BRPI0923756A2 - método para produção de um componente de um dispositivo, e os componentes e dispositivos resultantes - Google Patents
método para produção de um componente de um dispositivo, e os componentes e dispositivos resultantesInfo
- Publication number
- BRPI0923756A2 BRPI0923756A2 BRPI0923756A BRPI0923756A BRPI0923756A2 BR PI0923756 A2 BRPI0923756 A2 BR PI0923756A2 BR PI0923756 A BRPI0923756 A BR PI0923756A BR PI0923756 A BRPI0923756 A BR PI0923756A BR PI0923756 A2 BRPI0923756 A2 BR PI0923756A2
- Authority
- BR
- Brazil
- Prior art keywords
- producing
- devices
- component
- resulting components
- resulting
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/60—Cleaning only by mechanical processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/007—After-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0014—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by incorporation in a layer which is removed with the contaminants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24612—Composite web or sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2804—Next to metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2839—Web or sheet containing structurally defined element or component and having an adhesive outermost layer with release or antistick coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2848—Three or more layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14197308P | 2008-12-31 | 2008-12-31 | |
| PCT/US2009/069803 WO2010078414A2 (en) | 2008-12-31 | 2009-12-30 | Method of producing a component of a device, and the resulting components and devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0923756A2 true BRPI0923756A2 (pt) | 2016-01-19 |
Family
ID=42310597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0923756A BRPI0923756A2 (pt) | 2008-12-31 | 2009-12-30 | método para produção de um componente de um dispositivo, e os componentes e dispositivos resultantes |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US8753712B2 (https=) |
| EP (1) | EP2382650B1 (https=) |
| JP (1) | JP5551713B2 (https=) |
| KR (1) | KR101597860B1 (https=) |
| CN (1) | CN102326233B (https=) |
| BR (1) | BRPI0923756A2 (https=) |
| WO (1) | WO2010078414A2 (https=) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8753712B2 (en) * | 2008-12-31 | 2014-06-17 | 3M Innovative Properties Company | Method of producing a component of a device, and the resulting components and devices |
| KR101147988B1 (ko) * | 2010-07-13 | 2012-05-24 | 포항공과대학교 산학협력단 | 물리적 박리 방법을 이용한 플렉서블 전자소자의 제조방법, 플렉서블 전자소자 및 플렉서블 기판 |
| DE102013000400B4 (de) * | 2013-01-11 | 2015-07-16 | Curt Niebling | Verfahren und Vorrichtung zur Transferlaminierung |
| JP6023737B2 (ja) * | 2014-03-18 | 2016-11-09 | 信越化学工業株式会社 | ウエハ加工体、ウエハ加工用仮接着材、及び薄型ウエハの製造方法 |
| US10190004B2 (en) * | 2014-03-27 | 2019-01-29 | Skudo Group Pty Ltd | Peelable coating |
| GB201407956D0 (en) * | 2014-05-06 | 2014-06-18 | Isis Innovation | Vacuum deposited modification of polymer surfaces |
| JP6426936B2 (ja) * | 2014-07-31 | 2018-11-21 | 東京エレクトロン株式会社 | 基板洗浄方法および記憶媒体 |
| JP6371253B2 (ja) * | 2014-07-31 | 2018-08-08 | 東京エレクトロン株式会社 | 基板洗浄システム、基板洗浄方法および記憶媒体 |
| DE112015004366A5 (de) * | 2014-09-26 | 2017-06-08 | Heliatek Gmbh | Verfahren zum aufbringen einer schutzschicht, schutzschicht selbst und halbfabrikat mit einer schutzschicht |
