TW200710526A - Method for chamfering substrate and method for manufacturing optical component - Google Patents

Method for chamfering substrate and method for manufacturing optical component

Info

Publication number
TW200710526A
TW200710526A TW095127338A TW95127338A TW200710526A TW 200710526 A TW200710526 A TW 200710526A TW 095127338 A TW095127338 A TW 095127338A TW 95127338 A TW95127338 A TW 95127338A TW 200710526 A TW200710526 A TW 200710526A
Authority
TW
Taiwan
Prior art keywords
substrate
substrates
cut
chamfering
binder
Prior art date
Application number
TW095127338A
Other languages
English (en)
Other versions
TWI307804B (zh
Inventor
Takeshi Fukano
Original Assignee
Fujinon Sano Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujinon Sano Corp filed Critical Fujinon Sano Corp
Publication of TW200710526A publication Critical patent/TW200710526A/zh
Application granted granted Critical
Publication of TWI307804B publication Critical patent/TWI307804B/zh

Links

TW095127338A 2005-08-04 2006-07-26 Method for chamfering substrate and method for manufacturing optical component TW200710526A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005226706A JP2007039287A (ja) 2005-08-04 2005-08-04 基板の面取り方法及び光学部品の製造方法

Publications (2)

Publication Number Publication Date
TW200710526A true TW200710526A (en) 2007-03-16
TWI307804B TWI307804B (zh) 2009-03-21

Family

ID=37699151

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095127338A TW200710526A (en) 2005-08-04 2006-07-26 Method for chamfering substrate and method for manufacturing optical component

Country Status (3)

Country Link
JP (1) JP2007039287A (zh)
CN (1) CN1907893B (zh)
TW (1) TW200710526A (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101950040B (zh) * 2010-04-23 2011-09-14 浙江水晶光电科技股份有限公司 滤光片分离器
CN102398223A (zh) * 2010-09-14 2012-04-04 鸿富锦精密工业（深圳）有限公司 滚圆装置及滚圆方法
JP5793014B2 (ja) * 2011-07-21 2015-10-14 株式会社不二製作所 硬質脆性材料基板の側部研磨方法
JP5943659B2 (ja) * 2012-03-15 2016-07-05 サンワ化学工業株式会社 ガラス積層用仮固定接着剤組成物及び該組成物を用いる板ガラスの加工方法
JP2013252993A (ja) * 2012-06-07 2013-12-19 Nippon Electric Glass Co Ltd 膜付ガラス板の製造方法及び膜付ガラス板
JP2015008192A (ja) * 2013-06-25 2015-01-15 株式会社ディスコ サファイアウェーハの外周研磨方法
CN103435254A (zh) * 2013-08-27 2013-12-11 江西合力泰科技股份有限公司 一种玻璃盖板切割工艺
CN106003432B (zh) * 2016-06-06 2018-05-15 重庆市三星精艺玻璃有限公司 双层玻璃钻孔工艺
CN112768383A (zh) * 2021-01-26 2021-05-07 长江存储科技有限责任公司 晶圆处理装置与晶圆处理方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950012890B1 (ko) * 1992-01-21 1995-10-23 박경 연마를 겸할 수 있는 판유리 변형면취기
JPH06320425A (ja) * 1993-05-13 1994-11-22 Sony Corp 硬脆質薄板の端面加工方法
JP4392882B2 (ja) * 1998-11-30 2010-01-06 Ｈｏｙａ株式会社 板ガラス製品の製造方法
JP4447393B2 (ja) * 2004-07-23 2010-04-07 Ｈｏｙａ株式会社 光学多層膜付きガラス部材、及び該ガラス部材を用いた光学素子

Also Published As

Publication number Publication date
CN1907893A (zh) 2007-02-07
TWI307804B (zh) 2009-03-21
JP2007039287A (ja) 2007-02-15
CN1907893B (zh) 2010-07-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees