JP5505436B2 - 硬化性組成物、硬化物、光半導体装置およびポリシロキサン - Google Patents

硬化性組成物、硬化物、光半導体装置およびポリシロキサン Download PDF

Info

Publication number
JP5505436B2
JP5505436B2 JP2012034100A JP2012034100A JP5505436B2 JP 5505436 B2 JP5505436 B2 JP 5505436B2 JP 2012034100 A JP2012034100 A JP 2012034100A JP 2012034100 A JP2012034100 A JP 2012034100A JP 5505436 B2 JP5505436 B2 JP 5505436B2
Authority
JP
Japan
Prior art keywords
group
polysiloxane
mol
integer
curable composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012034100A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012233153A5 (enExample
JP2012233153A (ja
Inventor
康二 中西
太一 田崎
公一 長谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Priority to JP2012034100A priority Critical patent/JP5505436B2/ja
Priority to KR1020120034311A priority patent/KR101472829B1/ko
Priority to TW101114054A priority patent/TWI499644B/zh
Priority to CN201210129278.XA priority patent/CN102757650B/zh
Priority to TW104108949A priority patent/TW201525073A/zh
Publication of JP2012233153A publication Critical patent/JP2012233153A/ja
Publication of JP2012233153A5 publication Critical patent/JP2012233153A5/ja
Application granted granted Critical
Publication of JP5505436B2 publication Critical patent/JP5505436B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
JP2012034100A 2011-04-21 2012-02-20 硬化性組成物、硬化物、光半導体装置およびポリシロキサン Expired - Fee Related JP5505436B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012034100A JP5505436B2 (ja) 2011-04-21 2012-02-20 硬化性組成物、硬化物、光半導体装置およびポリシロキサン
KR1020120034311A KR101472829B1 (ko) 2011-04-21 2012-04-03 경화성 조성물, 경화물, 광반도체 장치 및 폴리실록산
TW101114054A TWI499644B (zh) 2011-04-21 2012-04-20 硬化性組成物、硬化物以及光半導體裝置
CN201210129278.XA CN102757650B (zh) 2011-04-21 2012-04-20 固化性组合物、固化物、光半导体装置以及聚硅氧烷
TW104108949A TW201525073A (zh) 2011-04-21 2012-04-20 聚矽氧烷

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011094922 2011-04-21
JP2011094922 2011-04-21
JP2012034100A JP5505436B2 (ja) 2011-04-21 2012-02-20 硬化性組成物、硬化物、光半導体装置およびポリシロキサン

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014012162A Division JP5696798B2 (ja) 2011-04-21 2014-01-27 ポリシロキサン

Publications (3)

Publication Number Publication Date
JP2012233153A JP2012233153A (ja) 2012-11-29
JP2012233153A5 JP2012233153A5 (enExample) 2013-07-11
JP5505436B2 true JP5505436B2 (ja) 2014-05-28

Family

ID=47433784

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2012034100A Expired - Fee Related JP5505436B2 (ja) 2011-04-21 2012-02-20 硬化性組成物、硬化物、光半導体装置およびポリシロキサン
JP2014012162A Expired - Fee Related JP5696798B2 (ja) 2011-04-21 2014-01-27 ポリシロキサン

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2014012162A Expired - Fee Related JP5696798B2 (ja) 2011-04-21 2014-01-27 ポリシロキサン

Country Status (2)