| US10276469B2 (en) * | 2015-04-17 | 2019-04-30 | Taiwan Semiconductor Manufacturing Co., Ltd | Method for forming semiconductor device structure |
| US11242198B2 (en) * | 2015-11-10 | 2022-02-08 | Simplehuman, Llc | Household goods with antimicrobial coatings and methods of making thereof |
| KR101905560B1 (ko) * | 2016-03-08 | 2018-11-21 | 현대자동차 주식회사 | 연료전지용 막-전극 어셈블리의 제조장치 및 방법 |
| IL262529B2 (en) | 2016-05-30 | 2023-06-01 | Landa Labs 2012 Ltd | A method for creating a multi-layered product |
| GB201609463D0 (en) * | 2016-05-30 | 2016-07-13 | Landa Labs 2012 Ltd | Method of manufacturing a multi-layer article |
| CN107618693A (zh) * | 2016-07-15 | 2018-01-23 | 戴宇 | 对表面产生效应的装置、方法及其批量应用的装置和方法 |
| DE102017108496B4 (de) * | 2017-04-21 | 2023-06-29 | Windmöller & Hölscher Kg | Verfahren und Vorrichtungen sowie System zum Auf- und Abwickeln eines Wickels |
| JP2021514827A (ja) * | 2018-02-23 | 2021-06-17 | インターナショナル テスト ソリューションズ, インコーポレイテッド | フレキシブル電子回路ウェブロールを自動的に清浄化するための新規材料及びハードウエア |
| CN108941061B (zh) * | 2018-05-18 | 2021-02-05 | 中国人民解放军国防科技大学 | 光学元件的定量化清洁装置及方法 |
| JP7227758B2 (ja) * | 2018-05-31 | 2023-02-22 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
| CN108910141B (zh) * | 2018-08-27 | 2024-01-12 | 广东利元亨智能装备股份有限公司 | 一种抚平装置 |
| CN110045866A (zh) * | 2019-03-06 | 2019-07-23 | 苏州蓝沛光电科技有限公司 | 刮涂残留物的去除方法 |
| KR102723091B1 (ko) * | 2019-12-19 | 2024-10-29 | 에프. 호프만-라 로슈 아게 | 복수의 분석 테스트 스트립을 제조하는 방법 및 시스템 |
| WO2022118289A1 (en) * | 2020-12-04 | 2022-06-09 | 3M Innovative Properties Company | Laminates for cleaning substrate surfaces and methods of use thereof |
| EP4248272B1 (en) * | 2020-12-21 | 2024-02-28 | 3M Innovative Properties Company | Arrayed structured replication articles and methods |
| WO2023118185A1 (en) * | 2021-12-20 | 2023-06-29 | Nicoventures Trading Limited | A method of manufacturing a product comprising aerosol generating material |
| CN114497408A (zh) * | 2022-02-11 | 2022-05-13 | 吉林大学 | 一种纸基有机电致发光器件及其制备方法 |
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| DE2603290B2 (de) * | 1976-01-29 | 1978-04-20 | Claus 6000 Frankfurt Hilgenstock | Verfahren zum Reinigen von Metall-, Glas- oder Kunststoffoberflachen, insbesondere von Schallplatten |
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| JP2823813B2 (ja) | 1994-05-06 | 1998-11-11 | 鹿島建設株式会社 | 剥離性ポリマー膜による壁面汚れの剥離方法 |
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| JP3107030B2 (ja) | 1997-03-14 | 2000-11-06 | 鹿島建設株式会社 | 構造物表面の洗浄方法 |
| US5902678A (en) | 1997-04-01 | 1999-05-11 | Nitto Denko Corporation | Pressure-sensitive adhesive or pressure-sensitive adhesive tape for foreign-matter removal |
| US5753563A (en) | 1997-07-30 | 1998-05-19 | Chartered Semiconductor Manufacturing Ltd. | Method of removing particles by adhesive |
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| JP2000042470A (ja) * | 1998-07-31 | 2000-02-15 | Teijin Ltd | プラスチックフィルムの製造方法及びその装置 |
| US6086798A (en) | 1998-12-17 | 2000-07-11 | Abante Corporation | Method for removing contaminant from surface of mold die |
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| US6553689B2 (en) | 2000-09-24 | 2003-04-29 | 3M Innovative Properties Company | Vapor collection method and apparatus |
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| US7032324B2 (en) | 2000-09-24 | 2006-04-25 | 3M Innovative Properties Company | Coating process and apparatus |
