JP2012138410A - 熱圧着ヘッド、実装装置、実装方法及び接合体 - Google Patents
熱圧着ヘッド、実装装置、実装方法及び接合体 Download PDFInfo
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Abstract
【解決手段】熱硬化性の接着剤層23を介して実装部品18,21を熱加圧することにより実装部20,22に実装部品18,21を接続する熱圧着ヘッド3において、熱圧着ヘッド3は、ペルチェ素子5を有し、ペルチェ素子5は、実装部品18,21を熱加圧する際に、実装部20,22近傍に設けられた他の構成部品15と対峙する面側を冷却部6とする。
【選択図】図1
Description
実装装置1は、このような液晶表示パネル10のCOG実装部20に電子部品18を実装し、またFOG実装部22にフレキシブル基板21を実装するものであり、図1に示すように、液晶表示パネル10が載置されるステージ2と、ステージ2に載置された液晶表示パネル10の各実装部20,22に液晶駆動用IC等の電子部品18やフレキシブル基板21を実装する熱圧着ヘッド3と、熱圧着ヘッド3を各実装部20,22に近接離間させるヘッド駆動機構4とを備える。
このような熱圧着ヘッド3を駆動するヘッド駆動機構4は、熱圧着ヘッド3をCOG実装部20やFOG実装部22に近接離間するように昇降自在に支持するとともに、ヘッド本体3bの昇降動作及びヘッド本体3bに内蔵されたヒーターの駆動を制御する。そして、ヘッド駆動機構4は、電子部品18やフレキシブル基板21の実装時には、ヘッド本体3b内のヒーターを駆動して所定温度に加熱するとともに、熱圧着ヘッド3を所定時間、所定の圧力で電子部品18やフレキシブル基板21を押圧するように駆動する。
次いで、かかる実装装置1を用いて液晶表示パネル10にCOG実装及びFOG実装を行う工程について説明する。図1に示すように、実装装置1は、ステージ2上に、液晶表示パネル10が位置決めされて載置される。このとき、液晶表示パネル10は、透明基板11,12がシール13によって貼り合わされ、内部空間に液晶が封入されている。また、液晶表示パネル10は、相対向する内側表面に透明電極16,17が設けられ、透明基板12の縁部には、それぞれ透明電極17の端子部17aが形成されたCOG実装部20及びFOG実装部22が設けられている。さらに、液晶表示パネル10は、透明電極16,17上には、所定のラビング処理が施された配向膜24が形成されている。また、透明基板11,12の外側には一対の偏光板25,26が配設されている。
次いで、本発明が適用された熱圧着ヘッドの変形例について説明する。この熱圧着ヘッド30は、図3に示すように、ヘッド本体30aに複数のペルチェ素子5a、5b、5c・・・が重畳して取り付けられている。各ペルチェ素子5は、冷却部6と加熱部7との温度差、及び使用可能な温度範囲といった温度特性が異なるものが用いられる。
また、本発明が適用された実装装置1は、この熱圧着ヘッド30に重畳されたペルチェ素子5によっても、電子部品18やフレキシブル基板21等の実装部品を加熱押圧しても良い。実装装置1は、熱圧着する実装部品や異方性導電フィルム23の種類によって熱圧着ヘッドの加熱温度が変わる。したがって、図4に示すように、種類の異なる複数の実装部品が配列され、それぞれ加熱押圧の温度が異なる場合に、熱圧着ヘッド30は、重畳されたペルチェ素子5によって温度が異なることから、各実装部品に最適な温度を有するペルチェ素子5を配して加熱押圧することができる。これにより、実装装置1は、加熱押圧の温度が異なる複数の実装部品を一括して実装することができる。
また、図5に示すように、本発明が適用された熱圧着ヘッドは、第1の熱圧着ヘッド40に、一又は複数のペルチェ素子5を介して加熱温度の異なる第2の熱圧着ヘッド41を取り付けるようにしてもよい。第2の熱圧着ヘッド41が第1の熱圧着ヘッド40よりも加熱温度が低い場合、第2の熱圧着ヘッド41には、第1の熱圧着ヘッド40との間に、冷却部6の温度が第2の熱圧着ヘッド41の熱加圧温度に近くなるようなペルチェ素子5が取り付けられる。
また、本発明が適用された熱圧着ヘッドは、図6に示すように、ペルチェ素子5をヘッド本体50aの電子部品18やパネル表示部15と面する側面を含む他の側面や全周囲に亘って形成された熱圧着ヘッド50としてもよい。この熱圧着ヘッド50は、ヘッド本体50aの熱が周囲に拡散することを防止することができ、周囲の実装部位に対する熱による影響を抑えることができる。
また、本発明が適用された熱圧着ヘッドは、図7に示すように、ヘッド本体60a内にヒーターを内蔵せず、ヘッド本体60aの周囲に取り付けたペルチェ素子5によって所定の温度に加熱される熱圧着ヘッド60としてもよい。この熱圧着ヘッド60は、加熱部7の温度が実装部品の加熱温度となるペルチェ素子5を用い、当該ペルチェ素子5のヘッド本体60aに取り付けられた面を加熱部7として放熱させ、ヘッド本体60aを加熱する。
また、本発明が適用された熱圧着ヘッド3、50、60は、実装部品の実装が終了した後に、ヘッド本体3b、50a、60aをペルチェ素子5によって冷却してもよい。上述したように、ペルチェ素子5は、直流電流を流す方向を逆にすることにより、熱の移動方向も逆になるので、冷却部6と加熱部7を入れ替えることが可能である。したがって、熱圧着ヘッド3、50、60は、電子部品18やフレキシブル基板21の実装が終了した後、ヘッド駆動機構4によって上昇され、ペルチェ素子5の電流の方向を逆にして流す。
また、本発明は、図8(a)に示すように、熱圧着ヘッドをペルチェ素子5のみで構成してもよい。この熱圧着ヘッド70は、ペルチェ素子5の加熱部7の電子部品18やフレキシブル基板21と対峙する下面を押圧面とする。
Claims (20)
- 熱硬化性の接着剤層を介して実装部品を熱加圧することにより実装部に上記実装部品を接続する熱圧着ヘッドにおいて、
上記熱圧着ヘッドは、ペルチェ素子を有し、
上記ペルチェ素子は、上記実装部品を熱加圧する際に、上記実装部近傍に設けられた他の構成部品と対峙する面側を冷却部とする熱圧着ヘッド。 - 上記ペルチェ素子は、少なくともヘッド本体の上記実装部近傍に設けられた他の構成部品に面する側に設けられ、
上記実装部品を熱加圧する際に、上記ペルチェ素子は上記ヘッド本体と対峙する面側を加熱部とする請求項1記載の熱圧着ヘッド。 - 複数の上記ペルチェ素子が重畳され、上記ヘッド本体と接触する上記ペルチェ素子の加熱部は上記実装部品の熱加圧温度とされ、上記他の構成部品に面する上記ペルチェ素子の冷却部は上記他の構成部品に影響を与えない温度とされている請求項2に記載の熱圧着ヘッド。
- 上記ペルチェ素子で上記実装部品を熱加圧する請求項1〜請求項3のいずれか1項に記載の熱圧着ヘッド。
- 上記ペルチェ素子が上記ヘッド本体の全周囲に設けられている請求項2〜請求項4のいずれか1項に記載の熱圧着ヘッド。
- 上記実装部品を熱加圧する際に、上記ヘッド本体が上記ペルチェ素子によって加熱される請求項2〜請求項5のいずれか1項に記載の熱圧着ヘッド。
- 上記実装部品を熱加圧した後、上記ヘッド本体が上記ペルチェ素子によって冷却される請求項6記載の熱圧着ヘッド。
- 上記ペルチェ素子のみからなる請求項1に記載の熱圧着ヘッド。
- 複数の上記ペルチェ素子が重畳され、上記実装部品を熱加圧する上記ペルチェ素子の加熱部は上記実装部品の熱加圧温度とされ、上記他の構成部品に面する上記ペルチェ素子の冷却部は上記他の構成部品に影響を与えない温度とされている請求項8に記載の熱圧着ヘッド。
- 熱硬化性の接着剤層を介して実装部品を熱加圧することにより実装部に上記実装部品を接続する熱圧着ヘッドと、
上記熱圧着ヘッドを実装部品が接続される上記実装部に対峙させ、該実装部と近接離間させるヘッド駆動機構とを備え、
上記熱圧着ヘッドは、ペルチェ素子を有し、
上記ペルチェ素子は、上記実装部品を熱加圧する際に、上記実装部近傍に設けられた他の構成部品と対峙する面側を冷却部とする実装装置。 - 実装部上に熱硬化性の接着剤層を介して実装部品を載置する工程と、
ペルチェ素子を有する熱圧着ヘッドによって上記実装部品を上記実装部上に熱加圧する工程とを有し、
上記熱加圧工程において、上記ペルチェ素子は、上記実装部近傍に設けられた他の構成部品と対峙する面側を冷却部とする実装方法。 - 上記ペルチェ素子は、少なくともヘッド本体の上記実装部近傍に設けられた他の構成部品に面する側に設けられ、
上記実装部品を熱加圧する際に、上記ペルチェ素子は上記ヘッド本体と対峙する面側を加熱部とする請求項11に記載の実装方法。 - 複数の上記ペルチェ素子が重畳され、上記熱圧着ヘッドと接触する上記ペルチェ素子の加熱部は上記実装部品の熱加圧温度とされ、上記他の構成部品に面する上記ペルチェ素子の冷却部は上記他の構成部品に影響を与えない温度とされている請求項12に記載の実装方法。
- 上記ペルチェ素子が上記ヘッド本体の全周囲に設けられている請求項12又は請求項13に記載の実装方法。
