WO2012086771A1 - 熱圧着ヘッド、実装装置、実装方法及び接合体 - Google Patents
熱圧着ヘッド、実装装置、実装方法及び接合体 Download PDFInfo
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- WO2012086771A1 WO2012086771A1 PCT/JP2011/079855 JP2011079855W WO2012086771A1 WO 2012086771 A1 WO2012086771 A1 WO 2012086771A1 JP 2011079855 W JP2011079855 W JP 2011079855W WO 2012086771 A1 WO2012086771 A1 WO 2012086771A1
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- mounting
- thermocompression bonding
- peltier element
- bonding head
- heat
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
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Definitions
- the present invention relates to a thermocompression bonding head, a mounting apparatus, a mounting method, and a bonding in which a mounting component is mounted by the method, which is bonded to a mounting portion of a substrate or a panel by thermocompression bonding via a thermosetting adhesive.
- a thermocompression bonding head a mounting apparatus, a mounting method, and a bonding in which a mounting component is mounted by the method, which is bonded to a mounting portion of a substrate or a panel by thermocompression bonding via a thermosetting adhesive.
- liquid crystal display devices are often used as various display means such as televisions, PC monitors, mobile phones, tablet PCs, portable game machines, and in-vehicle monitors.
- COG chip on glass
- FOG film on ⁇ ⁇ glass
- a liquid crystal display device 100 employing a COG mounting system has a liquid crystal display panel 104 that performs a main function for liquid crystal display, as shown in FIG. 9, and the liquid crystal display panel 104 is a glass substrate or the like. And two transparent substrates 102 and 103 facing each other. In the liquid crystal display panel 104, the transparent substrates 102 and 103 are bonded to each other by a frame-shaped seal 105, and the liquid crystal 106 is sealed in a space surrounded by the transparent substrates 102 and 103 and the seal 105.
- a panel display unit 107 is provided.
- the transparent substrates 102 and 103 have a pair of striped transparent electrodes 108 and 109 made of ITO (Indium Tin Oxide) or the like on both inner surfaces facing each other so as to intersect each other.
- the transparent substrates 102 and 103 are configured such that a pixel as a minimum unit of liquid crystal display is constituted by the intersection of the transparent electrodes 108 and 109.
- one transparent substrate 103 is formed to have a larger planar dimension than the other transparent substrate 102, and the transparent electrode 109 is formed on the edge 103a of the transparent substrate 103 formed to be large. Terminal portion 109a is formed.
- alignment films 111 and 112 subjected to a predetermined rubbing process are formed on both transparent electrodes 108 and 109, and the initial alignment of liquid crystal molecules is regulated by the alignment films 111 and 112. ing.
- a pair of polarizing plates 118 and 119 are disposed outside both the transparent substrates 108 and 109, and the vibration direction of transmitted light from the light source 120 such as a backlight is regulated by both the polarizing plates 118 and 119. It has come to be.
- the liquid crystal driving IC 115 is thermocompression-bonded on the terminal portion 109a via an anisotropic conductive film 114.
- the anisotropic conductive film 114 is a film formed by mixing conductive particles in a thermosetting binder resin, and heat conduction is performed between the two conductors so that the electrical conduction between the conductors is achieved by the conductive particles. And the mechanical connection between the conductors is maintained by the binder resin.
- the liquid crystal driving IC 115 can perform predetermined liquid crystal display by selectively changing the alignment of the liquid crystal by selectively applying a liquid crystal driving voltage to the pixels.
- the adhesive constituting the anisotropic conductive film 114 the most reliable thermosetting adhesive is usually used.
- the anisotropic conductive film 114 is attached to the terminal portion 109a of the transparent electrode 109 by a temporary crimping means (not shown). Temporarily crimp. Subsequently, after the liquid crystal driving IC 115 is mounted on the anisotropic conductive film 114, the liquid crystal driving IC 115 is connected to the terminal together with the anisotropic conductive film 114 by thermocompression bonding means 121 such as a thermocompression bonding head as shown in FIG. The thermocompression bonding means 121 generates heat while being pressed toward the portion 109a.
- the anisotropic conductive film 114 undergoes a thermosetting reaction, whereby the liquid crystal driving IC 115 is bonded onto the terminal portion 109a via the anisotropic conductive film 114.
- the liquid crystal display device 100 itself has been reduced in size and weight, while it has been required to secure the display area of the liquid crystal display device 100 as much as possible. It is required to make the edge 103a provided with the portion 109a as small as possible.
- thermocompression bonding means 121 the distance between the terminal portion 109a thermally pressed by the thermocompression bonding means 121 and the panel display portion 107 becomes shorter, and the heating temperature tends to increase with the miniaturization of the thermocompression bonding means 121. Therefore, there is a problem that the polarizing plates 118 and 119 attached to the liquid crystal display panel 104 and the seal 105 sealing the transparent substrates 102 and 103 are deteriorated by the heat.
- thermocompression bonding means there is also a problem that a thermal shock is applied to the liquid crystal driving IC 115 due to the heat from 121, and the mounting state on the terminal portion 109a becomes unstable.
