JP5600117B2 - ワイヤーソー切断の間の乾燥性を向上させるための組成物 - Google Patents

ワイヤーソー切断の間の乾燥性を向上させるための組成物 Download PDF

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Publication number
JP5600117B2
JP5600117B2 JP2011542526A JP2011542526A JP5600117B2 JP 5600117 B2 JP5600117 B2 JP 5600117B2 JP 2011542526 A JP2011542526 A JP 2011542526A JP 2011542526 A JP2011542526 A JP 2011542526A JP 5600117 B2 JP5600117 B2 JP 5600117B2
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JP
Japan
Prior art keywords
composition
weight
liquid carrier
substrate
abrasive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011542526A
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English (en)
Japanese (ja)
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JP2012512757A (ja
JP2012512757A5 (https=
Inventor
ナギブ ネビン
グラムバイン スティーブン
メッゲンボーグ ケビン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials LLC
Original Assignee
Cabot Microelectronics Corp
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Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
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Application granted granted Critical
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Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0405—With preparatory or simultaneous ancillary treatment of work
    • Y10T83/0443—By fluid application

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2011542526A 2008-12-20 2009-12-21 ワイヤーソー切断の間の乾燥性を向上させるための組成物 Expired - Fee Related JP5600117B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US20314608P 2008-12-20 2008-12-20
US61/203,146 2008-12-20
PCT/US2009/068909 WO2010071870A2 (en) 2008-12-20 2009-12-21 Composition for improving dryness during wire sawing

Publications (3)

Publication Number Publication Date
JP2012512757A JP2012512757A (ja) 2012-06-07
JP2012512757A5 JP2012512757A5 (https=) 2012-07-19
JP5600117B2 true JP5600117B2 (ja) 2014-10-01

Family

ID=42269291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011542526A Expired - Fee Related JP5600117B2 (ja) 2008-12-20 2009-12-21 ワイヤーソー切断の間の乾燥性を向上させるための組成物

Country Status (10)

Country Link
US (1) US8597538B2 (https=)
EP (1) EP2377146A2 (https=)
JP (1) JP5600117B2 (https=)
KR (1) KR20110104066A (https=)
CN (1) CN102257602A (https=)
IL (1) IL213232A0 (https=)
MY (1) MY152029A (https=)
SG (1) SG172288A1 (https=)
TW (1) TWI403575B (https=)
WO (1) WO2010071870A2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2011105255A1 (ja) * 2010-02-26 2013-06-20 株式会社Sumco 半導体ウェーハの製造方法
JP6039935B2 (ja) * 2012-06-29 2016-12-07 出光興産株式会社 水性加工液
KR102040050B1 (ko) * 2013-08-02 2019-11-05 동우 화인켐 주식회사 웨이퍼 다이싱용 세정제 조성물
CN104194647B (zh) * 2014-09-02 2016-04-06 蓝思科技股份有限公司 一种加工蓝宝石专用钻石研磨液和研磨膏及它们的制备方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4468339B1 (en) * 1982-01-21 1989-05-16 Aqueous compositions containing overbased materials
JPS60141795A (ja) * 1983-12-29 1985-07-26 Sanyo Chem Ind Ltd 難削材用の切削・研削油剤
JP2894566B2 (ja) * 1989-12-08 1999-05-24 ユシロ化学工業株式会社 切断加工用油剤
JP3347278B2 (ja) * 1997-10-08 2002-11-20 ユシロ化学工業株式会社 難燃性潤滑油組成物ならびにこれを用いた切削液および切断方法
JP2000327838A (ja) * 1999-05-18 2000-11-28 Super Silicon Kenkyusho:Kk ワイヤソー又はバンドソー用水性研削液
JP2001164240A (ja) * 1999-12-06 2001-06-19 Ishii Hyoki Corp 水性切削液
JP2001303027A (ja) * 2000-04-26 2001-10-31 Seimi Chem Co Ltd 研磨用組成物及び研磨方法
JP2004051756A (ja) * 2002-07-19 2004-02-19 Sanyo Chem Ind Ltd Ｃｍｐプロセス用研磨組成物
JP4345357B2 (ja) * 2003-05-27 2009-10-14 株式会社Ｓｕｍｃｏ 半導体ウェーハの製造方法
JP2005034986A (ja) * 2003-06-27 2005-02-10 Showa Denko Kk 研磨用組成物とそれを用いた基板研磨方法
JP2005193332A (ja) * 2004-01-07 2005-07-21 Tokyo Seiko Co Ltd ソーワイヤ
JP2006096951A (ja) * 2004-09-30 2006-04-13 Kyodo Yushi Co Ltd 水溶性切断加工用油剤、スラリー、及び切断加工方法
JPWO2007123235A1 (ja) * 2006-04-24 2009-09-10 日立化成工業株式会社 Ｃｍｐ用研磨液及び研磨方法
MX2009002368A (es) * 2006-08-30 2009-04-24 Saint Gobain Ceramics Composiciones fluidas acuosas para suspensiones esoesas abrasivas, metodos de produccion y metodo de uso de las mismas.
JP5081435B2 (ja) * 2006-11-22 2012-11-28 出光興産株式会社 一方向クラッチ内臓型回転伝達装置用グリース
CN102690607B (zh) * 2007-02-27 2015-02-11 日立化成株式会社 金属用研磨液及其应用
JP2008103690A (ja) * 2007-08-24 2008-05-01 Mitsubishi Electric Corp シリコンインゴット切断用スラリー

Also Published As

Publication number Publication date
KR20110104066A (ko) 2011-09-21
JP2012512757A (ja) 2012-06-07
SG172288A1 (en) 2011-07-28
CN102257602A (zh) 2011-11-23
IL213232A0 (en) 2011-07-31
WO2010071870A2 (en) 2010-06-24
TWI403575B (zh) 2013-08-01
EP2377146A2 (en) 2011-10-19
MY152029A (en) 2014-08-15
TW201033342A (en) 2010-09-16
US8597538B2 (en) 2013-12-03
US20110239836A1 (en) 2011-10-06
WO2010071870A3 (en) 2010-09-10

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