IT1400768B1 - Componente micromeccanico - Google Patents
Componente micromeccanicoInfo
- Publication number
- IT1400768B1 IT1400768B1 ITMI2010A001578A ITMI20101578A IT1400768B1 IT 1400768 B1 IT1400768 B1 IT 1400768B1 IT MI2010A001578 A ITMI2010A001578 A IT MI2010A001578A IT MI20101578 A ITMI20101578 A IT MI20101578A IT 1400768 B1 IT1400768 B1 IT 1400768B1
- Authority
- IT
- Italy
- Prior art keywords
- micromechanical component
- micromechanical
- component
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
- B81B3/0051—For defining the movement, i.e. structures that guide or limit the movement of an element
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/025—Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
- G01P2015/0831—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type having the pivot axis between the longitudinal ends of the mass, e.g. see-saw configuration
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009029095.8A DE102009029095B4 (de) | 2009-09-02 | 2009-09-02 | Mikromechanisches Bauelement |
Publications (2)
Publication Number | Publication Date |
---|---|
ITMI20101578A1 ITMI20101578A1 (it) | 2011-03-03 |
IT1400768B1 true IT1400768B1 (it) | 2013-07-02 |
Family
ID=43524834
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITMI2010A001578A IT1400768B1 (it) | 2009-09-02 | 2010-08-27 | Componente micromeccanico |
Country Status (3)
Country | Link |
---|---|
US (1) | US8671757B2 (it) |
DE (1) | DE102009029095B4 (it) |
IT (1) | IT1400768B1 (it) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8919199B2 (en) * | 2010-12-01 | 2014-12-30 | Analog Devices, Inc. | Apparatus and method for anchoring electrodes in MEMS devices |
JP2013117396A (ja) * | 2011-12-01 | 2013-06-13 | Denso Corp | 加速度センサ |
JP5999302B2 (ja) * | 2012-02-09 | 2016-09-28 | セイコーエプソン株式会社 | 電子デバイスおよびその製造方法、並びに電子機器 |
US8748999B2 (en) * | 2012-04-20 | 2014-06-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Capacitive sensors and methods for forming the same |
DE102012208032B4 (de) * | 2012-05-14 | 2023-09-28 | Robert Bosch Gmbh | Hybrid integriertes Bauteil mit MEMS-Bauelement und ASIC-Bauelement |
GB2506171B (en) * | 2012-09-24 | 2015-01-28 | Wolfson Microelectronics Plc | MEMS device and process |
DE102012219550B4 (de) * | 2012-10-25 | 2024-04-18 | Robert Bosch Gmbh | Hybrid integriertes Bauteil |
CN103063876B (zh) * | 2013-01-05 | 2014-08-20 | 中国科学院上海微系统与信息技术研究所 | 变面积型电容式横向加速度传感器及制备方法 |
US8692340B1 (en) * | 2013-03-13 | 2014-04-08 | Invensense, Inc. | MEMS acoustic sensor with integrated back cavity |
US9809448B2 (en) | 2013-03-13 | 2017-11-07 | Invensense, Inc. | Systems and apparatus having MEMS acoustic sensors and other MEMS sensors and methods of fabrication of the same |
US9213045B2 (en) * | 2013-05-23 | 2015-12-15 | Freescale Semiconductor, Inc. | Active lateral force stiction self-recovery for microelectromechanical systems devices |
DE102013222747A1 (de) * | 2013-11-08 | 2015-05-13 | Robert Bosch Gmbh | Mikromechanischer Z-Sensor |
US9599471B2 (en) | 2013-11-14 | 2017-03-21 | Analog Devices, Inc. | Dual use of a ring structure as gyroscope and accelerometer |
US9709595B2 (en) | 2013-11-14 | 2017-07-18 | Analog Devices, Inc. | Method and apparatus for detecting linear and rotational movement |
DE102014202816B4 (de) | 2014-02-17 | 2022-06-30 | Robert Bosch Gmbh | Wippeneinrichtung für einen mikromechanischen Z-Sensor |
DE102014002823B4 (de) * | 2014-02-25 | 2017-11-02 | Northrop Grumman Litef Gmbh | Mikromechanisches bauteil mit geteilter, galvanisch isolierter aktiver struktur und verfahren zum betreiben eines solchen bauteils |
JP6413463B2 (ja) * | 2014-08-15 | 2018-10-31 | セイコーエプソン株式会社 | 物理量センサー、物理量センサー装置、電子機器および移動体 |
US9810712B2 (en) | 2014-08-15 | 2017-11-07 | Seiko Epson Corporation | Physical quantity sensor, physical quantity sensor device, electronic equipment, and moving body |
JP6655281B2 (ja) * | 2014-08-19 | 2020-02-26 | セイコーエプソン株式会社 | 物理量センサー、電子機器および移動体 |
JP6464613B2 (ja) * | 2014-08-27 | 2019-02-06 | セイコーエプソン株式会社 | 物理量センサー、電子機器および移動体 |
US10746548B2 (en) | 2014-11-04 | 2020-08-18 | Analog Devices, Inc. | Ring gyroscope structural features |
EP3038126A1 (en) * | 2014-12-22 | 2016-06-29 | DelfMEMS SAS | MEMS structure with thick movable membrane |
US9638712B2 (en) * | 2015-01-22 | 2017-05-02 | Nxp Usa, Inc. | MEMS device with over-travel stop structure and method of fabrication |
US20170356929A1 (en) * | 2015-01-30 | 2017-12-14 | Goertek, Inc. | Z-axis structure of accelerometer and manufacturing method of z-axis structure |
US10858241B2 (en) * | 2015-04-09 | 2020-12-08 | Rensselaer Polytechnic Institute | Enhanced control of shuttle mass motion in MEMS devices |
US20170023606A1 (en) * | 2015-07-23 | 2017-01-26 | Freescale Semiconductor, Inc. | Mems device with flexible travel stops and method of fabrication |
DE102016203092A1 (de) * | 2015-11-10 | 2017-05-11 | Robert Bosch Gmbh | Beschleunigungssensor |
DE102017208357A1 (de) * | 2017-05-18 | 2018-11-22 | Robert Bosch Gmbh | Mikroelektromechanisches Bauelement |
DE102017208370A1 (de) * | 2017-05-18 | 2018-11-22 | Robert Bosch Gmbh | Mikromechanischer Sensor |
JP6922562B2 (ja) * | 2017-08-31 | 2021-08-18 | セイコーエプソン株式会社 | 物理量センサー、物理量センサーデバイス、携帯型電子機器、電子機器および移動体 |
DE102017216962A1 (de) * | 2017-09-25 | 2019-03-28 | Robert Bosch Gmbh | Mikromechanische Sensoranordnung |
DE102018222615B4 (de) * | 2018-12-20 | 2021-09-02 | Robert Bosch Gmbh | Bauelement mit einer optimierten mehrlagigen Torsionsfeder |
US11656077B2 (en) | 2019-01-31 | 2023-05-23 | Analog Devices, Inc. | Pseudo-extensional mode MEMS ring gyroscope |
IT201900009651A1 (it) * | 2019-06-20 | 2020-12-20 | St Microelectronics Srl | Sensore inerziale mems con elevata resistenza al fenomeno di adesione |
DE102020203425A1 (de) | 2020-03-17 | 2021-09-23 | Robert Bosch Gesellschaft mit beschränkter Haftung | Mikromechanisches Bauteil für eine Sensorvorrichtung |
US11499987B2 (en) * | 2020-06-17 | 2022-11-15 | Nxp Usa, Inc. | Z-axis inertial sensor with extended motion stops |
JP2022081956A (ja) * | 2020-11-20 | 2022-06-01 | セイコーエプソン株式会社 | 物理量センサー、物理量センサーデバイス及び慣性計測装置 |
JP2022175616A (ja) * | 2021-05-14 | 2022-11-25 | セイコーエプソン株式会社 | 慣性センサー及び慣性計測装置 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
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FR2700065B1 (fr) * | 1992-12-28 | 1995-02-10 | Commissariat Energie Atomique | Procédé de fabrication d'accéléromètres utilisant la technologie silicium sur isolant. |
JPH11237402A (ja) * | 1998-02-19 | 1999-08-31 | Akebono Brake Ind Co Ltd | 半導体加速度センサ及びその自己診断法 |
DE19817357B4 (de) | 1998-04-18 | 2008-10-30 | Robert Bosch Gmbh | Mikromechanisches Bauelement |
DE19930779B4 (de) * | 1999-07-03 | 2010-05-06 | Robert Bosch Gmbh | Mikromechanisches Bauelement |
DE19949605A1 (de) * | 1999-10-15 | 2001-04-19 | Bosch Gmbh Robert | Beschleunigungssensor |
DE10038099A1 (de) | 2000-08-04 | 2002-02-21 | Bosch Gmbh Robert | Mikromechanisches Bauelement |
DE10116931A1 (de) * | 2001-04-05 | 2002-10-17 | Bosch Gmbh Robert | Sensor |
US7232701B2 (en) | 2005-01-04 | 2007-06-19 | Freescale Semiconductor, Inc. | Microelectromechanical (MEM) device with a protective cap that functions as a motion stop |
US7121141B2 (en) | 2005-01-28 | 2006-10-17 | Freescale Semiconductor, Inc. | Z-axis accelerometer with at least two gap sizes and travel stops disposed outside an active capacitor area |
US7318349B2 (en) * | 2005-06-04 | 2008-01-15 | Vladimir Vaganov | Three-axis integrated MEMS accelerometer |
DE102006026880B4 (de) * | 2006-06-09 | 2023-02-16 | Robert Bosch Gmbh | Mikromechanischer Beschleunigungssensor |
KR100899812B1 (ko) * | 2006-12-05 | 2009-05-27 | 한국전자통신연구원 | 정전 용량형 가속도계 |
DE102006057929A1 (de) * | 2006-12-08 | 2008-06-12 | Robert Bosch Gmbh | Mikromechanischer Inertialsensor mit verringerter Empfindlichkeit gegenüber dem Einfluss driftender Oberflächenladungen und zu seinem Betrieb geeignetes Verfahren |
ITTO20070033A1 (it) | 2007-01-19 | 2008-07-20 | St Microelectronics Srl | Dispositivo microelettromeccanico ad asse z con struttura di arresto perfezionata |
US7578190B2 (en) * | 2007-08-03 | 2009-08-25 | Freescale Semiconductor, Inc. | Symmetrical differential capacitive sensor and method of making same |
US8079262B2 (en) * | 2007-10-26 | 2011-12-20 | Rosemount Aerospace Inc. | Pendulous accelerometer with balanced gas damping |
US8186221B2 (en) * | 2009-03-24 | 2012-05-29 | Freescale Semiconductor, Inc. | Vertically integrated MEMS acceleration transducer |
-
2009
- 2009-09-02 DE DE102009029095.8A patent/DE102009029095B4/de active Active
-
2010
- 2010-08-27 IT ITMI2010A001578A patent/IT1400768B1/it active
- 2010-08-31 US US12/872,596 patent/US8671757B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
ITMI20101578A1 (it) | 2011-03-03 |
DE102009029095B4 (de) | 2017-05-18 |
US8671757B2 (en) | 2014-03-18 |
DE102009029095A1 (de) | 2011-03-03 |
US20110048131A1 (en) | 2011-03-03 |
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