WO2023070900A1 - 一种晶圆盒对位翻转机构及装置 - Google Patents

一种晶圆盒对位翻转机构及装置 Download PDF

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Publication number
WO2023070900A1
WO2023070900A1 PCT/CN2021/139137 CN2021139137W WO2023070900A1 WO 2023070900 A1 WO2023070900 A1 WO 2023070900A1 CN 2021139137 W CN2021139137 W CN 2021139137W WO 2023070900 A1 WO2023070900 A1 WO 2023070900A1
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WIPO (PCT)
Prior art keywords
assembly
fixing plate
wafer
positioning
seat
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PCT/CN2021/139137
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English (en)
French (fr)
Inventor
钱诚
童建
周志勇
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江苏亚电科技有限公司
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Application filed by 江苏亚电科技有限公司 filed Critical 江苏亚电科技有限公司
Priority to CN202180077560.5A priority Critical patent/CN116648779A/zh
Publication of WO2023070900A1 publication Critical patent/WO2023070900A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the application belongs to the technical field of wafer production equipment, and in particular relates to a wafer box alignment and flipping mechanism and device.
  • the wafer During the process of being processed and polished, the wafer will be polluted due to contact with various organic substances, particles and metals. For example, it is necessary to remove photoresist, etchant, and remove particles. Therefore, wafer cleaning is required to remove pollution. thing.
  • the technical problem to be solved by the present invention is: in order to solve the deficiencies in the prior art, thereby providing a wafer box alignment and flipping that can automatically position and flip the wafer box so as to facilitate the transfer of wafers in different wafer boxes Mechanisms and devices.
  • a wafer cassette alignment and flipping mechanism comprising:
  • the first rotating assembly includes a first rotating seat for carrying the wafer cassette, a first rotating shaft and a first rotating drive motor, the first rotating driving motor can drive the first rotating seat to rotate around the first
  • the shaft rotates, and also includes a first positioning assembly and a pushing assembly fixed on the first rotating seat;
  • the first rotating base includes a first sending out fixing plate and a second sending out fixing plate which are perpendicular to each other;
  • the first positioning assembly includes a first sliding positioning seat arranged on the first sending out fixing plate, two first fixed positioning blocks arranged on one side of the first sliding positioning seat, and two first fixed positioning blocks arranged on the other side of the first sliding positioning seat There are two first sliding positioning blocks on one side, and the first sliding positioning driver pushes the first sliding positioning block close to or away from the first fixed positioning block to perform four-corner positioning on the bottom of the wafer box;
  • a second fixed positioning block is arranged on the side of the plate away from the first sending out fixing plate;
  • the sliding positioning seat is driven by the second sliding positioning driver so that the sliding positioning seat approaches or moves away from the second receiving and fixing plate;
  • the pushing assembly is used to push the wafer in the wafer box on the first rotating assembly toward the opening direction of the wafer box.
  • the wafer cassette alignment and turnover mechanism of the present invention further includes: a second rotary assembly opposite to the first rotary assembly, and the second rotary assembly includes a second rotary seat for carrying the wafer cassette , the second rotating shaft and the second rotating driving motor, the second rotating driving motor can drive the second rotating base to rotate around the second rotating shaft;
  • the second rotating seat includes a first receiving and fixing plate and a second receiving and fixing plate which are perpendicular to each other;
  • the second positioning assembly includes a second sliding positioning seat arranged on the first receiving and fixing plate, two third fixed positioning blocks arranged on one side of the second sliding positioning seat, and arranged on the other side of the second sliding positioning seat Two second sliding positioning blocks, the receiving end sliding positioning driver pushes the second sliding positioning block close to or away from the third fixed positioning block to perform four-corner positioning on the bottom of the wafer box; it is also included on the second receiving fixing plate A fourth fixed positioning block is provided at a position away from the side of the first receiving and fixing plate.
  • the push assembly includes a push rod, a push slide rail and a push driver, and the push driver drives the push rod to move on the push slide rail, so that the push rod passes through the first rotation
  • the first through hole on the seat pushes the wafer in the wafer cassette into the wafer cassette on the second rotating assembly to complete cassette rewinding.
  • the first receiving and fixing plate, the second receiving and fixing plate, the first fixed positioning block, the second fixed positioning block, the third fixed positioning block and the fourth fixed positioning block are all It is L-shaped.
  • the second emitting fixing plate and the second receiving fixing plate are respectively provided with rollers to support and fix the first sliding positioning seat and the second sliding positioning seat.
  • the sliding positioning seat is driven by the second sliding positioning driver to make the sliding positioning seat approach or move away from the second receiving and fixing plate.
  • the wafer cassette alignment and flipping mechanism of the present invention is further provided with a lifting assembly at the second rotating assembly for jacking up the wafer cassette of the second rotating assembly.
  • the lifting assembly includes a lifting block and a lifting drive member, and the lifting drive member drives the lifting block to pass through the second through hole to lift the wafer cassette out .
  • a clamping block for clamping the edge of the wafer box is provided at the middle position of the second emitting fixing plate and the second receiving fixing plate.
  • the wafer cassette alignment and turning mechanism of the present invention there is a V-shaped locking groove in the middle of the locking block.
  • the wafer box alignment and turning mechanism of the present invention When the wafer box alignment and turning mechanism of the present invention is working, the wafer box is placed on the first rotating seat first, and the first fixed positioning block and the first side positioning block are initially fixed to the bottom of the wafer box, and the The end sliding positioning driver pushes the wafer box against the first fixed positioning block to fix the wafer box. Then, the sliding positioning driver at the sending end pushes the wafer box close to the first fixed positioning block to fix the side wall of the wafer box. Since both sides of the wafer box are fixed, the wafer box will not loosen when the first rotating seat is turned over by 90 degrees, and after turning over, the pushing assembly completes the pushing out of the wafer.
  • the wafer box alignment and turning mechanism of the present invention realizes the automatic separation of the wafer and the wafer box.
  • FIG. 1 is a schematic structural view of a wafer reversing device according to an embodiment of the present application
  • Fig. 2 is the structural representation of the workbench place of the embodiment of the present application.
  • Fig. 3 is a schematic structural view of the first rotating assembly and the second rotating assembly of the embodiment of the present application when they are opened;
  • Fig. 4 is a structural schematic view of the docking of the first rotary assembly and the second rotary assembly of the embodiment of the present application; (although two wafer cassettes have wafers in the figure, usually only one wafer cassette has wafers )
  • Fig. 5 is a schematic structural view of the side view when the first rotary assembly and the second rotary assembly of the embodiment of the application are docked; (although there are wafers in both wafer cassettes in the figure, usually there is only one wafer box with wafers)
  • Fig. 6 is a schematic structural diagram of a first rotating assembly according to an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of a second rotating assembly with a wafer cassette according to an embodiment of the present application.
  • Fig. 8 is a schematic structural diagram of the second rotating assembly without a wafer cassette in the embodiment of the present application.
  • Fig. 9 is a schematic structural view of the lifting assembly of the embodiment of the present application.
  • FIG. 10 is a schematic structural diagram of the position of the rollers in the embodiment of the present application.
  • connection should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it may be mechanically connected or electrically connected; it may be directly connected or indirectly connected through an intermediary, and it may be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application based on specific situations.
  • This embodiment provides a wafer cassette alignment flip mechanism, as shown in Figure 2, including:
  • the first rotating assembly 31 is used to carry the wafer box 9 with wafers, including the first rotating seat 311 for carrying the wafer box, the first rotating shaft 312 and the first rotating drive Motor 313, the first rotation drive motor 313 can drive the first rotating base 311 to rotate around the first rotating shaft 312, and also includes the first positioning assembly 314 and the pushing assembly 319 (first positioning assembly) fixed on the first rotating base 311 Assembly 314 and push assembly 319 all follow the first rotating seat 311 movement);
  • the first rotating seat 311 includes a first sending out fixing plate 3111 and a second sending out fixing plate 3112 which are perpendicular to each other;
  • the first positioning assembly 314, as shown in Figure 7, includes a first sliding positioning seat 3140 arranged on the first fixed plate 3111, and two first fixed positioning blocks 3143 arranged on one side of the first sliding positioning seat 3140 , the two first side positioning blocks 3144 arranged on the other side of the first sliding positioning seat 3140, the sending end sliding positioning driver 3145 pushes the wafer box close to the first fixed positioning block 3143 to align the side wall of the wafer box 9
  • the sliding positioning driver 3145 at the sending end pushes the positioning rod and the first fixed positioning block 3143 on the other side to complete the fixing of the wafer cassette;
  • the position on one side of 3111 is provided with a second fixed positioning block 3141; when the first rotating seat 311 is overturned (from the state in Fig.
  • the wafer cassette 9 is first supported by the first fixed plate 3111, and the second A sliding positioning seat 3140 is slid close to the second fixed positioning block 3141, so that the wafer cassette is against the second sending out fixing plate 3112, flipped over to make the wafer “fall down”, and the first sending out fixing plate 3111 is supported by the first sliding positioning
  • the driver 3146 clamps the wafer cassette 9, and when the wafer cassette 9 needs to be grabbed, the first sliding positioning seat 3140 slides and breaks away from the fixation of the wafer cassette 9.
  • the sliding positioning seat 3240 is driven by the second sliding positioning driver 3246 so that the sliding positioning seat 3240 approaches or moves away from the second receiving and fixing plate 3212;
  • the push assembly 319 includes a push rod 3191, a push slide rail 3192 and a push driver 3193, and the push driver 3193 drives the push rod 3191 to move on the push slide rail 3192, so that the push rod 3191 passes through the first rotating seat 311.
  • the through hole 31111 pushes the wafer on the wafer cassette 9 into the wafer cassette on the second rotating assembly 32 to complete the rewinding.
  • the second rotating assembly 32 is used to carry an empty wafer box 9 earlier, including a second rotating seat 321 for carrying a wafer box, a second rotating shaft 322 and a second rotating drive motor 323, and the second rotating drive motor 323 capable of driving the second rotating seat 321 to rotate around the second rotating shaft 322,
  • the second rotating seat 321 includes a first receiving and fixing plate 3211 and a second receiving and fixing plate 3212 which are perpendicular to each other;
  • the second positioning assembly 324 includes a second sliding positioning seat 3240 arranged on the first receiving and fixing plate 3211, and two third fixed positioning blocks 3243 arranged on one side of the second sliding positioning seat 3240 , the two second side positioning blocks 3244 arranged on the other side of the second sliding positioning seat 3240, the sliding positioning driver 3245 at the receiving end pushes the wafer box close to the third fixed positioning block 3243 to fix it, and also includes On the second receiving and fixing plate 3212, a fourth fixing and positioning block 3241 is provided at a position away from the first receiving and fixing plate 3211; The round box 9 is first supported by the second receiving and fixing plate 3212, and then reaches the first receiving and fixing plate 3211 after being turned over. The receiving end sliding positioning driver 3245 and the third fixing and positioning block 3243 clamp the wafer box 9 together, and the second sliding After the positioning seat 3240 slides, it is detached from the fixation, so that the wafer cassette 9 can be grabbed away.
  • the sliding positioning seat 3240 is driven by the second sliding positioning driver 3246 so that the sliding positioning seat 3240 approaches or moves away from the second receiving and fixing plate 3212;
  • a clamping block 3242 with a V-shaped groove for clamping the edge of the wafer box, so as to cooperate with the protrusion on the wafer box for fixing.
  • a lift assembly 329 is also provided at the second rotary assembly 32 for lifting the wafer cassette of the second rotary assembly 32, including a lift block 3291 and a lift drive member 3292, and the lift drive member 3292 drives the lift block 3291 passes through the second via hole 32111 to lift the wafer box out.
  • the position is as shown in Figure 3, and the wafer cassette 9 fully loaded with wafers is placed on the first rotary On the assembly 31, an empty wafer cassette 9 is placed on the second rotary assembly 32, and the first rotary assembly 31 and the second rotary assembly 32 rotate so that the wafer cassette 9 is relatively arranged, as shown in Figure 4 or 5, and then pushed
  • the assembly 319 pushes the wafers in the wafer cassette 9 on the first rotary assembly 31 into the wafer cassette 9 on the second rotary assembly 32, and then, the first rotary assembly 31 and the second rotary assembly 32 rotate back to 3 position, the wafer box 9 full of wafers and the empty wafer box 9 are all grabbed by the manipulator, and the transfer of the next wafer can continue.
  • the first receiving fixed plate 3211, the second receiving fixed plate 3212, the first fixed positioning block 3143, the second fixed positioning block 3241, the third fixed positioning block 3243 and the fourth fixed positioning block 3241 are L-shaped;
  • the second sending out fixing plate 3112 and the second receiving fixing plate 3212 are respectively provided with rollers 33 to support and fix the first sliding positioning seat 3140 and the second sliding positioning seat 3240, so that the second sending out fixing plate 3112 and The second receiving fixing plate 3212 slides.
  • wafer cassettes full of wafers are generally directly transported by the robot arm or directly transported away.
  • This embodiment provides a wafer reversing device, as shown in Figure 1, comprising:
  • the working platform 2 is set in the frame 1, as shown in Figure 2;
  • the cassette reversing mechanism 3 is arranged on the working platform 2 and includes a first rotary assembly 31 and a second rotary assembly 32 oppositely arranged to transfer the wafers in the wafer cassette of the first rotary assembly 31 to the second rotary assembly 32 in the wafer box;
  • Empty box transport mechanism 4 used to provide empty wafer box to the second rotary assembly 32 or store the empty wafer box from the first rotary assembly 31;
  • the first rotating assembly 31 and the second rotating assembly 32 are as shown in Embodiment 1.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

本申请涉及一种晶圆盒对位翻转机构和装置，工作时，先将晶圆盒放置到第一旋转座上，第一固定定位块与第一侧边定位块先对晶圆盒底部进行初步固定，发出端滑动定位驱动件推动晶圆盒抵靠住第一固定定位块以对晶圆盒进行固定。而后，第一滑动定位驱动件推动晶圆盒靠近第一固定定位块以对晶圆盒的侧壁进行固定。由于晶圆盒的两个面都被固定，第一旋转座翻转90度时，晶圆盒不会松动，翻转后再由推动总成完成晶圆的推出。本发明的晶圆盒对位翻转机构实现了自动化的晶圆与晶圆盒的分离。

Description

一种晶圆盒对位翻转机构及装置 技术领域
本申请属于晶圆生产设备技术领域，尤其是涉及一种晶圆盒对位翻转机构及装置。
背景技术
晶圆在被加工成形及抛光处理的过程中，由于会与各种有机物、粒子及金属接触而被污染，如需要去除光刻胶、去除腐蚀剂、去除颗粒物，因此需要通过晶圆清洗来清除污染物。