Country Link
JP (2) JP5505436B2 (enExample)
TW (2) TW201525073A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101556274B1 (ko) 2012-12-28 2015-09-30 제일모직 주식회사 봉지재 조성물, 봉지재 및 전자 소자
KR102165826B1 (ko) 2016-08-12 2020-10-15 와커 헤미 아게 경화성 오르가노폴리실록산 조성물, 캡슐화제 및 반도체 장치
KR102625363B1 (ko) * 2017-07-24 2024-01-17 다우 도레이 캄파니 리미티드 다성분 경화형 열전도성 실리콘 겔 조성물, 열전도성 부재 및 방열 구조체
JP7574543B2 (ja) * 2020-03-31 2024-10-29 三菱ケミカル株式会社 樹脂組成物、電子機器用部材、樹脂添加剤、及び樹脂添加用オルガノポリシロキサン組成物
JP7574544B2 (ja) * 2020-03-31 2024-10-29 三菱ケミカル株式会社 樹脂組成物、電子機器用部材、樹脂添加剤、及び、樹脂添加用オルガノポリシロキサン組成物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH062821B2 (ja) * 1989-11-28 1994-01-12 信越化学工業株式会社 エポキシ基含有シリコーンエラストマー微粉末の製造方法及びその方法により製造された微粉末
JP3469327B2 (ja) * 1994-08-03 2003-11-25 信越化学工業株式会社 オルガノポリシロキサンの製造方法
JP2003192790A (ja) * 2001-12-27 2003-07-09 Dow Corning Toray Silicone Co Ltd ラジカル重合性オルガノポリシロキサン混合物およびその製造方法
JP5060074B2 (ja) * 2006-05-11 2012-10-31 東レ・ダウコーニング株式会社 接着促進剤、硬化性オルガノポリシロキサン組成物、および半導体装置
JP4862032B2 (ja) * 2008-12-05 2012-01-25 信越化学工業株式会社 高屈折率を有する硬化物を与える付加硬化型シリコーン組成物、及び該組成物からなる光学素子封止材
JP4913858B2 (ja) * 2009-04-14 2012-04-11 日東電工株式会社 熱硬化性シリコーン樹脂用組成物
JP2011057755A (ja) * 2009-09-07 2011-03-24 Shin-Etsu Chemical Co Ltd シリコーン組成物及びその硬化物

Also Published As

Publication number Publication date
JP5696798B2 (ja) 2015-04-08
TWI499644B (zh) 2015-09-11
TW201525073A (zh) 2015-07-01
TW201247785A (en) 2012-12-01
JP2014074183A (ja) 2014-04-24
JP2012233153A (ja) 2012-11-29

Similar Documents

Publication Publication Date Title
KR101589936B1 (ko) 경화성 오가노폴리실록산 조성물 및 반도체 장치
US9346954B2 (en) Curable resin composition
CN102757650B (zh) 固化性组合物、固化物、光半导体装置以及聚硅氧烷
JP2013139547A (ja) 硬化性組成物、硬化物および光半導体装置
WO2016035285A1 (ja) 硬化性シリコーン組成物、硬化性ホットメルトシリコーン、および光デバイス
JP5696798B2 (ja) ポリシロキサン
JP2013001794A (ja) 架橋性シリコーン組成物及びその架橋物
CN103571209A (zh) 加成固化型硅酮组合物、及半导体装置
JPWO2015136820A1 (ja) 硬化性樹脂組成物
JP5858027B2 (ja) 硬化性組成物、硬化物および光半導体装置
KR20150119882A (ko) 경화성 수지 조성물
JP2012233153A5 (enExample)
JP6324206B2 (ja) 硬化性オルガノポリシロキサン組成物及び半導体装置
JP5660145B2 (ja) 硬化性組成物、硬化物および光半導体装置
JP5621819B2 (ja) 硬化性組成物、硬化物および光半導体装置
JP7648333B2 (ja) 硬化性液状シリコーン組成物、その硬化物、それを含む光学充填剤、およびその硬化物からなる層を含む表示装置
KR101594343B1 (ko) 경화성 조성물 및 그의 제조 방법, 경화물, 및 광반도체 장치
KR20130062869A (ko) 경화성 조성물, 경화물 및 광반도체 장치
JP5807427B2 (ja) 硬化性組成物、硬化膜、ポリシロキサンおよび光半導体装置
JP6766334B2 (ja) 有機ケイ素化合物、該有機ケイ素化合物を含む熱硬化性組成物、および光半導体用封止材料
JP5943104B2 (ja) 硬化性組成物、硬化膜、ポリシロキサンおよび光半導体装置
JP2024128602A (ja) ホットメルト性硬化性シリコーン組成物、封止材、ホットメルト接着剤、及び光半導体装置
JP2017036391A (ja) 硬化性組成物、硬化物、ポリシロキサン、及び光半導体装置
KR20130112761A (ko) 경화성 조성물, 경화물 및 광반도체 장치
KR20140110718A (ko) 경화성 조성물, 경화물 및 광반도체 장치

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130524

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20130524

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20130524

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130926

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20130926

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20131001

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20131120

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20131210

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140127

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140218

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140303

R150 Certificate of patent or registration of utility model

Ref document number: 5505436

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees