JP2012512757A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2012512757A5 JP2012512757A5 JP2011542526A JP2011542526A JP2012512757A5 JP 2012512757 A5 JP2012512757 A5 JP 2012512757A5 JP 2011542526 A JP2011542526 A JP 2011542526A JP 2011542526 A JP2011542526 A JP 2011542526A JP 2012512757 A5 JP2012512757 A5 JP 2012512757A5
- Authority
- JP
- Japan
- Prior art keywords
- composition
- substrate
- liquid carrier
- weight
- slicing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 8
- 239000007788 liquid Substances 0.000 claims 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 4
- 239000002562 thickening agent Substances 0.000 claims 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims 3
- 229920005862 polyol Polymers 0.000 claims 3
- 150000003077 polyols Chemical class 0.000 claims 3
- BNGXYYYYKUGPPF-UHFFFAOYSA-M (3-methylphenyl)methyl-triphenylphosphanium;chloride Chemical compound [Cl-].CC1=CC=CC(C[P+](C=2C=CC=CC=2)(C=2C=CC=CC=2)C=2C=CC=CC=2)=C1 BNGXYYYYKUGPPF-UHFFFAOYSA-M 0.000 claims 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 claims 2
- XMVBHZBLHNOQON-UHFFFAOYSA-N 2-butyl-1-octanol Chemical compound CCCCCCC(CO)CCCC XMVBHZBLHNOQON-UHFFFAOYSA-N 0.000 claims 2
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 claims 2
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 claims 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 2
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 claims 2
- 229910052921 ammonium sulfate Inorganic materials 0.000 claims 2
- 235000011130 ammonium sulphate Nutrition 0.000 claims 2
- 239000001110 calcium chloride Substances 0.000 claims 2
- 229910001628 calcium chloride Inorganic materials 0.000 claims 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 claims 2
- 239000007800 oxidant agent Substances 0.000 claims 2
- 229920000642 polymer Polymers 0.000 claims 2
- 150000003839 salts Chemical class 0.000 claims 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims 2
- 239000000377 silicon dioxide Substances 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- 239000002202 Polyethylene glycol Substances 0.000 claims 1
- 239000000654 additive Substances 0.000 claims 1
- 230000000996 additive effect Effects 0.000 claims 1
- 150000001298 alcohols Chemical class 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 125000004430 oxygen atom Chemical group O* 0.000 claims 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims 1
- 229920001223 polyethylene glycol Polymers 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US20314608P | 2008-12-20 | 2008-12-20 | |
| US61/203,146 | 2008-12-20 | ||
| PCT/US2009/068909 WO2010071870A2 (en) | 2008-12-20 | 2009-12-21 | Composition for improving dryness during wire sawing |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012512757A JP2012512757A (ja) | 2012-06-07 |
| JP2012512757A5 true JP2012512757A5 (https=) | 2012-07-19 |
| JP5600117B2 JP5600117B2 (ja) | 2014-10-01 |
Family
ID=42269291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011542526A Expired - Fee Related JP5600117B2 (ja) | 2008-12-20 | 2009-12-21 | ワイヤーソー切断の間の乾燥性を向上させるための組成物 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US8597538B2 (https=) |
| EP (1) | EP2377146A2 (https=) |
| JP (1) | JP5600117B2 (https=) |
| KR (1) | KR20110104066A (https=) |
| CN (1) | CN102257602A (https=) |
| IL (1) | IL213232A0 (https=) |
| MY (1) | MY152029A (https=) |
| SG (1) | SG172288A1 (https=) |
| TW (1) | TWI403575B (https=) |
| WO (1) | WO2010071870A2 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2011105255A1 (ja) * | 2010-02-26 | 2013-06-20 | 株式会社Sumco | 半導体ウェーハの製造方法 |