在清洗过程中需要使用不同的清洗剂，因此在使用不同清洗剂的清洗槽内进行清洗时，需要多晶圆进行倒盒，也即将晶圆从一个晶圆盒转移到另一个晶圆盒。
发明内容
本发明要解决的技术问题是：为解决现有技术中的不足，从而提供一种能够自动对晶圆盒进行定位和翻转以便于晶圆在不同晶圆盒进行转移的晶圆盒对位翻转机构及装置。
本发明解决其技术问题所采用的技术方案是：
一种晶圆盒对位翻转机构，包括：
第一旋转组件，所述第一旋转组件包括用于承载晶圆盒的第一旋转座，第一旋转轴和第一旋转驱动电机，第一旋转驱动电机能够驱动第一旋转座绕第一旋转轴旋转，还包括固定于第一旋转座上的第一定位总成和推动总成；
所述第一旋转座包括相互垂直的第一发出固定板，第二发出固定板；
所述第一定位总成，包括设置于第一发出固定板上的第一滑动定位座，设置于第一滑动定位座一侧的两个第一固定定位块，设置于第一滑动定位座另一侧的两个第一滑动定位块，第一滑动定位驱动件推动第一滑动定位块靠近或者远离第一固定定位块，以对晶圆盒底部进行四角定位；还包括设置于第二发出固定板上的远离第一发出固定板一侧的位置设置有第二固定定位块；
所述滑动定位座由第二滑动定位驱动件驱动而使滑动定位座靠近或者远离第二接收固定板；
所述推动总成用于向着晶圆盒开口方向推动第一旋转组件上晶圆盒内的晶圆。
优选地，本发明的晶圆盒对位翻转机构，还包括：与所述第一旋转组件相对设置的第二旋转组件，所述第二旋转组件包括用于承载晶圆盒的第二旋转座，第二旋转轴和第二旋转驱动电机，第二旋转驱动电机能够驱动第二旋转座绕第二旋转轴旋转；
第二旋转座包括相互垂直的第一接收固定板和第二接收固定板；
第二定位总成，包括设置于第一接收固定板上的第二滑动定位座，设置于第二滑动定位座一侧的两个第三固定定位块，设置于第二滑动定位座另一侧的两个第二滑动定位块，接收端滑动定位驱动件推动第二滑动定位块靠近或者远离第三固定定位块，以对晶圆盒底部进行四角定位；还包括设置于第二接收固定板上的远离第一接收固定板一侧的位置设置有第四固定定位块。
优选地，本发明的晶圆盒对位翻转机构，所述推动总成包括推杆，推动滑轨和推动驱动器，推动驱动器驱动推杆在推动滑轨上运动，使推杆穿过第一旋转座上的第一过孔推动晶圆盒内的晶圆进入第二旋转组件上的晶圆盒完成倒盒。
优选地，本发明的晶圆盒对位翻转机构，第一接收固定板、第二接收固定板、第一固定定位块、第二固定定位块、第三固定定位块和第四固定定位块均为L形。
优选地，本发明的晶圆盒对位翻转机构，第二发出固定板和第二接收固定板上分别设置有滚轮支撑固定第一滑动定位座和第二滑动定位座。
优选地，本发明的晶圆盒对位翻转机构，滑动定位座由第二滑动定位驱动件驱动而使滑动定位座靠近或者远离第二接收固定板。
优选地，本发明的晶圆盒对位翻转机构，在第二旋转组件处还设置有升降组件，用于顶 起第二旋转组件的晶圆盒。
优选地，本发明的晶圆盒对位翻转机构，所述升降组件包括升降块及升降驱动件，升降驱动件驱动升降块从第二过孔处穿出，以将晶圆盒顶出升起。
优选地，本发明的晶圆盒对位翻转机构，第二发出固定板和第二接收固定板中间位置的还设置有用于卡住晶圆盒边缘的卡块。
优选地，本发明的晶圆盒对位翻转机构，所述卡块中间具有V形卡槽。
本发明的有益效果是：
本发明的晶圆盒对位翻转机构，工作时，先将晶圆盒放置到第一旋转座上，第一固定定位块与第一侧边定位块先对晶圆盒底部进行初步固定，发出端滑动定位驱动件推动晶圆盒抵靠住第一固定定位块以对晶圆盒进行固定。而后，发出端滑动定位驱动件推动晶圆盒靠近第一固定定位块以对晶圆盒的侧壁进行固定。由于晶圆盒的两个面都被固定，第一旋转座翻转90度时，晶圆盒不会松动，翻转后再由推动总成完成晶圆的推出。本发明的晶圆盒对位翻转机构实现了自动化的晶圆与晶圆盒的分离。
附图说明
下面结合附图和实施例对本申请的技术方案进一步说明。
图1是本申请实施例的晶圆倒盒装置的结构示意图；
图2是本申请实施例的工作台处的结构示意图；
图3是本申请实施例的第一旋转组件和第二旋转组件打开时的结构示意图；
图4是本申请实施例的第一旋转组件和第二旋转组件对接时的结构示意图；(图中虽然两个晶圆盒都有晶圆，但通常情况下仅有一个晶圆盒具有晶圆)
图5是本申请实施例的第一旋转组件和第二旋转组件对接时的侧向视角的结构示意图；(图中虽然两个晶圆盒都有晶圆，但通常情况下仅有一个晶圆盒具有晶圆)
图6是本申请实施例的第一旋转组件的结构示意图；
图7是本申请实施例的具有晶圆盒时第二旋转组件的结构示意图；
图8是本申请实施例的无晶圆盒时第二旋转组件的结构示意图；
图9是本申请实施例的升降组件的结构示意图；
图10是本申请实施例的滚轮位置的结构示意图。
图中的附图标记为：
1 框架；
2 工作平台；
3 倒盒机构；
4 空盒运输机构；
9 晶圆盒；
31 第一旋转组件；
32 第二旋转组件；
311 第一旋转座；
312 第一旋转轴；
313 第一旋转驱动电机；
314 第一定位总成；
319 推动总成；
321 第二旋转座；
322 第二旋转轴；
323 第二旋转驱动电机；
324 第二定位总成；
329 升降组件；
3111 第一发出固定板；
3112 第二发出固定板；
3140 第一滑动定位座；
3141 第二固定定位块；
3143 第一固定定位块；
3144 第一滑动定位块；
3145 发出端滑动定位驱动件；
3146 第一滑动定位驱动件；
3191 推杆；
3192 推动滑轨；
3193 推动驱动器；
3211 第一接收固定板；
3212 第二接收固定板、；
3240 滑动定位座；
3241 第四固定定位块；
3242 卡块；
3243 第三固定定位块；
3244 第二滑动定位块；
3245 接收端滑动定位驱动件；
3246 第二滑动定位驱动件；
3291 升降块；
3292 升降驱动件；
31111 第一过孔；
32111 第二过孔；
33 滚轮。
具体实施方式
需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请保护范围的限制。此外，术语“第一”、“第二”等仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”等的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明创造的描述中，除非另有说明，“多个”的含义是两个或两个以上。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以通过具体情况理解上述术语在本申请中的具体含义。
下面将参考附图并结合实施例来详细说明本申请的技术方案。
实施例1
本实施例提供一种晶圆盒对位翻转机构，如图2所示，包括：
第一旋转组件31，所述第一旋转组件31先用于承载具有晶圆的晶圆盒9，包括用于承载晶圆盒的第一旋转座311，第一旋转轴312和第一旋转驱动电机313，第一旋转驱动电机313能够驱动第一旋转座311绕第一旋转轴312旋转，还包括固定于第一旋转座311上的第一定位总成314和推动总成319(第一定位总成314和推动总成319均跟随第一旋转座311运动)；
第一旋转座311包括相互垂直的第一发出固定板3111，第二发出固定板3112；
第一定位总成314，如图7所示，包括设置于第一发出固定板3111上的第一滑动定位座3140，设置于第一滑动定位座3140一侧的两个第一固定定位块3143，设置于第一滑动定位座3140另一侧的两个第一侧边定位块3144，发出端滑动定位驱动件3145推动晶圆盒靠近第一固定定位块3143以对晶圆盒9的侧壁进行固定，发出端滑动定位驱动件3145推动定位杆与另一侧的第一固定定位块3143完成对晶圆盒的固定；还包括设置于第二发出固定板3112上的远离第一发出固定板3111一侧的位置设置有第二固定定位块3141；所述第一旋转座311翻转时(从图3状态变为图4状态)，晶圆盒9先被第一发出固定板3111支撑，第一滑动定位座3140滑动后靠近第二固定定位块3141，使晶圆盒抵靠第二发出固定板3112，翻转使晶圆“放倒”，第一发出固定板3111支撑时由第一滑动定位驱动件3146卡紧晶圆盒9，需要抓走晶圆盒9时，由第一滑动定位座3140滑动后脱离对晶圆盒9的固定。
滑动定位座3240由第二滑动定位驱动件3246驱动而使滑动定位座3240靠近或者远离第二接收固定板3212；
所述推动总成319包括推杆3191，推动滑轨3192和推动驱动器3193，推动驱动器3193驱动推杆3191在推动滑轨3192上运动，使推杆3191穿过第一旋转座311上的第一过孔31111推动晶圆盒9上的晶圆进入第二旋转组件32上的晶圆盒完成倒盒。
第二旋转组件32，先用于承载空的晶圆盒9，包括用于承载晶圆盒的第二旋转座321，第二旋转轴322和第二旋转驱动电机323，第二旋转驱动电机323能够驱动第二旋转座321绕第二旋转轴322旋转，