- 上記熱圧着ヘッドは、上記実装部品を熱加圧する際に、上記ヘッド本体が上記ペルチェ素子によって加熱される請求項12〜請求項14のいずれか1項に記載の実装方法。
- 上記熱圧着ヘッドは、上記実装部品を熱加圧した後、上記ヘッド本体が上記ペルチェ素子によって冷却される請求項15に記載の実装方法。
- 蒸気熱圧着ヘッドは、上記ペルチェ素子のみからなる請求項11に記載の実装方法。
- 複数の上記ペルチェ素子が重畳され、上記実装部品を熱加圧する上記ペルチェ素子の加熱部は上記実装部品の熱加圧温度とされ、上記他の構成部品に面する上記ペルチェ素子の冷却部は上記他の構成部品に影響を与えない温度とされている請求項17に記載の実装方法。
- 上記熱硬化性の接着剤層は、異方導電性接着フィルムまたは絶縁性接着フィルムである請求項11〜請求項18のいずれか1項に記載の実装方法。
- 請求項11〜請求項19のいずれか1項に記載の実装方法により製造された接合体。
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000294602A (ja) * | 1999-04-01 | 2000-10-20 | Nec Corp | フリップチップボンダー |
JP2001320010A (ja) * | 2000-02-24 | 2001-11-16 | Seiko Epson Corp | 半導体装置の実装構造、電気光学装置、液晶装置及び電子機器 |
JP2005084518A (ja) * | 2003-09-10 | 2005-03-31 | Seiko Epson Corp | 電気光学装置、回路基板、電子機器、電気光学装置の製造方法及び回路基板の製造方法 |
JP2007207980A (ja) * | 2006-02-01 | 2007-08-16 | Seiko Instruments Inc | 圧着装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006245554A (ja) * | 2005-02-02 | 2006-09-14 | Sony Chemical & Information Device Corp | 電気部品の実装方法 |
JP4979288B2 (ja) * | 2006-07-19 | 2012-07-18 | ソニーケミカル&インフォメーションデバイス株式会社 | 熱圧着ヘッドを用いた実装方法 |
JP4828635B2 (ja) * | 2007-07-25 | 2011-11-30 | 京セラ株式会社 | 熱電素子、熱電モジュール及び熱電素子の製造方法 |
KR100920399B1 (ko) * | 2007-09-14 | 2009-10-07 | 주식회사 에이디피엔지니어링 | 냉각블럭 및 이를 포함하는 기판처리장치 |
CN101320146A (zh) * | 2008-07-16 | 2008-12-10 | 友达光电股份有限公司 | 热压机构 |
JP2011234127A (ja) * | 2010-04-27 | 2011-11-17 | Olympus Corp | 光透過部材の実装方法 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000294602A (ja) * | 1999-04-01 | 2000-10-20 | Nec Corp | フリップチップボンダー |
JP2001320010A (ja) * | 2000-02-24 | 2001-11-16 | Seiko Epson Corp | 半導体装置の実装構造、電気光学装置、液晶装置及び電子機器 |
JP2005084518A (ja) * | 2003-09-10 | 2005-03-31 | Seiko Epson Corp | 電気光学装置、回路基板、電子機器、電気光学装置の製造方法及び回路基板の製造方法 |
JP2007207980A (ja) * | 2006-02-01 | 2007-08-16 | Seiko Instruments Inc | 圧着装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016192461A (ja) * | 2015-03-31 | 2016-11-10 | トヨタ自動車株式会社 | 熱圧着装置 |
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