JP2012233153A5 - - Google Patents
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- Publication number
- JP2012233153A5 JP2012233153A5 JP2012034100A JP2012034100A JP2012233153A5 JP 2012233153 A5 JP2012233153 A5 JP 2012233153A5 JP 2012034100 A JP2012034100 A JP 2012034100A JP 2012034100 A JP2012034100 A JP 2012034100A JP 2012233153 A5 JP2012233153 A5 JP 2012233153A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- integer
- polysiloxane
- mol
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- -1 polysiloxane Polymers 0.000 claims description 64
- 229920001296 polysiloxane Polymers 0.000 claims description 60
- 125000003342 alkenyl group Chemical group 0.000 claims description 28
- 239000000203 mixture Substances 0.000 claims description 26
- 125000003700 epoxy group Chemical group 0.000 claims description 23
- 239000000126 substance Substances 0.000 claims description 15
- 125000004429 atom Chemical group 0.000 claims description 14
- 125000003118 aryl group Chemical group 0.000 claims description 9
- 239000000853 adhesive Chemical group 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 125000000217 alkyl group Chemical group 0.000 claims description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 7
- 125000004432 carbon atom Chemical group C* 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 114
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 49
- 238000010992 reflux Methods 0.000 description 29
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 27
- 230000015572 biosynthetic process Effects 0.000 description 20
- 238000003786 synthesis reaction Methods 0.000 description 20
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 18
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 18
- 238000006243 chemical reaction Methods 0.000 description 13
- 238000001816 cooling Methods 0.000 description 11
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 10
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 10
- 238000005227 gel permeation chromatography Methods 0.000 description 9
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 9
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 8
- 239000004793 Polystyrene Substances 0.000 description 8
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 8
- 229920002223 polystyrene Polymers 0.000 description 8
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 7
- 239000003054 catalyst Substances 0.000 description 6
- 230000018044 dehydration Effects 0.000 description 6
- 238000006297 dehydration reaction Methods 0.000 description 6
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 5
- 150000002430 hydrocarbons Chemical group 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 235000011187 glycerol Nutrition 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 2
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 2
- KWEKXPWNFQBJAY-UHFFFAOYSA-N (dimethyl-$l^{3}-silanyl)oxy-dimethylsilicon Chemical compound C[Si](C)O[Si](C)C KWEKXPWNFQBJAY-UHFFFAOYSA-N 0.000 description 1
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- PKTOVQRKCNPVKY-UHFFFAOYSA-N dimethoxy(methyl)silicon Chemical compound CO[Si](C)OC PKTOVQRKCNPVKY-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000005246 nonafluorobutyl group Chemical group FC(F)(F)C(F)(F)C(F)(F)C(F)(F)* 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 description 1
