JP2012099599A5 - - Google Patents
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- Publication number
- JP2012099599A5 JP2012099599A5 JP2010245150A JP2010245150A JP2012099599A5 JP 2012099599 A5 JP2012099599 A5 JP 2012099599A5 JP 2010245150 A JP2010245150 A JP 2010245150A JP 2010245150 A JP2010245150 A JP 2010245150A JP 2012099599 A5 JP2012099599 A5 JP 2012099599A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- gate insulating
- forming
- semiconductor device
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010245150A JP5668414B2 (ja) | 2010-11-01 | 2010-11-01 | 半導体装置の製造方法 |
| KR1020127026283A KR20130122514A (ko) | 2010-11-01 | 2011-10-19 | 반도체 장치 및 그 제조 방법 |
| EP11837874.4A EP2637213A4 (en) | 2010-11-01 | 2011-10-19 | SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREFOR |
| CN201180018726.2A CN102844871B (zh) | 2010-11-01 | 2011-10-19 | 半导体装置及其制造方法 |
| US13/581,980 US8691679B2 (en) | 2010-11-01 | 2011-10-19 | Semiconductor device and method of manufacturing the same |
| PCT/JP2011/073996 WO2012060223A1 (ja) | 2010-11-01 | 2011-10-19 | 半導体装置およびその製造方法 |
| CA2791183A CA2791183A1 (en) | 2010-11-01 | 2011-10-19 | Semiconductor device and method of manufacturing the same |
| TW100138735A TW201222820A (en) | 2010-11-01 | 2011-10-25 | Semiconductor device and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010245150A JP5668414B2 (ja) | 2010-11-01 | 2010-11-01 | 半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012099599A JP2012099599A (ja) | 2012-05-24 |
| JP2012099599A5 true JP2012099599A5 (enExample) | 2013-07-25 |
| JP5668414B2 JP5668414B2 (ja) | 2015-02-12 |
Family
ID=46024340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010245150A Expired - Fee Related JP5668414B2 (ja) | 2010-11-01 | 2010-11-01 | 半導体装置の製造方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8691679B2 (enExample) |
| EP (1) | EP2637213A4 (enExample) |
| JP (1) | JP5668414B2 (enExample) |
| KR (1) | KR20130122514A (enExample) |
| CN (1) | CN102844871B (enExample) |
| CA (1) | CA2791183A1 (enExample) |
| TW (1) | TW201222820A (enExample) |
| WO (1) | WO2012060223A1 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014003253A (ja) * | 2012-06-21 | 2014-01-09 | Sumitomo Electric Ind Ltd | 炭化珪素半導体装置 |
| JP5875684B2 (ja) * | 2012-07-09 | 2016-03-02 | 株式会社日立製作所 | Ｍｏｓ型電界効果トランジスタ |
| JP2014063948A (ja) * | 2012-09-24 | 2014-04-10 | Sumitomo Electric Ind Ltd | 炭化珪素半導体装置の製造方法 |
| JP2014078659A (ja) * | 2012-10-12 | 2014-05-01 | Sumitomo Electric Ind Ltd | 半導体装置の製造方法 |
| WO2014065018A1 (ja) | 2012-10-23 | 2014-05-01 | 富士電機株式会社 | 半導体装置の製造方法 |
| EP2763159A1 (en) * | 2013-01-30 | 2014-08-06 | University College Cork | Improved low resistance contacts for semiconductor devices |
| DE112015000137T5 (de) | 2014-04-18 | 2016-04-28 | Fuji Electric Co., Ltd. | Verfahren zum Herstellen einer Halbleitervorrichtung |
| JP5939363B2 (ja) | 2014-04-18 | 2016-06-22 | 富士電機株式会社 | 半導体装置の製造方法 |
| WO2015159437A1 (ja) * | 2014-04-18 | 2015-10-22 | 富士電機株式会社 | 半導体装置の製造方法 |
| JP2016046311A (ja) * | 2014-08-20 | 2016-04-04 | 住友電気工業株式会社 | 炭化珪素半導体装置 |
| JP6387791B2 (ja) | 2014-10-29 | 2018-09-12 | 富士電機株式会社 | 半導体装置の製造方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1131548C (zh) | 1997-04-04 | 2003-12-17 | 松下电器产业株式会社 | 半导体装置 |
| JP3184115B2 (ja) * | 1997-04-11 | 2001-07-09 | 松下電器産業株式会社 | オーミック電極形成方法 |
| US6599644B1 (en) * | 2000-10-06 | 2003-07-29 | Foundation For Research & Technology-Hellas | Method of making an ohmic contact to p-type silicon carbide, comprising titanium carbide and nickel silicide |
| JP2004158702A (ja) * | 2002-11-07 | 2004-06-03 | C Tekku:Kk | 半導体装置製造方法 |
| US20050104072A1 (en) * | 2003-08-14 | 2005-05-19 | Slater David B.Jr. | Localized annealing of metal-silicon carbide ohmic contacts and devices so formed |
| CN100483631C (zh) * | 2003-08-14 | 2009-04-29 | 克里公司 | 金属-碳化硅欧姆接触的局部退火及其形成的装置 |
| US8866150B2 (en) * | 2007-05-31 | 2014-10-21 | Cree, Inc. | Silicon carbide power devices including P-type epitaxial layers and direct ohmic contacts |
| EP2280417B1 (en) * | 2008-04-15 | 2015-07-22 | Sumitomo Electric Industries, Ltd. | Semiconductor device and method for manufacturing the same |
| JP2010087397A (ja) | 2008-10-02 | 2010-04-15 | Sumitomo Electric Ind Ltd | 炭化珪素半導体装置 |
| US8188538B2 (en) * | 2008-12-25 | 2012-05-29 | Rohm Co., Ltd. | Semiconductor device and method of manufacturing semiconductor device |
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2010
- 2010-11-01 JP JP2010245150A patent/JP5668414B2/ja not_active Expired - Fee Related
-
2011
- 2011-10-19 CA CA2791183A patent/CA2791183A1/en not_active Abandoned
- 2011-10-19 WO PCT/JP2011/073996 patent/WO2012060223A1/ja not_active Ceased
- 2011-10-19 US US13/581,980 patent/US8691679B2/en active Active
- 2011-10-19 EP EP11837874.4A patent/EP2637213A4/en not_active Ceased
- 2011-10-19 KR KR1020127026283A patent/KR20130122514A/ko not_active Withdrawn
- 2011-10-19 CN CN201180018726.2A patent/CN102844871B/zh not_active Expired - Fee Related
- 2011-10-25 TW TW100138735A patent/TW201222820A/zh unknown