光学部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200710526A TW200710526A (en) | 2007-03-16 |
| TWI307804B true TWI307804B (https=) | 2009-03-21 |
Family
ID=37699151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095127338A TW200710526A (en) | 2005-08-04 | 2006-07-26 | Method for chamfering substrate and method for manufacturing optical component |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2007039287A (https=) |
| CN (1) | CN1907893B (https=) |
| TW (1) | TW200710526A (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101950040B (zh) * | 2010-04-23 | 2011-09-14 | 浙江水晶光电科技股份有限公司 | 滤光片分离器 |
| CN102398223A (zh) * | 2010-09-14 | 2012-04-04 | 鸿富锦精密工业（深圳）有限公司 | 滚圆装置及滚圆方法 |
| JP5793014B2 (ja) * | 2011-07-21 | 2015-10-14 | 株式会社不二製作所 | 硬質脆性材料基板の側部研磨方法 |
| JP5943659B2 (ja) * | 2012-03-15 | 2016-07-05 | サンワ化学工業株式会社 | ガラス積層用仮固定接着剤組成物及び該組成物を用いる板ガラスの加工方法 |
| JP2013252993A (ja) * | 2012-06-07 | 2013-12-19 | Nippon Electric Glass Co Ltd | 膜付ガラス板の製造方法及び膜付ガラス板 |
| JP2015008192A (ja) * | 2013-06-25 | 2015-01-15 | 株式会社ディスコ | サファイアウェーハの外周研磨方法 |
| CN103435254A (zh) * | 2013-08-27 | 2013-12-11 | 江西合力泰科技股份有限公司 | 一种玻璃盖板切割工艺 |
| CN106003432B (zh) * | 2016-06-06 | 2018-05-15 | 重庆市三星精艺玻璃有限公司 | 双层玻璃钻孔工艺 |
| CN112768383A (zh) * | 2021-01-26 | 2021-05-07 | 长江存储科技有限责任公司 | 晶圆处理装置与晶圆处理方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR950012890B1 (ko) * | 1992-01-21 | 1995-10-23 | 박경 | 연마를 겸할 수 있는 판유리 변형면취기 |
| JPH06320425A (ja) * | 1993-05-13 | 1994-11-22 | Sony Corp | 硬脆質薄板の端面加工方法 |
| JP4392882B2 (ja) * | 1998-11-30 | 2010-01-06 | Ｈｏｙａ株式会社 | 板ガラス製品の製造方法 |
| JP4447393B2 (ja) * | 2004-07-23 | 2010-04-07 | Ｈｏｙａ株式会社 | 光学多層膜付きガラス部材、及び該ガラス部材を用いた光学素子 |
-
2005
- 2005-08-04 JP JP2005226706A patent/JP2007039287A/ja not_active Abandoned
-
2006
- 2006-07-26 TW TW095127338A patent/TW200710526A/zh not_active IP Right Cessation
- 2006-08-04 CN CN2006101100661A patent/CN1907893B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1907893A (zh) | 2007-02-07 |
| TW200710526A (en) | 2007-03-16 |
| CN1907893B (zh) | 2010-07-21 |
| JP2007039287A (ja) | 2007-02-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8885258B2 (en) | Stack-type lens array and lens module | |
| TWI283457B (en) | Manufacturing method of semiconductor device | |
| TW201104732A (en) | Thin wafer structure and method | |
| TWI307804B (https=) | ||
| JP2020518133A5 (https=) | ||
| TW201224593A (en) | Method of producing glass substrate for electronic device | |
| CN1883033A (zh) | 在大批量制造中的背研磨期间保护薄半导体晶片 | |
| JP2009536108A5 (https=) | ||
| TWI351389B (en) | Process for producing components | |
| KR100822842B1 (ko) | 기판의 모따기방법 및 광학부품의 제조방법 | |
| JP4578939B2 (ja) | 小型ガラス製品の製造方法 | |
| JP4273945B2 (ja) | 複合プリズムの製造方法 | |
| JPS6316970A (ja) | 研磨用基板ホルダ−およびそれから基板を脱離させる方法 | |
| CN114573243A (zh) | 一种超薄玻璃减薄工艺 | |
| CN100501910C (zh) | 粘贴于粘着薄片的基体片、半导体晶片及装置的制造方法 | |
| JP2007130723A (ja) | ガラス基板の角部面取り用保持装置及びガラス基板の角部面取り方法 | |
| WO2007028695A1 (en) | Method for cleaning particulate foreign matter from the surfaces of semiconductor wafers | |
| TWI846913B (zh) | 樹脂片材之剝離方法 | |
| JP4650791B2 (ja) | ディスプレイ用ガラス基板の処理方法 | |
| JP2004274008A (ja) | 厚さが薄いウエハからチップを製造する方法 | |
| KR100699148B1 (ko) | 웨이퍼 후면 연삭장치 및 이를 이용한 연삭 방법 | |
| TW202234495A (zh) | 製造半導體製品的方法及其系統 | |
| JP2004255541A (ja) | 半導体ウエハ製造方法 | |
| JP2020107683A (ja) | 基板処理システム、および基板処理方法 | |
| JP2003048209A (ja) | セラミックチップの製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |