IT1397181B1 - Componente micromeccanico - Google Patents
Componente micromeccanicoInfo
- Publication number
- IT1397181B1 IT1397181B1 ITMI2009A001978A ITMI20091978A IT1397181B1 IT 1397181 B1 IT1397181 B1 IT 1397181B1 IT MI2009A001978 A ITMI2009A001978 A IT MI2009A001978A IT MI20091978 A ITMI20091978 A IT MI20091978A IT 1397181 B1 IT1397181 B1 IT 1397181B1
- Authority
- IT
- Italy
- Prior art keywords
- micromechanical component
- micromechanical
- component
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
- G01P2015/0831—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type having the pivot axis between the longitudinal ends of the mass, e.g. see-saw configuration
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008043788A DE102008043788A1 (de) | 2008-11-17 | 2008-11-17 | Mikromechanisches Bauelement |
Publications (2)
Publication Number | Publication Date |
---|---|
ITMI20091978A1 ITMI20091978A1 (it) | 2010-05-18 |
IT1397181B1 true IT1397181B1 (it) | 2013-01-04 |
Family
ID=42104817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITMI2009A001978A IT1397181B1 (it) | 2008-11-17 | 2009-11-12 | Componente micromeccanico |
Country Status (3)
Country | Link |
---|---|
US (1) | US8806940B2 (it) |
DE (1) | DE102008043788A1 (it) |
IT (1) | IT1397181B1 (it) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006058747A1 (de) * | 2006-12-12 | 2008-06-19 | Robert Bosch Gmbh | Mikromechanischer z-Sensor |
DE102008043788A1 (de) * | 2008-11-17 | 2010-05-20 | Robert Bosch Gmbh | Mikromechanisches Bauelement |
IT1401001B1 (it) * | 2010-06-15 | 2013-07-05 | Milano Politecnico | Accelerometro capacitivo triassiale microelettromeccanico |
DE102010039293B4 (de) | 2010-08-13 | 2018-05-24 | Robert Bosch Gmbh | Mikromechanisches Bauteil und Herstellungsverfahren für ein mikromechanisches Bauteil |
JP2012088120A (ja) * | 2010-10-18 | 2012-05-10 | Seiko Epson Corp | 物理量センサー素子、物理量センサーおよび電子機器 |
DE102010062056B4 (de) | 2010-11-26 | 2018-09-27 | Robert Bosch Gmbh | Mikromechanisches Bauteil |
DE102011006422B4 (de) | 2011-03-30 | 2019-02-28 | Robert Bosch Gmbh | Mikromechanisches Bauteil und Sensorvorrichtung |
US9069005B2 (en) * | 2011-06-17 | 2015-06-30 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Capacitance detector for accelerometer and gyroscope and accelerometer and gyroscope with capacitance detector |
DE102011081014B4 (de) | 2011-08-16 | 2020-01-23 | Robert Bosch Gmbh | Mikromechanisches Bauteil und Herstellungsverfahren für ein mikromechanisches Bauteil |
JP5790296B2 (ja) * | 2011-08-17 | 2015-10-07 | セイコーエプソン株式会社 | 物理量センサー及び電子機器 |
DE102011057110A1 (de) * | 2011-12-28 | 2013-07-04 | Maxim Integrated Products, Inc. | MEMS-Beschleunigungssensor |
DE102012208053B4 (de) | 2012-05-14 | 2024-07-11 | Robert Bosch Gmbh | Hybrid integriertes Bauteil und Verfahren zu dessen Herstellung |
US9290067B2 (en) * | 2012-08-30 | 2016-03-22 | Freescale Semiconductor, Inc. | Pressure sensor with differential capacitive output |
JP6206650B2 (ja) * | 2013-07-17 | 2017-10-04 | セイコーエプソン株式会社 | 機能素子、電子機器、および移動体 |
JP2015072188A (ja) * | 2013-10-03 | 2015-04-16 | セイコーエプソン株式会社 | 物理量検出素子、および物理量検出装置、電子機器、移動体 |
DE102014202816B4 (de) * | 2014-02-17 | 2022-06-30 | Robert Bosch Gmbh | Wippeneinrichtung für einen mikromechanischen Z-Sensor |
JP6274413B2 (ja) * | 2014-02-25 | 2018-02-07 | セイコーエプソン株式会社 | 機能素子、電子機器、および移動体 |
US9810712B2 (en) | 2014-08-15 | 2017-11-07 | Seiko Epson Corporation | Physical quantity sensor, physical quantity sensor device, electronic equipment, and moving body |
JP6655281B2 (ja) * | 2014-08-19 | 2020-02-26 | セイコーエプソン株式会社 | 物理量センサー、電子機器および移動体 |
JP6464613B2 (ja) | 2014-08-27 | 2019-02-06 | セイコーエプソン株式会社 | 物理量センサー、電子機器および移動体 |
US10295346B2 (en) * | 2014-10-28 | 2019-05-21 | Seiko Epson Corporation | Physical quantity detecting vibration element, physical quantity sensor, electronic apparatus, and moving object |
DE102014223314A1 (de) * | 2014-11-14 | 2016-05-19 | Robert Bosch Gmbh | Wippeneinrichtung für einen mikromechanischen Z-Sensor |
US20170356929A1 (en) * | 2015-01-30 | 2017-12-14 | Goertek, Inc. | Z-axis structure of accelerometer and manufacturing method of z-axis structure |
DE102015207639B4 (de) * | 2015-04-27 | 2022-10-06 | Robert Bosch Gmbh | Seismisches Erfassungselement für einen mikromechanischen Sensor |
WO2017046866A1 (ja) * | 2015-09-15 | 2017-03-23 | 株式会社日立製作所 | 加速度センサ |
WO2017150201A1 (ja) * | 2016-03-03 | 2017-09-08 | セイコーエプソン株式会社 | センサーデバイス、電子機器、および移動体 |
WO2017188514A1 (ko) * | 2016-04-26 | 2017-11-02 | (주)스탠딩에그 | 오프셋 드리프트 특성이 개선된 mems 장치의 제조 방법, 상기 mems 장치를 포함하는 mems 패키지 및 컴퓨팅 시스템 |
JP6450983B2 (ja) * | 2017-06-01 | 2019-01-16 | セイコーエプソン株式会社 | センサー素子、電子機器、および移動体 |
JP6911645B2 (ja) | 2017-08-30 | 2021-07-28 | セイコーエプソン株式会社 | 物理量センサー、物理量センサーの製造方法、複合センサー、慣性計測ユニット、携帯型電子機器、電子機器及び移動体 |
US10759656B2 (en) * | 2017-09-29 | 2020-09-01 | Apple Inc. | MEMS sensor with dual pendulous proof masses |
DE102017219901B3 (de) * | 2017-11-09 | 2019-01-10 | Robert Bosch Gmbh | Mikromechanischer z-Inertialsensor |
DE102018211547A1 (de) * | 2018-07-11 | 2020-01-16 | Robert Bosch Gmbh | Mikromechanischer Sensor |
IT201900000190A1 (it) * | 2019-01-08 | 2020-07-08 | St Microelectronics Srl | Dispositivo mems con geometria ottimizzata per la riduzione dell'offset dovuto all'effetto radiometrico |
JP7383978B2 (ja) * | 2019-10-23 | 2023-11-21 | セイコーエプソン株式会社 | 物理量センサー、電子機器および移動体 |
JP7547847B2 (ja) | 2020-02-28 | 2024-09-10 | セイコーエプソン株式会社 | 物理量センサー、電子機器および移動体 |
DE102020211924A1 (de) * | 2020-09-23 | 2022-03-24 | Robert Bosch Gesellschaft mit beschränkter Haftung | Sensorbauelement mit einem mikroelektromechanischen z-Inertialsensor und Verfahren zum Ermitteln einer Beschleunigung mithilfe des mikroelektromechanischen z-Inertialsensors |
Family Cites Families (26)
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DE3611360A1 (de) | 1986-04-04 | 1987-10-08 | Bosch Gmbh Robert | Sensor zur selbsttaetigen ausloesung von insassenschutzvorrichtungen |
US5404749A (en) * | 1993-04-07 | 1995-04-11 | Ford Motor Company | Boron doped silicon accelerometer sense element |
DE19541388A1 (de) | 1995-11-07 | 1997-05-15 | Telefunken Microelectron | Mikromechanischer Beschleunigungssensor |
JP3307328B2 (ja) * | 1998-05-11 | 2002-07-24 | 株式会社デンソー | 半導体力学量センサ |
US6230566B1 (en) * | 1999-10-01 | 2001-05-15 | The Regents Of The University Of California | Micromachined low frequency rocking accelerometer with capacitive pickoff |
US6428713B1 (en) * | 1999-10-01 | 2002-08-06 | Delphi Technologies, Inc. | MEMS sensor structure and microfabrication process therefor |
US6571628B1 (en) * | 2000-10-16 | 2003-06-03 | Institute Of Microelectronics | Z-axis accelerometer |
DE60232250D1 (de) * | 2001-08-20 | 2009-06-18 | Honeywell Int Inc | Bogenförmige federelemente für mikro-elektromechanischen beschleunigungssensor |
US6955086B2 (en) * | 2001-11-19 | 2005-10-18 | Mitsubishi Denki Kabushiki Kaisha | Acceleration sensor |
US6666092B2 (en) * | 2002-02-28 | 2003-12-23 | Delphi Technologies, Inc. | Angular accelerometer having balanced inertia mass |
US7005193B2 (en) * | 2003-04-29 | 2006-02-28 | Motorola, Inc. | Method of adding mass to MEMS structures |
JP2005069852A (ja) * | 2003-08-25 | 2005-03-17 | Seiko Instruments Inc | 容量型力学量センサ |
US7059190B2 (en) * | 2003-10-08 | 2006-06-13 | Denso Corporation | Semiconductor dynamic sensor having variable capacitor formed on laminated substrate |
US6935175B2 (en) * | 2003-11-20 | 2005-08-30 | Honeywell International, Inc. | Capacitive pick-off and electrostatic rebalance accelerometer having equalized gas damping |
US7140250B2 (en) * | 2005-02-18 | 2006-11-28 | Honeywell International Inc. | MEMS teeter-totter accelerometer having reduced non-linearty |
FI119299B (fi) * | 2005-06-17 | 2008-09-30 | Vti Technologies Oy | Menetelmä kapasitiivisen kiihtyvyysanturin valmistamiseksi ja kapasitiivinen kiihtyvyysanturi |
EA012274B1 (ru) * | 2005-10-06 | 2009-08-28 | Текнолоджикал Ресорсиз Пти Лимитед | Гравитационный градиентометр |
CN101467050B (zh) * | 2006-06-08 | 2013-02-13 | 株式会社村田制作所 | 加速度传感器 |
JP5105949B2 (ja) * | 2007-04-27 | 2012-12-26 | キヤノン株式会社 | センサ |
US7578190B2 (en) * | 2007-08-03 | 2009-08-25 | Freescale Semiconductor, Inc. | Symmetrical differential capacitive sensor and method of making same |
DE102008002606B4 (de) * | 2008-06-24 | 2020-03-12 | Robert Bosch Gmbh | Mikromechanischer Beschleunigungssensor mit offener seismischer Masse |
US8020443B2 (en) * | 2008-10-30 | 2011-09-20 | Freescale Semiconductor, Inc. | Transducer with decoupled sensing in mutually orthogonal directions |
DE102008043788A1 (de) * | 2008-11-17 | 2010-05-20 | Robert Bosch Gmbh | Mikromechanisches Bauelement |
DE102009029248B4 (de) * | 2009-09-08 | 2022-12-15 | Robert Bosch Gmbh | Mikromechanisches System zum Erfassen einer Beschleunigung |
US8322216B2 (en) * | 2009-09-22 | 2012-12-04 | Duli Yu | Micromachined accelerometer with monolithic electrodes and method of making the same |
DE102010039069B4 (de) * | 2010-08-09 | 2023-08-24 | Robert Bosch Gmbh | Beschleunigungssensor mit einer Dämpfungseinrichtung |
-
2008
- 2008-11-17 DE DE102008043788A patent/DE102008043788A1/de active Pending
-
2009
- 2009-11-05 US US12/613,083 patent/US8806940B2/en active Active
- 2009-11-12 IT ITMI2009A001978A patent/IT1397181B1/it active
Also Published As
Publication number | Publication date |
---|---|
ITMI20091978A1 (it) | 2010-05-18 |
DE102008043788A1 (de) | 2010-05-20 |
US20100122578A1 (en) | 2010-05-20 |
US8806940B2 (en) | 2014-08-19 |
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