JP2012238848A5 - - Google Patents

Download PDF

Info

Publication number
JP2012238848A5
JP2012238848A5 JP2012095055A JP2012095055A JP2012238848A5 JP 2012238848 A5 JP2012238848 A5 JP 2012238848A5 JP 2012095055 A JP2012095055 A JP 2012095055A JP 2012095055 A JP2012095055 A JP 2012095055A JP 2012238848 A5 JP2012238848 A5 JP 2012238848A5
Authority
JP
Japan
Prior art keywords
signal transmission
layer
circuit board
board according
vias
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012095055A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012238848A (ja
JP5887537B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012095055A priority Critical patent/JP5887537B2/ja
Priority claimed from JP2012095055A external-priority patent/JP5887537B2/ja
Publication of JP2012238848A publication Critical patent/JP2012238848A/ja
Publication of JP2012238848A5 publication Critical patent/JP2012238848A5/ja
Application granted granted Critical
Publication of JP5887537B2 publication Critical patent/JP5887537B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012095055A 2011-04-25 2012-04-18 回路基板 Active JP5887537B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012095055A JP5887537B2 (ja) 2011-04-25 2012-04-18 回路基板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011097479 2011-04-25
JP2011097479 2011-04-25
JP2012095055A JP5887537B2 (ja) 2011-04-25 2012-04-18 回路基板

Publications (3)

Publication Number Publication Date
JP2012238848A JP2012238848A (ja) 2012-12-06
JP2012238848A5 true JP2012238848A5 (enExample) 2014-10-30
JP5887537B2 JP5887537B2 (ja) 2016-03-16

Family

ID=47360769

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012095055A Active JP5887537B2 (ja) 2011-04-25 2012-04-18 回路基板

Country Status (2)

Country Link
US (1) US8822831B2 (enExample)
JP (1) JP5887537B2 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5216147B2 (ja) * 2011-03-08 2013-06-19 日本オクラロ株式会社 差動伝送回路、光送受信モジュール、及び情報処理装置
CN102811549A (zh) * 2011-06-03 2012-12-05 鸿富锦精密工业（深圳）有限公司 电路板
US9232653B2 (en) * 2011-12-28 2016-01-05 Panasonic Intellectual Property Management Co., Ltd. Multilayer wiring board
TWI449475B (zh) * 2012-01-09 2014-08-11 Novatek Microelectronics Corp 電路板
US9338879B2 (en) * 2014-07-17 2016-05-10 Via Technologies, Inc. Through-hole layout structure including first and second pairs of differential signal through-holes disposed between three ground through-holes
US9276549B1 (en) * 2014-09-12 2016-03-01 ScienBiziP Consulting(Shenzhen)Co., Ltd. Via system of printed circuit board and method of making same
US9936571B2 (en) * 2015-09-02 2018-04-03 Sae Magnetics (H.K.) Ltd. Printed circuit board
CN106653819B (zh) * 2017-02-17 2020-02-14 京东方科技集团股份有限公司 阵列基板和显示装置
US20190164891A1 (en) * 2017-11-27 2019-05-30 Finisar Corporation Tunable differential via circuit
US10410683B2 (en) * 2017-12-14 2019-09-10 Seagate Technology Llc Tightly coupled differential vias
KR20190073786A (ko) 2017-12-19 2019-06-27 삼성전자주식회사 인쇄회로기판, 이를 포함하는 메모리 모듈 및 메모리 시스템
JP7061459B2 (ja) * 2017-12-25 2022-04-28 日本航空電子工業株式会社 回路基板、コネクタ組立体及びケーブルハーネス
CN112512208B (zh) * 2019-09-16 2024-11-12 中兴通讯股份有限公司 一种电路板
CN113873740A (zh) * 2020-06-30 2021-12-31 昆山展腾电子科技有限公司 传输线结构
JP7770421B2 (ja) * 2021-11-30 2025-11-14 京セラ株式会社 配線基板、電子装置及び電子モジュール
TWI855707B (zh) * 2023-05-26 2024-09-11 欣興電子股份有限公司 電路板裝置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4624440B2 (ja) 1998-10-16 2011-02-02 パナソニック株式会社 多層回路基板、その製造方法、および、その特性インピーダンス調整方法
US6778043B2 (en) * 2001-12-19 2004-08-17 Maxxan Systems, Inc. Method and apparatus for adding inductance to printed circuits
JP2003273525A (ja) * 2002-03-15 2003-09-26 Kyocera Corp 配線基板
US7583513B2 (en) * 2003-09-23 2009-09-01 Intel Corporation Apparatus for providing an integrated printed circuit board registration coupon
KR20050072881A (ko) 2004-01-07 2005-07-12 삼성전자주식회사 임피던스 정합 비아 홀을 구비하는 다층기판
JP2006049645A (ja) * 2004-08-05 2006-02-16 Ngk Spark Plug Co Ltd 配線基板
JP2010212439A (ja) 2009-03-10 2010-09-24 Sumitomo Bakelite Co Ltd 回路基板
JP5445011B2 (ja) * 2009-08-07 2014-03-19 住友電気工業株式会社 回路基板

Similar Documents

Publication Publication Date Title
JP2012238848A5 (enExample)
JP5887537B2 (ja) 回路基板
JP6252699B2 (ja) 伝送線路およびフラットケーブル
JP6540847B2 (ja) 伝送線路および電子機器
JP5999239B2 (ja) 信号伝送部品および電子機器
JP5796256B2 (ja) フレキシブルフラットケーブル
JP2010027654A (ja) 配線基板、配線基板のビア形成方法、及び配線基板の製造方法
TW201401304A (zh) 複合式軟性電路排線
JP2015005744A (ja) フレキシブル回路板の差動モード信号伝送線のための減衰低減用接地構造体
JP2016092561A (ja) 伝送線路およびフラットケーブル
JP4414365B2 (ja) 高速伝送用基板
US9565750B2 (en) Wiring board for mounting a semiconductor element
CN102740583A (zh) 电路板
JP6187011B2 (ja) プリント回路基板
JP2012033529A (ja) 配線基板
JP2017050429A (ja) 信号配線基板
US10842018B2 (en) Interlayer transmission line
JP2006080239A (ja) 積層型高周波回路基板
TWI476788B (zh) Flexible standard cable and circuit board integrated cable structure
JP2014127502A (ja) 高周波部品
JP2011114263A (ja) 配線基板
TWM550960U (zh) 軟性印刷電路板
JP2014175829A (ja) 伝送線路、アンテナ装置及び伝送線路製造方法
US9236847B2 (en) Common mode filter
WO2015186537A1 (ja) 伝送線路部材