JP2012148351A - 切削方法 - Google Patents
切削方法 Download PDFInfo
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- JP2012148351A JP2012148351A JP2011006562A JP2011006562A JP2012148351A JP 2012148351 A JP2012148351 A JP 2012148351A JP 2011006562 A JP2011006562 A JP 2011006562A JP 2011006562 A JP2011006562 A JP 2011006562A JP 2012148351 A JP2012148351 A JP 2012148351A
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- Japan
- Prior art keywords
- adhesive sheet
- workpiece
- cutting
- chuck table
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
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- Milling, Broaching, Filing, Reaming, And Others (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
【解決手段】被加工物の第1面側を第1粘着シート74上に配設する第1粘着シート貼着ステップと、第1粘着シート上に配設された被加工物の第1粘着シート側をチャックテーブル30で保持する保持ステップと、被加工物の第1面側と反対側の第2面側に第2粘着シート86を貼着するとともに、被加工物の外側で第2粘着シートを第1粘着シートに貼着して被加工物を第1粘着シートと第2粘着シートとで包み込む第2粘着シート貼着ステップと、保持面と平行な面で回転する切削刃56を有するバイトホイール25を回転させつつ第2粘着シートに当接させた状態でチャックテーブルとバイトホイールとを相対移動させて第2粘着シートとともに被加工物の第2面側を切削する切削ステップと、を具備した。
【選択図】図9
Description
25 バイトホイール
26 バイトユニット
30 チャックテーブル
56 切削刃
72 LEDパッケージ
74 第1粘着シート
76 環状フレーム
78 基板
80 透光性モールド樹脂
86 第2粘着シート
Claims (1)
- 被加工物を保持する保持面を有するチャックテーブルで保持した被加工物をバイトホイールで切削する切削方法であって、
被加工物の第1面側を第1粘着シートに貼着して被加工物を該第1粘着シート上に配設する第1粘着シート貼着ステップと、
該第1粘着シート上に配設された被加工物の該第1粘着シート側をチャックテーブルで保持する保持ステップと、
該保持ステップを実施する前又は後で、被加工物の該第1面側と反対側の第2面側に第2粘着シートを貼着するとともに、被加工物の外側で該第2粘着シートを該第1粘着シートに貼着して被加工物を該第1粘着シートと該第2粘着シートとで包み込む第2粘着シート貼着ステップと、
該第2粘着シート貼着ステップを実施した後、該保持面と平行な面で回転する切削刃を有するバイトホイールを回転させつつ該第2粘着シートに当接させた状態で該チャックテーブルと該バイトホイールとを相対移動させて該第2粘着シートとともに被加工物の該第2面側を切削する切削ステップと、
を具備したことを特徴とする切削方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011006562A JP5748200B2 (ja) | 2011-01-17 | 2011-01-17 | 切削方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011006562A JP5748200B2 (ja) | 2011-01-17 | 2011-01-17 | 切削方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012148351A true JP2012148351A (ja) | 2012-08-09 |
JP5748200B2 JP5748200B2 (ja) | 2015-07-15 |
Family
ID=46791142
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011006562A Active JP5748200B2 (ja) | 2011-01-17 | 2011-01-17 | 切削方法 |
Country Status (1)
Country | Link |
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JP (1) | JP5748200B2 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02269171A (ja) * | 1989-04-10 | 1990-11-02 | Lintec Corp | ウエハ貼着用粘着シート |
JPH06114797A (ja) * | 1992-03-13 | 1994-04-26 | Tamachi Kogyo Kk | プリント基板等の切断工法 |
JP2005340324A (ja) * | 2004-05-25 | 2005-12-08 | Disco Abrasive Syst Ltd | 加工装置におけるチャックテーブルの加工方法 |
JP2009012105A (ja) * | 2007-07-03 | 2009-01-22 | Disco Abrasive Syst Ltd | バイトユニット |
-
2011
- 2011-01-17 JP JP2011006562A patent/JP5748200B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02269171A (ja) * | 1989-04-10 | 1990-11-02 | Lintec Corp | ウエハ貼着用粘着シート |
JPH06114797A (ja) * | 1992-03-13 | 1994-04-26 | Tamachi Kogyo Kk | プリント基板等の切断工法 |
JP2005340324A (ja) * | 2004-05-25 | 2005-12-08 | Disco Abrasive Syst Ltd | 加工装置におけるチャックテーブルの加工方法 |
JP2009012105A (ja) * | 2007-07-03 | 2009-01-22 | Disco Abrasive Syst Ltd | バイトユニット |
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JP5748200B2 (ja) | 2015-07-15 |
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