JP5618657B2 - 加工方法 - Google Patents
加工方法 Download PDFInfo
- Publication number
- JP5618657B2 JP5618657B2 JP2010156556A JP2010156556A JP5618657B2 JP 5618657 B2 JP5618657 B2 JP 5618657B2 JP 2010156556 A JP2010156556 A JP 2010156556A JP 2010156556 A JP2010156556 A JP 2010156556A JP 5618657 B2 JP5618657 B2 JP 5618657B2
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- substrate
- wafer
- chuck table
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003672 processing method Methods 0.000 title claims description 11
- 239000000758 substrate Substances 0.000 claims description 50
- 239000004065 semiconductor Substances 0.000 claims description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 238000004140 cleaning Methods 0.000 description 4
- 239000007921 spray Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Engineering & Computer Science (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
Description
10 研削手段(研削ユニット)
11 半導体ウエーハ
23 サブストレート
25 研削ホイール
26 研削砥石
50 チャックテーブル
Claims (1)
- シリコンウエーハから構成されたサブストレートに貼り付けられたシリコンからなる半導体ウエーハを研削して平坦化する加工方法であって、
該サブストレートを研削装置のチャックテーブルで保持するサブストレート保持ステップと、
該チャックテーブルで保持された該サブストレートを研削手段で研削して平坦化するサブストレート平坦化ステップと、
平坦化された該サブストレートに該半導体ウエーハを貼り付ける貼り付けステップと、
該貼り付けステップを実施した後、該半導体ウエーハが貼り付けられた該サブストレート側を該サブストレート平坦化ステップで使用したのと同一のチャックテーブルで保持する半導体ウエーハ保持ステップと、
該半導体ウエーハ保持ステップで該チャックテーブルに保持された該半導体ウエーハを、該サブストレート平坦化ステップで使用したのと同一の研削手段で研削して平坦化する半導体ウエーハ研削ステップと、
を具備したことを特徴とする加工方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010156556A JP5618657B2 (ja) | 2010-07-09 | 2010-07-09 | 加工方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010156556A JP5618657B2 (ja) | 2010-07-09 | 2010-07-09 | 加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012019127A JP2012019127A (ja) | 2012-01-26 |
JP5618657B2 true JP5618657B2 (ja) | 2014-11-05 |
Family
ID=45604141
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010156556A Active JP5618657B2 (ja) | 2010-07-09 | 2010-07-09 | 加工方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5618657B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019111634A (ja) * | 2017-12-26 | 2019-07-11 | 株式会社ディスコ | 被加工物の研削方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005303214A (ja) * | 2004-04-16 | 2005-10-27 | Matsushita Electric Ind Co Ltd | 半導体ウェーハの研削方法 |
JP2005333100A (ja) * | 2004-04-23 | 2005-12-02 | Sekisui Chem Co Ltd | 支持プレート |
JP2009043931A (ja) * | 2007-08-08 | 2009-02-26 | Disco Abrasive Syst Ltd | ウェーハの裏面研削方法 |
JP2010042469A (ja) * | 2008-08-12 | 2010-02-25 | Tokyo Ohka Kogyo Co Ltd | サポートプレート |
-
2010
- 2010-07-09 JP JP2010156556A patent/JP5618657B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2012019127A (ja) | 2012-01-26 |
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