JP2012080056A - 基板搭載用カセット - Google Patents
基板搭載用カセット Download PDFInfo
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- JP2012080056A JP2012080056A JP2010288457A JP2010288457A JP2012080056A JP 2012080056 A JP2012080056 A JP 2012080056A JP 2010288457 A JP2010288457 A JP 2010288457A JP 2010288457 A JP2010288457 A JP 2010288457A JP 2012080056 A JP2012080056 A JP 2012080056A
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- cassette
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- 239000000758 substrate Substances 0.000 title claims abstract description 117
- 230000003028 elevating effect Effects 0.000 claims description 15
- 238000003780 insertion Methods 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 6
- 230000008859 change Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 32
- 230000008569 process Effects 0.000 description 32
- 238000012546 transfer Methods 0.000 description 13
- 238000003860 storage Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 238000013404 process transfer Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/46—Machines having sequentially arranged operating stations
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Abstract
【解決手段】上下に離隔して配置される上部フレームと下部フレーム及び内側に基板を支持する複数の第1支持バーが形成されて、上部フレームと下部フレームの両側に垂直方向に配置されるサイドフレームによってボックスを形成し、内側に基板を収納するカセット本体と、内側に基板を支持する複数の第2支持バーが形成されて、上部フレームと下部フレームの前方または後方に垂直方向に配置されるセンターフレームと、該センターフレームとカセット本体との間に設けられて、センターフレームをカセット本体に脱着可能に接続する接続部材と、を備えることを特徴とする。
【選択図】図3
Description
111…上部フレーム
112…下部フレーム
113…サイドフレーム
113a…支持バー
120…センターフレーム
121…サポートバー
130…接続部材
131…第1の固定部
131a…回動軸
132…第2の固定部
132b…挿入孔
140…昇降部材
141…支持フレーム
142…操作部
142a…レバー
142b…作用軸
142c…固定ブロック
142d…接続ブラケット
143…ガイド部材
143a…ガイドレール
143b…スライダ
144…第1のストッパ
145…第2のストッパ
Claims (10)
- 上下に離隔して配置される上部フレームと下部フレーム及び内側に基板を支持する複数の第1支持バーが形成されて、前記上部フレームと下部フレームの両側に垂直方向に配置されるサイドフレームによってボックスを形成し、内側に基板を収納するカセット本体と、
内側に基板を支持する複数の第2支持バーが形成されて、前記上部フレームと下部フレームの前方または後方に垂直方向に配置されるセンターフレームと、
該センターフレームと前記カセット本体との間に設けられて、前記センターフレームを前記カセット本体に脱着可能に接続する接続部材と、
を備えることを特徴とする基板搭載用カセット。 - 前記接続部材が、カセット本体に固定される第1の固定部と、センターフレーム側に固定されて、前記第1の固定部に着脱可能に取付けられる第2の固定部とからなり、前記第1の固定部が、カセット本体の前方と後方に各々設けられることを特徴とする請求項1に記載の基板搭載用カセット。
- 前記第1の固定部と第2の固定部とに、回動軸と回動軸挿入孔とが各々形成されて、相互が回動可能に組み立てられることを特徴とする請求項2に記載の基板搭載用カセット。
- 前記センターフレームと前記接続部材との間に設けられて、前記センターフレームを垂直方向に昇降させる昇降部材をさらに備えることを特徴とする請求項1〜3のいずれか1項に記載の基板搭載用カセット。
- 前記昇降部材が、前記上部フレームと前記下部フレームとの間に垂直方向に配置される支持フレームと、該支持フレームに設けられて、前記センターフレームの昇降駆動を制御する操作部とを備えることを特徴とする請求項4に記載の基板搭載用カセット。
- 前記支持フレーム上で前記センターフレームの垂直方向移動を案内するガイド部材が前記支持フレームと前記センターフレームとの間に設けられることを特徴とする請求項5に記載の基板搭載用カセット。
- 前記操作部が、前記支持フレームに回動可能に設けられるレバーと、該レバーの回動によって垂直方向に昇降する作用軸と、該作用軸とセンターフレームとを接続する接続ブラケットとからなることを特徴とする請求項5または6に記載の基板搭載用カセット。
- 前記レバーが、トグルクランプからなることを特徴とする請求項7に記載の基板搭載用カセット。
- 前記支持フレームが、前記レバーのロック位置を前記支持フレーム側に固定する第1のストッパを設けることを特徴とする請求項8に記載の基板搭載用カセット。
- 前記接続部材によって前記カセット本体に回動可能に接続される前記支持フレームに、前記支持フレームと前記カセット本体とを固定して前記支持フレームの任意回動を防止する第2のストッパを設けることを特徴とする請求項9に記載の基板搭載用カセット。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2010-0096061 | 2010-10-01 | ||
KR1020100096061A KR101212889B1 (ko) | 2010-10-01 | 2010-10-01 | 기판 적재용 카세트 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012080056A true JP2012080056A (ja) | 2012-04-19 |
JP5714319B2 JP5714319B2 (ja) | 2015-05-07 |
Family
ID=45888882
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010288457A Active JP5714319B2 (ja) | 2010-10-01 | 2010-12-24 | 基板搭載用カセット |
Country Status (5)
Country | Link |
---|---|
US (1) | US8528750B2 (ja) |
JP (1) | JP5714319B2 (ja) |
KR (1) | KR101212889B1 (ja) |
CN (1) | CN102442492B (ja) |
TW (1) | TWI515157B (ja) |
Cited By (1)
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2010
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- 2010-12-20 US US12/972,843 patent/US8528750B2/en active Active
- 2010-12-22 TW TW099145178A patent/TWI515157B/zh active
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JP2006245470A (ja) * | 2005-03-07 | 2006-09-14 | Shinko Electric Co Ltd | 基板収納容器 |
JP2009177050A (ja) * | 2008-01-28 | 2009-08-06 | Shin Etsu Polymer Co Ltd | 処理治具用の収納容器 |
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JP2013169999A (ja) * | 2012-02-22 | 2013-09-02 | Sharp Corp | 積載梱包具及び梱包方法 |
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JP5714319B2 (ja) | 2015-05-07 |
CN102442492A (zh) | 2012-05-09 |
TW201215548A (en) | 2012-04-16 |
TWI515157B (zh) | 2016-01-01 |
CN102442492B (zh) | 2015-08-26 |
KR20120034472A (ko) | 2012-04-12 |
US8528750B2 (en) | 2013-09-10 |
KR101212889B1 (ko) | 2012-12-14 |
US20120080354A1 (en) | 2012-04-05 |
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