JP2012513682A - 電気複合構成部材または電子複合構成部材、および、電気複合構成部材または電子複合構成部材の製造方法 - Google Patents
電気複合構成部材または電子複合構成部材、および、電気複合構成部材または電子複合構成部材の製造方法 Download PDFInfo
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Abstract
Description
本発明の基礎となる課題は、電気複合構成部材または電子複合構成部材、ならびに、電気複合構成部材または電子複合構成部材の製造方法を提供し、接合時の断裂形成を回避できるようにすることである。なお、複合構成部材は低コストに製造でき、温度変化に対する耐性を有することが望ましい。
Claims (17)
- 第1接合部品(2)と少なくとも1つの第2接合部品(3)とを含む
電気複合構成部材または電子複合構成部材(1)において、
前記第1接合部品と前記第2接合部品とのあいだに、前記第1接合部品および前記第2接合部品の双方に固定に接続された、開放孔を有する第1焼結成形体(6;7)が収容されている
ことを特徴とする電気複合構成部材または電子複合構成部材。 - 前記第1焼結成形体(6;7)は、銀金属、例えば銀金属薄片から製造されているか、および/または、銀金属、例えば銀金属薄片を含む、請求項1記載の電気複合構成部材または電子複合構成部材。
- 前記第1接合部品および/または前記第2接合部品は、付加的な焼結ペーストなしで、前記第1焼結成形体に、直接に焼結されているか、または、例えばはんだペーストによってはんだ付けされているか、または、例えば超音波溶接によって溶接されているか、または、接着されている、請求項1または2記載の電気複合構成部材または電子複合構成部材。
- 前記第1接合部品は、エレクトロニクスモジュール、有利には半導体素子、特に有利にはパワー半導体素子であるか、または、回路支持体、有利には回路支持体のメタライゼーションであるか、または、打ち抜き板であるか、または、ボンディングワイヤないしはボンディング細線であるか、または、基板である、請求項1から3までのいずれか1項記載の電気複合構成部材または電子複合構成部材。
- 前記第2接合部品は、エレクトロニクスモジュール、有利には半導体素子、特に有利にはパワー半導体素子であるか、または、回路支持体、有利には回路支持体のメタライゼーションであるか、または、基板、有利には銅基板であるか、または、冷却体(5)である、請求項1から4までのいずれか1項記載の電気複合構成部材または電子複合構成部材。
- 前記第1接合部品と第3接合部品または第4接合部品とのあいだに第2焼結成形体(7;6)が収容されているか、および/または、前記第2接合部品と第3接合部品または第4接合部品とのあいだに第2焼結成形体(7;6)が収容されており、該第2焼結成形体は、有利には隣接する接合部品に焼結ペーストなしで直接に焼結されているかまたははんだ付けされているかまたは溶接されているかまたは接着されている、請求項1から5までのいずれか1項記載の電気複合構成部材または電子複合構成部材。
- 前記第3接合部品または前記第4接合部品は、エレクトロニクスモジュール、有利には半導体素子、特に有利にはパワー半導体素子であるか、または、回路支持体、有利には回路支持体のメタライゼーションであるか、または、基板、有利には銅基板であるか、または、冷却体(5)である、請求項6記載の電気複合構成部材または電子複合構成部材。
- 電気複合構成部材または電子複合構成部材の製造方法、有利には請求項1から7までのいずれか1項記載の電気複合構成部材または電子複合構成部材の製造方法において、
第1接合部品および第2接合部品(2,3)を、開放孔を有する第1焼結成形体(6)に固定に接続する
ことを特徴とする電気複合構成部材または電子複合構成部材の製造方法。 - 前記第1接合部品および前記第2接合部品を前記第1焼結成形体の2つの対向面に配置する、請求項8記載の電気複合構成部材または電子複合構成部材の製造方法。
- 前記第1接合部品および/または前記第2接合部品を、焼結ペーストなしで直接に、温度および/または圧力の作用のもとで、有利には共通の1回の焼結ステップにおいて、前記第1焼結成形体に焼結する、請求項8または9記載の電気複合構成部材または電子複合構成部材の製造方法。
- 前記第1接合部品および/または前記第2接合部品(2,3)を、例えばはんだペーストによって、前記第1焼結成形体にはんだ付けする、請求項8から10までのいずれか1項記載の電気複合構成部材または電子複合構成部材の製造方法。
- 前記はんだペースト、有利には付加的な融剤を、前記第1接合部品および/または前記第2接合部品および/または前記焼結成形体での接合の前に被着し、有利には印刷または塗布する、請求項11記載の電気複合構成部材または電子複合構成部材の製造方法。
- 前記第1接合部品および/または前記第2接合部品を、例えば補助材料(15)を用いてまたは補助材料(15)を用いずに、前記第1焼結成形体に溶接する、請求項8から12までのいずれか1項記載の電気複合構成部材または電子複合構成部材の製造方法。
- 前記第1接合部品および/または前記第2接合部品を、有利には超音波溶接により、例えば補助材料(15)を用いてまたは補助材料(15)を用いずに、前記焼結成形体に溶接する、請求項8から13までのいずれか1項記載の電気複合構成部材または電子複合構成部材の製造方法。
- 前記第1接合部品と第3接合部品または第4接合部品とのあいだに第2焼結成形体(7)を配置するか、および/または、前記第2接合部品と第3接合部品または第4接合部品とのあいだに第2焼結成形体(7)を配置し、該第2焼結成形体を、有利には隣接する接合部品に直接に焼結するかまたははんだ付けするかまたは溶接するかまたは接着する、請求項8から14までのいずれか1項記載の電気複合構成部材または電子複合構成部材の製造方法。
- 前記第2焼結成形体を前記第1接合部品または前記第2接合部品に、ならびに、前記第1焼結成形体を前記第1接合部品または前記第2接合部品に、共通のプロセスステップまたは別個のプロセスステップで、配置する、請求項15記載の電気複合構成部材または電子複合構成部材の製造方法。
- 1つの焼結体を複数の焼結成形体に個別化する、請求項8から16までのいずれか1項記載の電気複合構成部材または電子複合構成部材の製造方法。
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DE102008055134A DE102008055134A1 (de) | 2008-12-23 | 2008-12-23 | Elektrisches oder elektronisches Verbundbauteil sowie Verfahren zum Herstellen eines elektrischen oder elektronischen Verbundbauteils |
PCT/EP2009/066518 WO2010072555A1 (de) | 2008-12-23 | 2009-12-07 | Elektrisches oder elektronisches verbundbauteil sowie verfahren zum herstellen eines elektrischen oder elektronischen verbundbauteils |
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EP (1) | EP2382659A1 (ja) |
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JP2015504477A (ja) * | 2011-09-30 | 2015-02-12 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツングRobert Bosch Gmbh | 少なくとも一種の金属粉末から成る焼結可能な層及びはんだ層を含む層系と支持体シートとから成る層結合体 |
JP2016111083A (ja) * | 2014-12-03 | 2016-06-20 | 三菱電機株式会社 | パワーモジュール及びその製造方法 |
JP2020518456A (ja) * | 2017-04-25 | 2020-06-25 | シーメンス アクチエンゲゼルシヤフトSiemens Aktiengesellschaft | 拡散はんだ付けのためのはんだプリフォーム、その製造方法およびその組立方法 |
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AU2009331707A1 (en) | 2010-07-01 |
WO2010072555A1 (de) | 2010-07-01 |
US20110304985A1 (en) | 2011-12-15 |
DE102008055134A1 (de) | 2010-07-01 |
JP5602763B2 (ja) | 2014-10-08 |
EP2382659A1 (de) | 2011-11-02 |
CN102265393A (zh) | 2011-11-30 |
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