TWI499644B - 硬化性組成物、硬化物以及光半導體裝置 - Google Patents

硬化性組成物、硬化物以及光半導體裝置 Download PDF

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Publication number
TWI499644B
TWI499644B TW101114054A TW101114054A TWI499644B TW I499644 B TWI499644 B TW I499644B TW 101114054 A TW101114054 A TW 101114054A TW 101114054 A TW101114054 A TW 101114054A TW I499644 B TWI499644 B TW I499644B
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TW
Taiwan
Prior art keywords
group
polyoxyalkylene
integer
mol
sio
Prior art date
Application number
TW101114054A
Other languages
English (en)
Chinese (zh)
Other versions
TW201247785A (en
Inventor
中西康二
田崎太一
長谷川公一
Original Assignee
Jsr股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr股份有限公司 filed Critical Jsr股份有限公司
Publication of TW201247785A publication Critical patent/TW201247785A/zh
Application granted granted Critical
Publication of TWI499644B publication Critical patent/TWI499644B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
TW101114054A 2011-04-21 2012-04-20 硬化性組成物、硬化物以及光半導體裝置 TWI499644B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011094922 2011-04-21
JP2012034100A JP5505436B2 (ja) 2011-04-21 2012-02-20 硬化性組成物、硬化物、光半導体装置およびポリシロキサン

Publications (2)

Publication Number Publication Date
TW201247785A TW201247785A (en) 2012-12-01
TWI499644B true TWI499644B (zh) 2015-09-11

Family

ID=47433784

Family Applications (2)

Application Number Title Priority Date Filing Date
TW101114054A TWI499644B (zh) 2011-04-21 2012-04-20 硬化性組成物、硬化物以及光半導體裝置
TW104108949A TW201525073A (zh) 2011-04-21 2012-04-20 聚矽氧烷

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW104108949A TW201525073A (zh) 2011-04-21 2012-04-20 聚矽氧烷

Country Status (2)

Country Link
JP (2) JP5505436B2 (enExample)
TW (2) TWI499644B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101556274B1 (ko) 2012-12-28 2015-09-30 제일모직 주식회사 봉지재 조성물, 봉지재 및 전자 소자
US11028266B2 (en) 2016-08-12 2021-06-08 Wacker Chemie Ag Curable organopolysiloxane composition, encapsulant and semiconductor device
KR102625363B1 (ko) * 2017-07-24 2024-01-17 다우 도레이 캄파니 리미티드 다성분 경화형 열전도성 실리콘 겔 조성물, 열전도성 부재 및 방열 구조체
JP7574543B2 (ja) * 2020-03-31 2024-10-29 三菱ケミカル株式会社 樹脂組成物、電子機器用部材、樹脂添加剤、及び樹脂添加用オルガノポリシロキサン組成物
JP7574544B2 (ja) * 2020-03-31 2024-10-29 三菱ケミカル株式会社 樹脂組成物、電子機器用部材、樹脂添加剤、及び、樹脂添加用オルガノポリシロキサン組成物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03167228A (ja) * 1989-11-28 1991-07-19 Shin Etsu Chem Co Ltd エポキシ基含有シリコーンエラストマー微粉末の製造方法及びその方法により製造された微粉末
TW201035173A (en) * 2008-12-05 2010-10-01 Shinetsu Chemical Co Addition curable silicone composition for producing cured product having high refractive index, and sealing material for optical device comprising the composition
JP2010265437A (ja) * 2009-04-14 2010-11-25 Nitto Denko Corp 熱硬化性シリコーン樹脂用組成物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3469327B2 (ja) * 1994-08-03 2003-11-25 信越化学工業株式会社 オルガノポリシロキサンの製造方法
JP2003192790A (ja) * 2001-12-27 2003-07-09 Dow Corning Toray Silicone Co Ltd ラジカル重合性オルガノポリシロキサン混合物およびその製造方法
JP5060074B2 (ja) * 2006-05-11 2012-10-31 東レ・ダウコーニング株式会社 接着促進剤、硬化性オルガノポリシロキサン組成物、および半導体装置
JP2011057755A (ja) * 2009-09-07 2011-03-24 Shin-Etsu Chemical Co Ltd シリコーン組成物及びその硬化物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03167228A (ja) * 1989-11-28 1991-07-19 Shin Etsu Chem Co Ltd エポキシ基含有シリコーンエラストマー微粉末の製造方法及びその方法により製造された微粉末
TW201035173A (en) * 2008-12-05 2010-10-01 Shinetsu Chemical Co Addition curable silicone composition for producing cured product having high refractive index, and sealing material for optical device comprising the composition
JP2010265437A (ja) * 2009-04-14 2010-11-25 Nitto Denko Corp 熱硬化性シリコーン樹脂用組成物

Also Published As

Publication number Publication date
JP2014074183A (ja) 2014-04-24
TW201247785A (en) 2012-12-01
TW201525073A (zh) 2015-07-01
JP2012233153A (ja) 2012-11-29
JP5505436B2 (ja) 2014-05-28
JP5696798B2 (ja) 2015-04-08

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