- the present invention provides a mounting apparatus and mounting method for mounting a mounting component on a narrowed terminal portion by applying heat and pressure via an anisotropic conductive film, and other configurations such as a panel display unit and other electronic components. It is an object of the present invention to provide a thermocompression bonding head, a mounting apparatus, a mounting method, and a joined body that can alleviate a thermal shock to a component.
- thermocompression bonding head is a thermocompression bonding head that connects the mounting component to the mounting part by heat-pressing the mounting component via a thermosetting adhesive layer.
- the thermocompression bonding head includes a Peltier element, and the Peltier element has a cooling part on a surface side facing the other component parts provided in the vicinity of the mounting part when the mounting part is thermally pressurized. Is.
- the mounting device includes a thermocompression bonding head that connects the mounting component to the mounting part by heat-pressing the mounting component through a thermosetting adhesive layer, and the mounting component includes the thermocompression bonding head.
- a head drive mechanism that opposes the mounting part to be connected and moves the head close to and away from the mounting part, the thermocompression bonding head has a Peltier element, and the Peltier element is used when heat-pressing the mounting component.
- the surface facing the other component parts provided in the vicinity of the mounting part is the cooling part.
- the mounting method according to the present invention includes a step of placing the mounting component on the mounting portion via a thermosetting adhesive layer, and the mounting component on the mounting portion by a thermocompression bonding head having a Peltier element.
- a step of heat-pressing, and in the heat-pressing step, the Peltier element has a cooling portion on a surface facing the other components provided in the vicinity of the mounting portion.
- the joined body according to the present invention is manufactured by the above mounting method.
- the thermocompression bonding head has a Peltier element, and a current flowing in a predetermined direction through the Peltier element is used as a cooling part on the side facing the other component part. Can be prevented from being transmitted.
- FIG. 1 is a sectional view showing a mounting apparatus to which the present invention is applied.
- FIG. 2 is a cross-sectional view showing a state in which the mounting apparatus to which the present invention is applied is used for another liquid crystal display panel.
- FIG. 3 is a side view showing a configuration in which a plurality of Peltier elements are attached in an overlapping manner.
- FIG. 4 is a side view showing a configuration in which a mounted component is thermally pressed by a Peltier element.
- FIG. 5 is a side view showing a configuration including a plurality of thermocompression bonding heads via Peltier elements.
- FIG. 6 is a cross-sectional view showing a configuration in which a Peltier element is provided around the head body.
- FIG. 7 is a cross-sectional view showing a thermocompression bonding head that is heated by a Peltier element without incorporating a heater.
- 8A and 8B are sectional views showing a thermocompression bonding head composed of Peltier elements.
- FIG. 9 is a cross-sectional view showing a conventional liquid crystal display panel.
- FIG. 10 is a cross-sectional view showing a COG mounting process of a conventional liquid crystal display panel.
- FIG. 11 is a cross-sectional view showing a FOG mounting process of a conventional liquid crystal display panel.
- the mounting apparatus 1 to which the present invention is applied includes a thermocompression bonding head 3 and a so-called COG (chip-on-glass) mounting in which a liquid crystal driving IC is directly mounted on a substrate of a liquid crystal display panel or a liquid crystal driving circuit is formed. It can be suitably used for so-called FOG (film-on-glass) mounting in which a flexible substrate is directly mounted on a substrate of a liquid crystal display panel.
- COG chip-on-glass
- a liquid crystal display panel 10 on which a flexible substrate on which a liquid crystal driving IC and a liquid crystal driving circuit are formed by the mounting apparatus 1 is mounted will be described with reference to FIG.
- the liquid crystal display panel 10 similarly to the liquid crystal display panel 104, two transparent substrates 11 and 12 made of a glass substrate or the like are arranged to face each other, and the transparent substrates 11 and 12 are bonded to each other by a frame-shaped seal 13. Yes.
- the liquid crystal 14 is sealed in a space surrounded by the transparent substrates 11 and 12 to form a panel display unit 15.
- the transparent substrates 11 and 12 have a pair of striped transparent electrodes 16 and 17 made of ITO (Indium Tin Oxide) or the like on both inner surfaces facing each other so as to intersect each other.
- the transparent substrates 16 and 17 are configured such that a pixel as a minimum unit of liquid crystal display is constituted by the intersection of the transparent electrodes 16 and 17.
- one transparent substrate 12 is formed to have a larger planar dimension than the other transparent substrate 11, and an edge portion 12a of the formed transparent substrate 12 is used for driving liquid crystal.
- a COG mounting unit 20 on which an electronic component 18 such as an IC is mounted is provided, and an FOG mounting unit 22 on which a flexible substrate 21 on which a liquid crystal driving circuit is formed is mounted near the outside of the COG mounting unit 20. ing.
- liquid crystal driving IC and the liquid crystal driving circuit can perform predetermined liquid crystal display by selectively changing the alignment of the liquid crystal by selectively applying the liquid crystal driving voltage to the pixels. ing.
- the terminal portions 17a of the transparent electrodes 17 are formed on the mounting portions 20 and 22, respectively.