- 229910001950 potassium oxide Inorganic materials 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012034100A JP5505436B2 (ja) | 2011-04-21 | 2012-02-20 | 硬化性組成物、硬化物、光半導体装置およびポリシロキサン |
| KR1020120034311A KR101472829B1 (ko) | 2011-04-21 | 2012-04-03 | 경화성 조성물, 경화물, 광반도체 장치 및 폴리실록산 |
| TW101114054A TWI499644B (zh) | 2011-04-21 | 2012-04-20 | 硬化性組成物、硬化物以及光半導體裝置 |
| CN201210129278.XA CN102757650B (zh) | 2011-04-21 | 2012-04-20 | 固化性组合物、固化物、光半导体装置以及聚硅氧烷 |
| TW104108949A TW201525073A (zh) | 2011-04-21 | 2012-04-20 | 聚矽氧烷 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011094922 | 2011-04-21 | ||
| JP2011094922 | 2011-04-21 | ||
| JP2012034100A JP5505436B2 (ja) | 2011-04-21 | 2012-02-20 | 硬化性組成物、硬化物、光半導体装置およびポリシロキサン |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014012162A Division JP5696798B2 (ja) | 2011-04-21 | 2014-01-27 | ポリシロキサン |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012233153A JP2012233153A (ja) | 2012-11-29 |
| JP2012233153A5 true JP2012233153A5 (enExample) | 2013-07-11 |
| JP5505436B2 JP5505436B2 (ja) | 2014-05-28 |
Family
ID=47433784
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012034100A Expired - Fee Related JP5505436B2 (ja) | 2011-04-21 | 2012-02-20 | 硬化性組成物、硬化物、光半導体装置およびポリシロキサン |
| JP2014012162A Expired - Fee Related JP5696798B2 (ja) | 2011-04-21 | 2014-01-27 | ポリシロキサン |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014012162A Expired - Fee Related JP5696798B2 (ja) | 2011-04-21 | 2014-01-27 | ポリシロキサン |
Country Status (2)
| Country | Link |
|---|---|
| JP (2) | JP5505436B2 (enExample) |
| TW (2) | TW201525073A (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101556274B1 (ko) | 2012-12-28 | 2015-09-30 | 제일모직 주식회사 | 봉지재 조성물, 봉지재 및 전자 소자 |
| KR102165826B1 (ko) | 2016-08-12 | 2020-10-15 | 와커 헤미 아게 | 경화성 오르가노폴리실록산 조성물, 캡슐화제 및 반도체 장치 |
| KR102625363B1 (ko) * | 2017-07-24 | 2024-01-17 | 다우 도레이 캄파니 리미티드 | 다성분 경화형 열전도성 실리콘 겔 조성물, 열전도성 부재 및 방열 구조체 |
| JP7574543B2 (ja) * | 2020-03-31 | 2024-10-29 | 三菱ケミカル株式会社 | 樹脂組成物、電子機器用部材、樹脂添加剤、及び樹脂添加用オルガノポリシロキサン組成物 |
| JP7574544B2 (ja) * | 2020-03-31 | 2024-10-29 | 三菱ケミカル株式会社 | 樹脂組成物、電子機器用部材、樹脂添加剤、及び、樹脂添加用オルガノポリシロキサン組成物 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH062821B2 (ja) * | 1989-11-28 | 1994-01-12 | 信越化学工業株式会社 | エポキシ基含有シリコーンエラストマー微粉末の製造方法及びその方法により製造された微粉末 |
| JP3469327B2 (ja) * | 1994-08-03 | 2003-11-25 | 信越化学工業株式会社 | オルガノポリシロキサンの製造方法 |
| JP2003192790A (ja) * | 2001-12-27 | 2003-07-09 | Dow Corning Toray Silicone Co Ltd | ラジカル重合性オルガノポリシロキサン混合物およびその製造方法 |
| JP5060074B2 (ja) * | 2006-05-11 | 2012-10-31 | 東レ・ダウコーニング株式会社 | 接着促進剤、硬化性オルガノポリシロキサン組成物、および半導体装置 |
| JP4862032B2 (ja) * | 2008-12-05 | 2012-01-25 | 信越化学工業株式会社 | 高屈折率を有する硬化物を与える付加硬化型シリコーン組成物、及び該組成物からなる光学素子封止材 |
| JP4913858B2 (ja) * | 2009-04-14 | 2012-04-11 | 日東電工株式会社 | 熱硬化性シリコーン樹脂用組成物 |
| JP2011057755A (ja) * | 2009-09-07 | 2011-03-24 | Shin-Etsu Chemical Co Ltd | シリコーン組成物及びその硬化物 |
-
2012
- 2012-02-20 JP JP2012034100A patent/JP5505436B2/ja not_active Expired - Fee Related
- 2012-04-20 TW TW104108949A patent/TW201525073A/zh unknown
- 2012-04-20 TW TW101114054A patent/TWI499644B/zh not_active IP Right Cessation
-
2014
- 2014-01-27 JP JP2014012162A patent/JP5696798B2/ja not_active Expired - Fee Related
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