| EP1337349B1 (de) * | 2000-12-01 | 2011-03-09 | Henkel AG & Co. KGaA | Vorrichtung zum geregelten auftragen von kleb- und/oder dichtstoffen |
| US6436851B1 (en) | 2001-01-05 | 2002-08-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for spin coating a high viscosity liquid on a wafer |
| US6776171B2 (en) | 2001-06-27 | 2004-08-17 | International Business Machines Corporation | Cleaning of semiconductor wafers by contaminate encapsulation |
| US20030072948A1 (en) | 2001-10-03 | 2003-04-17 | 3M Innovative Properties Company | Dry-peelable temporary protective coatings |
| GB0208506D0 (en) | 2002-04-12 | 2002-05-22 | Dupont Teijin Films Us Ltd | Film coating |
| JP4383077B2 (ja) * | 2003-03-31 | 2009-12-16 | 大日本印刷株式会社 | ガスバリア性基板 |
| US7018713B2 (en) | 2003-04-02 | 2006-03-28 | 3M Innovative Properties Company | Flexible high-temperature ultrabarrier |
| US20070200147A1 (en) * | 2004-08-04 | 2007-08-30 | Fujifilm Corporation | Method For Manufacturing An Optical Film, Apparatus For Manufacturing The Same Optical Film, Polarizing Plate And Image Display Device |
| JP2006119186A (ja) | 2004-10-19 | 2006-05-11 | Hitachi Maxell Ltd | 画面保護シート |
| US20070126158A1 (en) * | 2005-12-01 | 2007-06-07 | 3M Innovative Properties Company | Method of cleaning polymeric mold |
| DE102006035644A1 (de) * | 2006-07-31 | 2008-02-14 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren zum Reduzieren der Kontamination durch Vorsehen einer zu entfernenden Polymerschutzschicht während der Bearbeitung von Mikrostrukturen |
| JP2008135661A (ja) * | 2006-11-29 | 2008-06-12 | Hitachi High-Technologies Corp | 半導体処理装置の清浄化方法 |
| KR20080051961A (ko) | 2006-12-07 | 2008-06-11 | 한국전자통신연구원 | 플렉시블 기판의 세정 방법 |
| US8753712B2 (en) * | 2008-12-31 | 2014-06-17 | 3M Innovative Properties Company | Method of producing a component of a device, and the resulting components and devices |
| WO2010078233A2 (en) | 2008-12-31 | 2010-07-08 | 3M Innovative Properties Company | Substrate with planarizing coating and method of making same |
-
2009
- 2009-12-30 US US13/133,001 patent/US8753712B2/en not_active Expired - Fee Related
- 2009-12-30 BR BRPI0923756A patent/BRPI0923756A2/pt not_active IP Right Cessation
- 2009-12-30 CN CN2009801573277A patent/CN102326233B/zh not_active Expired - Fee Related
- 2009-12-30 JP JP2011544602A patent/JP5551713B2/ja not_active Expired - Fee Related
- 2009-12-30 KR KR1020117017687A patent/KR101597860B1/ko not_active Expired - Fee Related
- 2009-12-30 WO PCT/US2009/069803 patent/WO2010078414A2/en not_active Ceased
- 2009-12-30 EP EP09837157.8A patent/EP2382650B1/en not_active Not-in-force
-
2014
- 2014-05-01 US US14/266,958 patent/US20140230846A1/en not_active Abandoned
-
2019
- 2019-10-24 US US16/663,006 patent/US11335551B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2010078414A2 (en) | 2010-07-08 |
| CN102326233B (zh) | 2013-11-20 |
| JP2012513899A (ja) | 2012-06-21 |
| WO2010078414A3 (en) | 2010-09-10 |
| JP5551713B2 (ja) | 2014-07-16 |
| KR101597860B1 (ko) | 2016-02-26 |
| CN102326233A (zh) | 2012-01-18 |
| US11335551B2 (en) | 2022-05-17 |
| US20200058493A1 (en) | 2020-02-20 |
| US20110250401A1 (en) | 2011-10-13 |
| EP2382650A2 (en) | 2011-11-02 |
| EP2382650B1 (en) | 2019-04-10 |
| KR20110110784A (ko) | 2011-10-07 |
| US20140230846A1 (en) | 2014-08-21 |
| EP2382650A4 (en) | 2014-06-18 |
| US8753712B2 (en) | 2014-06-17 |
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