| JP6039935B2 (ja) * | 2012-06-29 | 2016-12-07 | 出光興産株式会社 | 水性加工液 |
| KR102040050B1 (ko) * | 2013-08-02 | 2019-11-05 | 동우 화인켐 주식회사 | 웨이퍼 다이싱용 세정제 조성물 |
| CN104194647B (zh) * | 2014-09-02 | 2016-04-06 | 蓝思科技股份有限公司 | 一种加工蓝宝石专用钻石研磨液和研磨膏及它们的制备方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4468339B1 (en) * | 1982-01-21 | 1989-05-16 | Aqueous compositions containing overbased materials | |
| JPS60141795A (ja) * | 1983-12-29 | 1985-07-26 | Sanyo Chem Ind Ltd | 難削材用の切削・研削油剤 |
| JP2894566B2 (ja) * | 1989-12-08 | 1999-05-24 | ユシロ化学工業株式会社 | 切断加工用油剤 |
| JP3347278B2 (ja) * | 1997-10-08 | 2002-11-20 | ユシロ化学工業株式会社 | 難燃性潤滑油組成物ならびにこれを用いた切削液および切断方法 |
| JP2000327838A (ja) * | 1999-05-18 | 2000-11-28 | Super Silicon Kenkyusho:Kk | ワイヤソー又はバンドソー用水性研削液 |
| JP2001164240A (ja) * | 1999-12-06 | 2001-06-19 | Ishii Hyoki Corp | 水性切削液 |
| JP2001303027A (ja) * | 2000-04-26 | 2001-10-31 | Seimi Chem Co Ltd | 研磨用組成物及び研磨方法 |
| JP2004051756A (ja) * | 2002-07-19 | 2004-02-19 | Sanyo Chem Ind Ltd | Ｃｍｐプロセス用研磨組成物 |
| JP4345357B2 (ja) * | 2003-05-27 | 2009-10-14 | 株式会社Ｓｕｍｃｏ | 半導体ウェーハの製造方法 |
| JP2005034986A (ja) * | 2003-06-27 | 2005-02-10 | Showa Denko Kk | 研磨用組成物とそれを用いた基板研磨方法 |
| JP2005193332A (ja) * | 2004-01-07 | 2005-07-21 | Tokyo Seiko Co Ltd | ソーワイヤ |
| JP2006096951A (ja) * | 2004-09-30 | 2006-04-13 | Kyodo Yushi Co Ltd | 水溶性切断加工用油剤、スラリー、及び切断加工方法 |
| JPWO2007123235A1 (ja) * | 2006-04-24 | 2009-09-10 | 日立化成工業株式会社 | Ｃｍｐ用研磨液及び研磨方法 |
| MX2009002368A (es) * | 2006-08-30 | 2009-04-24 | Saint Gobain Ceramics | Composiciones fluidas acuosas para suspensiones esoesas abrasivas, metodos de produccion y metodo de uso de las mismas. |
| JP5081435B2 (ja) * | 2006-11-22 | 2012-11-28 | 出光興産株式会社 | 一方向クラッチ内臓型回転伝達装置用グリース |
| CN102690607B (zh) * | 2007-02-27 | 2015-02-11 | 日立化成株式会社 | 金属用研磨液及其应用 |
| JP2008103690A (ja) * | 2007-08-24 | 2008-05-01 | Mitsubishi Electric Corp | シリコンインゴット切断用スラリー |
-
2009
- 2009-12-21 US US13/133,857 patent/US8597538B2/en not_active Expired - Fee Related
- 2009-12-21 EP EP20090833869 patent/EP2377146A2/en not_active Withdrawn
- 2009-12-21 WO PCT/US2009/068909 patent/WO2010071870A2/en not_active Ceased
- 2009-12-21 CN CN2009801511016A patent/CN102257602A/zh active Pending
- 2009-12-21 JP JP2011542526A patent/JP5600117B2/ja not_active Expired - Fee Related
- 2009-12-21 MY MYPI2011002877A patent/MY152029A/en unknown
- 2009-12-21 KR KR1020117016863A patent/KR20110104066A/ko not_active Ceased
- 2009-12-21 TW TW98143965A patent/TWI403575B/zh not_active IP Right Cessation
- 2009-12-21 SG SG2011045234A patent/SG172288A1/en unknown
-
2011
- 2011-05-30 IL IL213232A patent/IL213232A0/en unknown
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI629325B (zh) | 鈷凹陷控制劑 | |
| JP6099067B1 (ja) | 研磨用組成物 | |
| KR102589681B1 (ko) | 연마용 조성물 및 연마 방법 | |
| CN107148457B (zh) | 钴抛光促进剂 | |
| JP5384037B2 (ja) | サファイア基板用研磨液組成物、及びサファイア基板の研磨方法 | |
| JP2012512757A5 (https=) | ||
| JP2015201644A5 (https=) | ||
| JP2012511251A5 (https=) | ||
| JP2009540575A5 (https=) | ||
| JP2011192995A5 (https=) | ||
| JP2011012249A (ja) | 水性切削液及び水性切削剤 | |
| KR20150118902A (ko) | 연마용 조성물 | |
| JP5698147B2 (ja) | ワイヤーソー切断のための切断用流体組成物 | |
| JP2011205096A5 (https=) | ||
| KR20160136229A (ko) | 연마 조성물, 및 그 연마 조성물을 사용한 연마 방법 | |
| TW201113357A (en) | Aqueous cutting fluid and aqueous cutting agent | |
| CN106398807A (zh) | 一种用于切割硅晶片的金刚线切割液 | |
| JP2006096951A (ja) | 水溶性切断加工用油剤、スラリー、及び切断加工方法 | |
| JP5736430B2 (ja) | サファイア基板用研磨液組成物、及びサファイア基板の研磨方法 | |
| JP2011082512A5 (https=) | ||
| JP2011205097A5 (https=) | ||
| JP2009079083A (ja) | 遊離砥粒ワイヤソー用水溶性加工油剤 | |
| TW201424933A (zh) | 硏磨方法及合金材料的製造方法 | |
| JP2012206183A (ja) | 研摩スラリー及びその研摩方法 | |
| JP2009510773A5 (https=) |