JP2013175717A5 - - Google Patents
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- Publication number
- JP2013175717A5 JP2013175717A5 JP2013009852A JP2013009852A JP2013175717A5 JP 2013175717 A5 JP2013175717 A5 JP 2013175717A5 JP 2013009852 A JP2013009852 A JP 2013009852A JP 2013009852 A JP2013009852 A JP 2013009852A JP 2013175717 A5 JP2013175717 A5 JP 2013175717A5
- Authority
- JP
- Japan
- Prior art keywords
- film
- metal element
- oxide semiconductor
- forming
- semiconductor film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 24
- 239000002184 metal Substances 0.000 claims 16
- 238000010438 heat treatment Methods 0.000 claims 5
- 238000004519 manufacturing process Methods 0.000 claims 5
- 229910044991 metal oxide Inorganic materials 0.000 claims 5
- 150000004706 metal oxides Chemical class 0.000 claims 5
- 238000000034 method Methods 0.000 claims 5
- 239000002019 doping agent Substances 0.000 claims 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 3
- 239000012299 nitrogen atmosphere Substances 0.000 claims 3
- 239000001301 oxygen Substances 0.000 claims 3
- 229910052760 oxygen Inorganic materials 0.000 claims 3
- 238000005530 etching Methods 0.000 claims 2
- 239000007789 gas Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013009852A JP6080563B2 (ja) | 2012-01-23 | 2013-01-23 | 半導体装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012011281 | 2012-01-23 | ||
| JP2012011281 | 2012-01-23 | ||
| JP2013009852A JP6080563B2 (ja) | 2012-01-23 | 2013-01-23 | 半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013175717A JP2013175717A (ja) | 2013-09-05 |
| JP2013175717A5 true JP2013175717A5 (enExample) | 2016-03-03 |
| JP6080563B2 JP6080563B2 (ja) | 2017-02-15 |
Family
ID=49268335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013009852A Expired - Fee Related JP6080563B2 (ja) | 2012-01-23 | 2013-01-23 | 半導体装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6080563B2 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6345544B2 (ja) * | 2013-09-05 | 2018-06-20 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US9455349B2 (en) * | 2013-10-22 | 2016-09-27 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor thin film transistor with reduced impurity diffusion |
| JP2016001712A (ja) * | 2013-11-29 | 2016-01-07 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP6444745B2 (ja) | 2015-01-22 | 2018-12-26 | 東芝メモリ株式会社 | 半導体装置及びその製造方法 |
| US11024725B2 (en) * | 2015-07-24 | 2021-06-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device including metal oxide film |
| EP3329515A4 (en) * | 2015-07-31 | 2019-07-03 | Intel Corporation | FUNCTIONAL METAL OXIDE-BASED MICROELECTRONIC DEVICES |
| JP6725357B2 (ja) * | 2015-08-03 | 2020-07-15 | 株式会社半導体エネルギー研究所 | 半導体装置、半導体装置の作製方法 |
| US10957801B2 (en) * | 2017-02-07 | 2021-03-23 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
| US11152512B2 (en) | 2017-05-19 | 2021-10-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, display device, and method for manufacturing semiconductor device |
| JP7237822B2 (ja) * | 2017-05-19 | 2023-03-13 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US12581637B2 (en) * | 2021-03-05 | 2026-03-17 | Applied Materials Inc. | Methods and structures for three-dimensional dynamic random-access memory |
| EP4286339B1 (en) * | 2022-05-31 | 2025-01-29 | Imec VZW | Mixed metal oxides |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7378286B2 (en) * | 2004-08-20 | 2008-05-27 | Sharp Laboratories Of America, Inc. | Semiconductive metal oxide thin film ferroelectric memory transistor |
| JP5415001B2 (ja) * | 2007-02-22 | 2014-02-12 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| KR101496148B1 (ko) * | 2008-05-15 | 2015-02-27 | 삼성전자주식회사 | 반도체소자 및 그 제조방법 |
| JP5708910B2 (ja) * | 2010-03-30 | 2015-04-30 | ソニー株式会社 | 薄膜トランジスタおよびその製造方法、並びに表示装置 |
| WO2011132591A1 (en) * | 2010-04-23 | 2011-10-27 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| DE112011101395B4 (de) * | 2010-04-23 | 2014-10-16 | Semiconductor Energy Laboratory Co., Ltd. | Verfahren zum Herstellen einer Halbleitervorrichtung |
| JP2012015436A (ja) * | 2010-07-05 | 2012-01-19 | Sony Corp | 薄膜トランジスタおよび表示装置 |
-
2013
- 2013-01-23 JP JP2013009852A patent/JP6080563B2/ja not_active Expired - Fee Related
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