JP5887537B2 - 回路基板 - Google Patents

回路基板 Download PDF

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Publication number
JP5887537B2
JP5887537B2 JP2012095055A JP2012095055A JP5887537B2 JP 5887537 B2 JP5887537 B2 JP 5887537B2 JP 2012095055 A JP2012095055 A JP 2012095055A JP 2012095055 A JP2012095055 A JP 2012095055A JP 5887537 B2 JP5887537 B2 JP 5887537B2
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JP
Japan
Prior art keywords
signal transmission
layer
circuit board
ground layer
region
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JP2012095055A
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English (en)
Japanese (ja)
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JP2012238848A (ja
JP2012238848A5 (enExample
Inventor
有一 横山
有一 横山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Priority to JP2012095055A priority Critical patent/JP5887537B2/ja
Publication of JP2012238848A publication Critical patent/JP2012238848A/ja
Publication of JP2012238848A5 publication Critical patent/JP2012238848A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
JP2012095055A 2011-04-25 2012-04-18 回路基板 Active JP5887537B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012095055A JP5887537B2 (ja) 2011-04-25 2012-04-18 回路基板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011097479 2011-04-25
JP2011097479 2011-04-25
JP2012095055A JP5887537B2 (ja) 2011-04-25 2012-04-18 回路基板

Publications (3)

Publication Number Publication Date
JP2012238848A JP2012238848A (ja) 2012-12-06
JP2012238848A5 JP2012238848A5 (enExample) 2014-10-30
JP5887537B2 true JP5887537B2 (ja) 2016-03-16

Family

ID=47360769

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012095055A Active JP5887537B2 (ja) 2011-04-25 2012-04-18 回路基板

Country Status (2)

Country Link
US (1) US8822831B2 (enExample)
JP (1) JP5887537B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2013099286A1 (ja) * 2011-12-28 2015-04-30 パナソニックＩｐマネジメント株式会社 多層配線基板

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5216147B2 (ja) * 2011-03-08 2013-06-19 日本オクラロ株式会社 差動伝送回路、光送受信モジュール、及び情報処理装置
CN102811549A (zh) * 2011-06-03 2012-12-05 鸿富锦精密工业（深圳）有限公司 电路板
TWI449475B (zh) * 2012-01-09 2014-08-11 Novatek Microelectronics Corp 電路板
US9338879B2 (en) * 2014-07-17 2016-05-10 Via Technologies, Inc. Through-hole layout structure including first and second pairs of differential signal through-holes disposed between three ground through-holes
US9276549B1 (en) * 2014-09-12 2016-03-01 ScienBiziP Consulting(Shenzhen)Co., Ltd. Via system of printed circuit board and method of making same
US9936571B2 (en) * 2015-09-02 2018-04-03 Sae Magnetics (H.K.) Ltd. Printed circuit board
CN106653819B (zh) * 2017-02-17 2020-02-14 京东方科技集团股份有限公司 阵列基板和显示装置
US20190164891A1 (en) * 2017-11-27 2019-05-30 Finisar Corporation Tunable differential via circuit
US10410683B2 (en) * 2017-12-14 2019-09-10 Seagate Technology Llc Tightly coupled differential vias
KR20190073786A (ko) 2017-12-19 2019-06-27 삼성전자주식회사 인쇄회로기판, 이를 포함하는 메모리 모듈 및 메모리 시스템
JP7061459B2 (ja) * 2017-12-25 2022-04-28 日本航空電子工業株式会社 回路基板、コネクタ組立体及びケーブルハーネス
CN112512208B (zh) * 2019-09-16 2024-11-12 中兴通讯股份有限公司 一种电路板
CN113873740A (zh) * 2020-06-30 2021-12-31 昆山展腾电子科技有限公司 传输线结构
JP7770421B2 (ja) * 2021-11-30 2025-11-14 京セラ株式会社 配線基板、電子装置及び電子モジュール
TWI855707B (zh) * 2023-05-26 2024-09-11 欣興電子股份有限公司 電路板裝置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4624440B2 (ja) 1998-10-16 2011-02-02 パナソニック株式会社 多層回路基板、その製造方法、および、その特性インピーダンス調整方法
US6778043B2 (en) * 2001-12-19 2004-08-17 Maxxan Systems, Inc. Method and apparatus for adding inductance to printed circuits
JP2003273525A (ja) * 2002-03-15 2003-09-26 Kyocera Corp 配線基板
US7583513B2 (en) * 2003-09-23 2009-09-01 Intel Corporation Apparatus for providing an integrated printed circuit board registration coupon
KR20050072881A (ko) 2004-01-07 2005-07-12 삼성전자주식회사 임피던스 정합 비아 홀을 구비하는 다층기판
JP2006049645A (ja) * 2004-08-05 2006-02-16 Ngk Spark Plug Co Ltd 配線基板
JP2010212439A (ja) 2009-03-10 2010-09-24 Sumitomo Bakelite Co Ltd 回路基板
JP5445011B2 (ja) * 2009-08-07 2014-03-19 住友電気工業株式会社 回路基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2013099286A1 (ja) * 2011-12-28 2015-04-30 パナソニックＩｐマネジメント株式会社 多層配線基板

Also Published As

Publication number Publication date
US20120325542A1 (en) 2012-12-27
JP2012238848A (ja) 2012-12-06
US8822831B2 (en) 2014-09-02

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