- an electronic component 18 such as a liquid crystal driving IC and a flexible substrate 21 are thermocompression bonded via an anisotropic conductive film 23.
- the anisotropic conductive film 23 contains conductive particles, and the electrode of the electronic component 18 or the flexible substrate 21 and the terminal portion 17a of the transparent electrode 17 formed on the edge portion 12a of the transparent substrate 12 are electrically conductive. Electrical connection is made through particles.
- the anisotropic conductive film 23 is a thermosetting adhesive, and is thermally bonded by a thermocompression bonding head 3 to be described later, so that the conductive particles become the terminal portions 17a of the transparent electrode 17, the electronic component 18, and the flexible substrate 21. It hardens
- the anisotropic conductive film 23 has a composition in which conductive particles are contained in an organic resin binder, and the organic resin binder includes a film forming material, a liquid curing component, a silane coupling agent, a curing agent, and the like.
- the film forming material any organic resin having film forming ability such as phenoxy resin and solid epoxy resin can be used as appropriate.
- the liquid curing component a thermosetting compound such as a liquid epoxy resin or liquid acrylate can be appropriately used.
- an amine-based curing agent, imidazoles, sulfonium salts, onium salts and the like can be preferably used.
- a thermal radical generator such as an organic peroxide can be preferably used.
- Examples of the conductive particles include any known conductive particles used in the anisotropic conductive film 23.
- any known conductive particles used in the anisotropic conductive film 23 For example, nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, Particles of various metals such as gold and metal alloys, metal oxides, carbon, graphite, glass, ceramics, plastics and other particles coated with metal, or the surface of these particles further coated with an insulating thin film And the like.
- examples of the resin particle include an epoxy resin, a phenol resin, an acrylic resin, an acrylonitrile / styrene (AS) resin, a benzoguanamine resin, a divinylbenzene resin, a styrene resin, and the like. Can be mentioned.
- the anisotropic conductive film 23 is not illustrated on the terminal portion 17a of the transparent electrode 17. Temporary pressure bonding is performed by a pressure bonding means. Subsequently, after placing the electronic component 18 and the flexible substrate 21 on the anisotropic conductive film 23, the thermocompression bonding head 3 presses the electronic component 18 and the flexible substrate 21 together with the anisotropic conductive film 23 toward the terminal portion 17 a side. While doing so, the thermocompression bonding head 3 generates heat.
- the anisotropic conductive film 23 undergoes a thermosetting reaction, whereby the electronic component 18 and the flexible substrate 21 are bonded onto the terminal portion 17a via the anisotropic conductive film 23. .
- an insulating adhesive film made of only a binder may be used.
- the electronic component 18 or the flexible substrate 21 and the terminal portion 17a of the transparent electrode 17 are electrically connected by direct contact.
- stud bumps or the like can be suitably used as the bumps of the electronic component 18.
- the anisotropic conductive film 23 is applied and formed on a release film such as PET that has been subjected to a release treatment from the standpoint of ease of handling and storage stability.
- the shape of the anisotropic conductive film 23 is not particularly limited.
- the anisotropic conductive film 23 has a long tape shape that can be wound around a take-up reel made of plastic or the like, and is cut by a predetermined length when used for mounting. Can be used.
- An alignment film 24 subjected to a predetermined rubbing process is formed on both the transparent electrodes 16 and 17, and the initial alignment of liquid crystal molecules is regulated by the alignment film 24.
- a pair of polarizing plates 25 and 26 are disposed outside the transparent substrates 11 and 12, and these polarizing plates 25 and 26 allow transmitted light from a light source (not shown) such as a backlight to be transmitted. The vibration direction is regulated.
- the mounting apparatus 1 mounts the electronic component 18 on the COG mounting portion 20 of the liquid crystal display panel 10 and also mounts the flexible substrate 21 on the FOG mounting portion 22.
- FIG. A stage 2 on which the panel 10 is mounted, and a thermocompression bonding head 3 for mounting an electronic component 18 such as a liquid crystal driving IC and a flexible substrate 21 on the mounting parts 20 and 22 of the liquid crystal display panel 10 mounted on the stage 2.
- a head driving mechanism 4 that moves the thermocompression bonding head 3 close to and away from the mounting portions 20 and 22.
- the stage 2 has a size sufficient for mounting the liquid crystal display panel 10, and the liquid crystal display panel 10 is positioned and mounted.
- the thermocompression bonding head 3 is provided so as to face the COG mounting part 20 and the FOG mounting part 22 provided on the edge part 12 a of the transparent substrate 12. ing.
- the thermocompression bonding head 3 has a pressing surface 3a for pressing the electronic component 18 and the flexible substrate 21, and a head body 3b in which a heater is built and a Peltier element 5 is attached.
- the thermocompression bonding head 3 presses the anisotropic conductive film 23 with conductive particles by pressing the pressing surface 3a heated to a predetermined temperature against the electronic component 18 and the flexible substrate 21 with a predetermined pressure and time. Cure in the crushed state.
- the thermocompression bonding head 3 is provided with a Peltier element 5 on the head body 3b.
- the Peltier element 5 is a plate-like element that utilizes a phenomenon in which heat is generated or absorbed when a contact surface of a dissimilar metal or semiconductor is energized, and includes a cooling unit 6 and a heating unit 7.
- the Peltier element 5 can reverse the cooling direction 6 and the heating part 7 because the direction of heat transfer is reversed by reversing the direction in which the direct current flows. Therefore, the Peltier element 5 can be used for both heating and cooling, and is suitable for highly accurate temperature control.
- the mounting apparatus 1 uses the Peltier element 5 to prevent the heat of the head main body 3b from being transmitted to the components on the transparent substrate 12 such as the electronic component 18 and the panel display unit 15.
- the Peltier element 5 is formed on at least a side surface of the head main body 3b facing the electronic component 18 and the panel display unit 15, and a side facing the component is a cooling unit 6. This is because the liquid crystal display panel 10 forms the panel display unit 15, mounts the electronic component 18 by COG, and then mounts the flexible substrate 21 by FOG. Therefore, in each mounting process, the panel display adjacent to the head body 3 b is displayed. This is to prevent the heat of the head body 3b from being transmitted to the portion 15 and the electronic component 18.
- the head driving mechanism 4 for driving the thermocompression bonding head 3 supports the thermocompression bonding head 3 so as to be movable up and down so as to be close to and away from the COG mounting portion 20 and the FOG mounting portion 22, The drive of the heater built in the head main body 3b is controlled.
- the head driving mechanism 4 drives the heater in the head main body 3b to heat it to a predetermined temperature when mounting the electronic component 18 and the flexible substrate 21, and also heats the thermocompression bonding head 3 with a predetermined pressure for a predetermined time. 18 and the flexible substrate 21 are driven to be pressed.
- the mounting apparatus 1 has a liquid crystal display panel 10 positioned and placed on a stage 2.
- the transparent substrates 11 and 12 are bonded together by the seal 13, and the liquid crystal is sealed in the internal space.
- the liquid crystal display panel 10 is provided with transparent electrodes 16 and 17 on the inner surfaces facing each other, and the edge of the transparent substrate 12 is provided with the COG mounting portion 20 and the FOG in which the terminal portions 17a of the transparent electrodes 17 are formed, respectively.
- a mounting portion 22 is provided.
- an alignment film 24 subjected to a predetermined rubbing process is formed on the transparent electrodes 16 and 17.
- a pair of polarizing plates 25 and 26 are disposed outside the transparent substrates 11 and 12.
- the anisotropic conductive film 23 is disposed on the terminal portion 17 a of the COG mounting portion 20.
- the thermocompression bonding head 3 is supported above the COG mounting portion 20 by the head driving mechanism 4.
- an electronic component 18 such as a liquid crystal driving IC is disposed on the anisotropic conductive film 23.
- the thermocompression bonding head 3 is controlled so that the head main body 3b is heated to a predetermined temperature by the head driving mechanism 4 and the pressing surface 3a is lowered so as to press the electronic component 18 and is pressed for a predetermined pressure and time. Is done.
- the anisotropic conductive film 23 hardens
- thermocompression bonding head 3 is provided with a Peltier element 5 on a side surface facing the panel display unit 15 of the head main body 3b, and a side facing the panel display unit 15 by passing a current in a predetermined direction through the Peltier element 5. Therefore, the heat of the head main body 3b can be prevented from being transmitted to the polarizing plate, the seal 13 and the like of the panel display unit 15. Therefore, even when the distance between the panel display unit 15 and the COG mounting unit 20 is narrowed and the head main body 3b is close to the panel display unit 15, deterioration or damage caused by thermal shock applied to each part of the panel display unit 15 Etc. can be prevented.
- thermocompression bonding head 3 is such that the head main body 3 b is heated to a predetermined temperature by the head driving mechanism 4, and the pressing surface 3 a is lowered so as to press the terminal portion of the flexible substrate 21. The pressure is controlled so as to be pressed only for the time. Thereby, the anisotropic conductive film 23 hardens
- thermocompression bonding head 3 is provided with the Peltier element 5 on the side surface facing the panel display unit 15 of the head main body 3b and the electronic component 18 previously mounted with COG, and a current in a predetermined direction is supplied to the Peltier element 5. Since the cooling unit 6 is the side facing the electronic component 18 and the panel display unit 15 by flowing, the heat of the head main body 3b is transmitted to the polarizing plates 25 and 26 of the panel display unit 15, the seal 13, the electronic component 18 and the like. Can be prevented.
- the electronic component 18 or the panel display unit 15 can be prevented from being altered or damaged due to a thermal shock applied thereto, and the connection of the electronic component 18 to the COG mounting portion 20 does not become unstable.
- thermocompression bonding head 3 is raised by the head driving mechanism 4 to prepare for the next mounting process.
- the case where the electronic component 18 and the flexible substrate 21 are mounted on the liquid crystal display panel 10 has been described. However, even when the liquid crystal display panel 10 is replaced with a wiring substrate, it can be similarly mounted. Moreover, although it described about mounting the flexible substrate 21 in the panel in which the COG mounting part exists previously, the mounting part mounted previously is not limited to COG.
- thermocompression bonding head 30 has a plurality of Peltier elements 5a, 5b, 5c,.
- Each Peltier element 5 has different temperature characteristics such as a temperature difference between the cooling unit 6 and the heating unit 7 and a usable temperature range.
- thermocompression bonding head 30 is attached with the first Peltier element 5a whose upper limit of the usable temperature range is close to the heating temperature of the head body 30a. Then, the thermocompression bonding head 30 attaches the second Peltier element 5b whose upper limit of the usable temperature range is close to the temperature of the cooling unit 6 of the first Peltier element 5a to the first Peltier element 5a. A third Peltier element 5c whose upper limit of the usable temperature range is close to the temperature of the cooling unit 6 of the second Peltier element 5b is attached to the second Peltier element 5b.
- thermocompression bonding head 30 has a plurality of other Peltier elements 5 whose upper limit of the usable temperature range is close to the temperature of the cooling unit 6 of the Peltier element 5 that has been previously attached. Peltier elements are superimposed.
- each Peltier element 5 can be gradually lowered toward the outside, and faces the components mounted on the transparent substrate 12 such as the panel display unit 15 and the electronic component 18.
- the cooling unit 6 of the Peltier element 5 can be set to a temperature that does not affect these components, for example, about room temperature.
- the mounting apparatus 1 to which the present invention is applied may heat-press the mounting components such as the electronic component 18 and the flexible substrate 21 by the Peltier element 5 superimposed on the thermocompression bonding head 30.
- the heating temperature of the thermocompression bonding head varies depending on the mounting component to be thermocompression bonded and the type of the anisotropic conductive film 23. Therefore, as shown in FIG. 4, when a plurality of different types of mounting parts are arranged and the temperature of the heating press is different, the thermocompression bonding head 30 has different temperatures depending on the superimposed Peltier elements 5.
- the Peltier element 5 having the optimum temperature for the mounted component can be arranged and heated and pressed. As a result, the mounting apparatus 1 can collectively mount a plurality of mounting components having different heating pressure temperatures.
- thermocompression bonding head to which the present invention is applied is connected to the first thermocompression bonding head 40 with a second thermocompression bonding head 41 having a different heating temperature via one or a plurality of Peltier elements 5. May be attached.
- the heating temperature of the second thermocompression bonding head 41 is lower than that of the first thermocompression bonding head 40, the temperature of the cooling unit 6 is between the second thermocompression bonding head 41 and the first thermocompression bonding head 40. Is attached to the Peltier element 5 so as to be close to the heat pressing temperature of the second thermocompression bonding head 41.
- thermocompression bonding head 41 when the heating temperature of the first thermocompression bonding head 40 is 200 ° C. and the heating temperature of the second thermocompression bonding head 41 is 130 ° C., the second thermocompression bonding head 41 A plurality of Peltier elements 5 are interposed between one thermocompression bonding head 40 and the temperature is gradually lowered, and the cooling unit 6 is attached to the Peltier element 5 having a temperature of about 130 ° C.
- the second thermocompression bonding head 41 has a plurality of Peltier elements 5 attached to the head body 41a.
- the outermost Peltier element 5 has a temperature at which the cooling unit 6 does not affect other components, for example, Set to 10 ° C.
- thermocompression bonding head 40 Even with such a thermocompression bonding head, a plurality of mounting components having different optimum heating temperatures can be collectively mounted by the first thermocompression bonding head 40 and the second thermocompression bonding head 41.
- thermocompression bonding head to which the present invention is applied covers other side surfaces including the side surface of the Peltier element 5 facing the electronic component 18 and the panel display unit 15 of the head main body 50a and the entire periphery. It is good also as the thermocompression-bonding head 50 formed in this way. This thermocompression bonding head 50 can prevent the heat of the head main body 50a from diffusing to the surroundings, and can suppress the influence of the heat on the surrounding mounting parts.
- thermocompression bonding head 50 may be attached by superimposing a plurality of Peltier elements 5 on the head main body 50a, like the thermocompression bonding head 30 described above.
- the thermocompression bonding head 50 can gradually lower the temperature of each Peltier element 5 as it goes outward, and faces the component parts mounted on the transparent substrate 12 such as the panel display unit 15 and the electronic component 18.
- the cooling unit 6 of the Peltier element 5 can be set to a temperature that does not affect these components, for example, about room temperature.
- thermocompression bonding head 50 like the thermocompression bonding head 40 described above, has one or a plurality of Peltier elements 5 on the other side including the side facing the electronic component 18 and the panel display unit 15 of the head main body 50a and the entire periphery. You may attach the 2nd thermocompression-bonding head from which heating temperature differs through this.
- the thermocompression bonding head 50 can collectively mount a plurality of mounting components having different optimum heating temperatures together with the second thermocompression bonding head.
- the thermocompression bonding head to which the present invention is applied does not include a heater in the head body 60a, and is heated to a predetermined temperature by the Peltier element 5 attached around the head body 60a.
- the thermocompression bonding head 60 may be used.
- the thermocompression bonding head 60 uses the Peltier element 5 in which the temperature of the heating unit 7 becomes the heating temperature of the mounted component, and dissipates the surface of the Peltier element 5 attached to the head main body 60a as the heating unit 7 to thereby radiate the head main body 60a. Heat.
- thermocompression bonding head 60 can be heated to a predetermined temperature without incorporating a heater.
- the thermocompression bonding head 60 can easily control the temperature by using the Peltier element 5.
- the thermocompression bonding head 60 can be heated uniformly by attaching the Peltier element 5 to the entire periphery of the head body 60a.
- thermocompression bonding head 60 may be attached by superimposing a plurality of Peltier elements 5 on the head main body 60a, like the thermocompression bonding head 30 described above. Thereby, the thermocompression bonding head 60 can gradually lower the temperature of each Peltier element 5 as it goes outward, and faces the component parts mounted on the transparent substrate 12 such as the panel display unit 15 and the electronic component 18.
- the cooling unit 6 of the Peltier element 5 can be set to a temperature that does not affect these components, for example, about room temperature.
- thermocompression bonding head 60 like the thermocompression bonding head 40 described above, has one or a plurality of Peltier elements 5 on other side surfaces including the side surface facing the electronic component 18 and the panel display unit 15 of the head main body 60a and the entire periphery. You may attach the 2nd thermocompression-bonding head from which heating temperature differs through this.
- the second thermocompression bonding head is also heated to a predetermined temperature by the Peltier element 5 without incorporating a heater. Further, the second thermocompression bonding head can also be heated uniformly by attaching the Peltier element 5 to the entire periphery of the head body. Thereby, the thermocompression bonding head 60 can collectively mount a plurality of mounting components having different optimum heating temperatures together with the second thermocompression bonding head.
- the head main bodies 3 b, 50 a, 60 a may be cooled by the Peltier element 5 after the mounting of the mounting components is completed.
- the Peltier element 5 since the Peltier element 5 reverses the direction in which the direct current flows, the heat transfer direction is also reversed, so that the cooling unit 6 and the heating unit 7 can be interchanged. Therefore, the thermocompression bonding heads 3, 50, 60 are raised by the head driving mechanism 4 after the mounting of the electronic component 18 and the flexible substrate 21 is finished, and flow the current of the Peltier element 5 in the reverse direction.
- thermocompression bonding heads 3, 50, 60 can cool the head main bodies 3b, 50a, 60a.
- the heating unit 7 of the Peltier element 5 is on the outside.
- the head driving mechanism 4 is raised and separated from the liquid crystal display panel 10, there is no influence of heat dissipation. .
- the head main body 3b, 50a, 60a side is changed to the heating unit 7 by returning the direction of the current to flow, and the panel display unit 15 or the electronic component 18 is restored.
- the component side such as the above can be used as the cooling unit 6.
- thermocompression bonding head may be configured by only the Peltier element 5.
- the thermocompression bonding head 70 uses the lower surface facing the electronic component 18 and the flexible substrate 21 of the heating unit 7 of the Peltier element 5 as a pressing surface.
- the present invention may be configured by connecting a pair of Peltier elements 5 as shown in FIG. 8B.
- the connection surface side of each Peltier element 5 is the heating unit 7, and the lower surface of the heating unit 7 facing the electronic component 18 and the flexible substrate 21 is the pressing surface.
- thermocompression bonding heads 70 and 80 use the component parts such as the electronic component 18 and the flexible substrate 21 as the cooling unit 6, the heat of the heating unit 7 can be prevented from being transmitted. Therefore, even when the distance between the panel display unit 15 and the COG mounting unit 20 or the distance between the COG mounting unit 20 and the FOG mounting unit is reduced and the heating unit 7 is close to the panel display unit 15 or the electronic component 18, Alteration, breakage, and the like due to thermal shock applied to each part of the panel display unit 15 can be prevented.
- thermocompression bonding heads 70 and 80 a plurality of Peltier elements 5 may be superposed and attached as in the thermocompression bonding head 30 described above.
- the thermocompression bonding heads 70 and 80 can gradually lower the temperature of each Peltier element 5 as it goes outward, so that the components mounted on the transparent substrate 12 such as the panel display unit 15 and the electronic component 18 can be reduced.
- the cooling part 6 of the facing Peltier element 5 can be set to a temperature that does not affect these components, for example, about room temperature.
- thermocompression bonding head 3a pressing surface
- 3b head body 4 head drive mechanism
- 10 liquid crystal display panel 11, 12 transparent substrate, 12a edge, 13 seal
- 14 liquid crystal 15 panel display unit 16
- 17 transparent electrode 18 electronic components
- 20 COG mounting part 21 flexible substrate
- 22 FOG mounting part 23 anisotropic conductive film
- 24 alignment film 25
Abstract
Description
本出願は、日本国において2010年12月24日に出願された日本特許出願番号特願2010-288320を基礎として優先権を主張するものであり、この出願は参照されることにより、本出願に援用される。
実装装置1は、このような液晶表示パネル10のCOG実装部20に電子部品18を実装し、またFOG実装部22にフレキシブル基板21を実装するものであり、図1に示すように、液晶表示パネル10が載置されるステージ2と、ステージ2に載置された液晶表示パネル10の各実装部20,22に液晶駆動用IC等の電子部品18やフレキシブル基板21を実装する熱圧着ヘッド3と、熱圧着ヘッド3を各実装部20,22に近接離間させるヘッド駆動機構4とを備える。
このような熱圧着ヘッド3を駆動するヘッド駆動機構4は、熱圧着ヘッド3をCOG実装部20やFOG実装部22に近接離間するように昇降自在に支持するとともに、ヘッド本体3bの昇降動作及びヘッド本体3bに内蔵されたヒーターの駆動を制御する。そして、ヘッド駆動機構4は、電子部品18やフレキシブル基板21の実装時には、ヘッド本体3b内のヒーターを駆動して所定温度に加熱するとともに、熱圧着ヘッド3を所定時間、所定の圧力で電子部品18やフレキシブル基板21を押圧するように駆動する。
次いで、かかる実装装置1を用いて液晶表示パネル10にCOG実装及びFOG実装を行う工程について説明する。図1に示すように、実装装置1は、ステージ2上に、液晶表示パネル10が位置決めされて載置される。このとき、液晶表示パネル10は、透明基板11,12がシール13によって貼り合わされ、内部空間に液晶が封入されている。また、液晶表示パネル10は、相対向する内側表面に透明電極16,17が設けられ、透明基板12の縁部には、それぞれ透明電極17の端子部17aが形成されたCOG実装部20及びFOG実装部22が設けられている。さらに、液晶表示パネル10は、透明電極16,17上には、所定のラビング処理が施された配向膜24が形成されている。また、透明基板11,12の外側には一対の偏光板25,26が配設されている。
次いで、本発明が適用された熱圧着ヘッドの変形例について説明する。この熱圧着ヘッド30は、図3に示すように、ヘッド本体30aに複数のペルチェ素子5a、5b、5c・・・が重畳して取り付けられている。各ペルチェ素子5は、冷却部6と加熱部7との温度差、及び使用可能な温度範囲といった温度特性が異なるものが用いられる。
また、本発明が適用された実装装置1は、この熱圧着ヘッド30に重畳されたペルチェ素子5によっても、電子部品18やフレキシブル基板21等の実装部品を加熱押圧しても良い。実装装置1は、熱圧着する実装部品や異方性導電フィルム23の種類によって熱圧着ヘッドの加熱温度が変わる。したがって、図4に示すように、種類の異なる複数の実装部品が配列され、それぞれ加熱押圧の温度が異なる場合に、熱圧着ヘッド30は、重畳されたペルチェ素子5によって温度が異なることから、各実装部品に最適な温度を有するペルチェ素子5を配して加熱押圧することができる。これにより、実装装置1は、加熱押圧の温度が異なる複数の実装部品を一括して実装することができる。
また、図5に示すように、本発明が適用された熱圧着ヘッドは、第1の熱圧着ヘッド40に、一又は複数のペルチェ素子5を介して加熱温度の異なる第2の熱圧着ヘッド41を取り付けるようにしてもよい。第2の熱圧着ヘッド41が第1の熱圧着ヘッド40よりも加熱温度が低い場合、第2の熱圧着ヘッド41には、第1の熱圧着ヘッド40との間に、冷却部6の温度が第2の熱圧着ヘッド41の熱加圧温度に近くなるようなペルチェ素子5が取り付けられる。
また、本発明が適用された熱圧着ヘッドは、図6に示すように、ペルチェ素子5をヘッド本体50aの電子部品18やパネル表示部15と面する側面を含む他の側面や全周囲に亘って形成された熱圧着ヘッド50としてもよい。この熱圧着ヘッド50は、ヘッド本体50aの熱が周囲に拡散することを防止することができ、周囲の実装部位に対する熱による影響を抑えることができる。
また、本発明が適用された熱圧着ヘッドは、図7に示すように、ヘッド本体60a内にヒーターを内蔵せず、ヘッド本体60aの周囲に取り付けたペルチェ素子5によって所定の温度に加熱される熱圧着ヘッド60としてもよい。この熱圧着ヘッド60は、加熱部7の温度が実装部品の加熱温度となるペルチェ素子5を用い、当該ペルチェ素子5のヘッド本体60aに取り付けられた面を加熱部7として放熱させ、ヘッド本体60aを加熱する。
また、本発明が適用された熱圧着ヘッド3、50、60は、実装部品の実装が終了した後に、ヘッド本体3b、50a、60aをペルチェ素子5によって冷却してもよい。上述したように、ペルチェ素子5は、直流電流を流す方向を逆にすることにより、熱の移動方向も逆になるので、冷却部6と加熱部7を入れ替えることが可能である。したがって、熱圧着ヘッド3、50、60は、電子部品18やフレキシブル基板21の実装が終了した後、ヘッド駆動機構4によって上昇され、ペルチェ素子5の電流の方向を逆にして流す。
また、本発明は、図8Aに示すように、熱圧着ヘッドをペルチェ素子5のみで構成してもよい。この熱圧着ヘッド70は、ペルチェ素子5の加熱部7の電子部品18やフレキシブル基板21と対峙する下面を押圧面とする。
Claims (20)
- 熱硬化性の接着剤層を介して実装部品を熱加圧することにより実装部に上記実装部品を接続する熱圧着ヘッドにおいて、
上記熱圧着ヘッドは、ペルチェ素子を有し、
上記ペルチェ素子は、上記実装部品を熱加圧する際に、上記実装部近傍に設けられた他の構成部品と対峙する面側を冷却部とする熱圧着ヘッド。 - 上記ペルチェ素子は、少なくともヘッド本体の上記実装部近傍に設けられた他の構成部品に面する側に設けられ、
上記実装部品を熱加圧する際に、上記ペルチェ素子は上記ヘッド本体と対峙する面側を加熱部とする請求項1記載の熱圧着ヘッド。 - 複数の上記ペルチェ素子が重畳され、上記ヘッド本体と接触する上記ペルチェ素子の加熱部は上記実装部品の熱加圧温度とされ、上記他の構成部品に面する上記ペルチェ素子の冷却部は上記他の構成部品に影響を与えない温度とされている請求項2に記載の熱圧着ヘッド。
- 上記ペルチェ素子で上記実装部品を熱加圧する請求項1~請求項3のいずれか1項に記載の熱圧着ヘッド。
- 上記ペルチェ素子が上記ヘッド本体の全周囲に設けられている請求項2~請求項4のいずれか1項に記載の熱圧着ヘッド。
- 上記実装部品を熱加圧する際に、上記ヘッド本体が上記ペルチェ素子によって加熱される請求項2~請求項5のいずれか1項に記載の熱圧着ヘッド。
- 上記実装部品を熱加圧した後、上記ヘッド本体が上記ペルチェ素子によって冷却される請求項6記載の熱圧着ヘッド。
- 上記ペルチェ素子のみからなる請求項1に記載の熱圧着ヘッド。
- 複数の上記ペルチェ素子が重畳され、上記実装部品を熱加圧する上記ペルチェ素子の加熱部は上記実装部品の熱加圧温度とされ、上記他の構成部品に面する上記ペルチェ素子の冷却部は上記他の構成部品に影響を与えない温度とされている請求項8に記載の熱圧着ヘッド。
- 熱硬化性の接着剤層を介して実装部品を熱加圧することにより実装部に上記実装部品を接続する熱圧着ヘッドと、
上記熱圧着ヘッドを実装部品が接続される上記実装部に対峙させ、該実装部と近接離間させるヘッド駆動機構とを備え、
上記熱圧着ヘッドは、ペルチェ素子を有し、
上記ペルチェ素子は、上記実装部品を熱加圧する際に、上記実装部近傍に設けられた他の構成部品と対峙する面側を冷却部とする実装装置。 - 実装部上に熱硬化性の接着剤層を介して実装部品を載置する工程と、
ペルチェ素子を有する熱圧着ヘッドによって上記実装部品を上記実装部上に熱加圧する工程とを有し、
上記熱加圧工程において、上記ペルチェ素子は、上記実装部近傍に設けられた他の構成部品と対峙する面側を冷却部とする実装方法。 - 上記ペルチェ素子は、少なくともヘッド本体の上記実装部近傍に設けられた他の構成部品に面する側に設けられ、
上記実装部品を熱加圧する際に、上記ペルチェ素子は上記ヘッド本体と対峙する面側を加熱部とする請求項11に記載の実装方法。 - 複数の上記ペルチェ素子が重畳され、上記熱圧着ヘッドと接触する上記ペルチェ素子の加熱部は上記実装部品の熱加圧温度とされ、上記他の構成部品に面する上記ペルチェ素子の冷却部は上記他の構成部品に影響を与えない温度とされている請求項12に記載の実装方法。
- 上記ペルチェ素子が上記ヘッド本体の全周囲に設けられている請求項12又は請求項13に記載の実装方法。
- 上記熱圧着ヘッドは、上記実装部品を熱加圧する際に、上記ヘッド本体が上記ペルチェ素子によって加熱される請求項12~請求項14のいずれか1項に記載の実装方法。
- 上記熱圧着ヘッドは、上記実装部品を熱加圧した後、上記ヘッド本体が上記ペルチェ素子によって冷却される請求項15に記載の実装方法。
- 蒸気熱圧着ヘッドは、上記ペルチェ素子のみからなる請求項11に記載の実装方法。
- 複数の上記ペルチェ素子が重畳され、上記実装部品を熱加圧する上記ペルチェ素子の加熱部は上記実装部品の熱加圧温度とされ、上記他の構成部品に面する上記ペルチェ素子の冷却部は上記他の構成部品に影響を与えない温度とされている請求項17に記載の実装方法。
- 上記熱硬化性の接着剤層は、異方導電性接着フィルムまたは絶縁性接着フィルムである請求項11~請求項18のいずれか1項に記載の実装方法。
- 請求項11~請求項19のいずれか1項に記載の実装方法により製造された接合体。
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