第二旋转座321包括相互垂直的第一接收固定板3211和第二接收固定板3212；
第二定位总成324，如图8所示，包括设置于第一接收固定板3211上的第二滑动定位座3240，设置于第二滑动定位座3240一侧的两个第三固定定位块3243，设置于第二滑动定位座3240另一侧的两个第二侧边定位块3244，接收端滑动定位驱动件3245推动晶圆盒靠近第三固定定位块3243以对进行固定，还包括设置于第二接收固定板3212上的远离第一接收固定板3211一侧的位置设置有第四固定定位块3241；所述第二旋转座321翻转时(从图4状态变为图3状态)，晶圆盒9先被第二接收固定板3212支撑，翻转后到达第一接收固定板3211，由接收端滑动定位驱动件3245与第三固定定位块3243一同卡紧晶圆盒9，由第二滑动定位座3240滑动后脱离固定，以便于晶圆盒9被抓走。
滑动定位座3240由第二滑动定位驱动件3246驱动而使滑动定位座3240靠近或者远离第二接收固定板3212；
第二发出固定板3112和第二接收固定板3212中间位置的还设置有用于卡住晶圆盒边缘的具有V形卡槽的卡块3242，以与晶圆盒上的凸起进行配合固定。
如图9所示，在第二旋转组件32处还设置有升降组件329用于顶起第二旋转组件32的晶圆盒，包括升降块3291及升降驱动件3292，升降驱动件3292驱动升降块3291从第二过孔32111处穿出，以将晶圆盒顶出升起。
本实施例的晶圆倒盒装置，第一旋转组件31和第二旋转组件32承接新的晶圆盒9时，位置如图3所示，满载晶圆的晶圆盒9放置到第一旋转组件31上，空的晶圆盒9放置到第二旋转组件32上，第一旋转组件31和第二旋转组件32旋转使晶圆盒9相对设置，如图4 或5所示，之后由推动总成319推动第一旋转组件31上的晶圆盒9内的晶圆推动到第二旋转组件32上的晶圆盒9内，而后，第一旋转组件31和第二旋转组件32旋转回归图3位置，满载晶圆的晶圆盒9和空的晶圆盒9均被机械手抓走，可继续进行下一个晶圆的转移。
第一接收固定板3211、第二接收固定板3212、第一固定定位块3143、第二固定定位块3241、第三固定定位块3243和第四固定定位块3241均为L形；
如图10所示，第二发出固定板3112和第二接收固定板3212上分别设置有滚轮33支撑固定第一滑动定位座3140和第二滑动定位座3240，以便于第二发出固定板3112和第二接收固定板3212滑动。
需要说明的是，装满晶圆的晶圆盒一般由机械手直接运输过来或者直接运输走。
实施例2
本实施例提供一种晶圆倒盒装置，如图1所示，包括：
框架1；
工作平台2，设置在框架1内，如图2所示；
倒盒机构3，设置在工作平台2上，包括相对设置的第一旋转组件31和第二旋转组件32，能够将位于第一旋转组件31的晶圆盒内的晶圆转移到第二旋转组件32的晶圆盒内；
空盒运输机构4，用于向第二旋转组件32提供空晶圆盒或者存储从第一旋转组件31的空晶圆盒；
第一旋转组件31和第二旋转组件32如实施例1所示。
以上述依据本申请的理想实施例为启示，通过上述的说明内容，相关工作人员完全可以在不偏离本项申请技术思想的范围内，进行多样的变更以及修改。本项申请的技术性范围并不局限于说明书上的内容，必须要根据权利要求范围来确定其技术性范围。

Claims (11)

  1. 一种晶圆盒对位翻转机构，其特征在于，包括：
    第一旋转组件(31)，所述第一旋转组件(31)包括用于承载晶圆盒的第一旋转座(311)，第一旋转轴(312)和第一旋转驱动电机(313)，第一旋转驱动电机(313)能够驱动第一旋转座(311)绕第一旋转轴(312)旋转，还包括固定于第一旋转座(311)上的第一定位总成(314)和推动总成(319)；
    所述第一旋转座(311)包括相互垂直的第一发出固定板(3111)，第二发出固定板(3112)；
    所述第一定位总成(314)，包括设置于第一发出固定板(3111)上的第一滑动定位座(3140)，设置于第一滑动定位座(3140)一侧的两个第一固定定位块(3143)，设置于第一滑动定位座(3140)另一侧的两个第一滑动定位块(3144)，第一滑动定位驱动件(3146)推动第一滑动定位块(3144)靠近或者远离第一固定定位块(3143)，以对晶圆盒(9)底部进行四角定位；还包括设置于第二发出固定板(3112)上的远离第一发出固定板(3111)一侧的位置设置有第二固定定位块(3141)；
    所述滑动定位座(3240)由第二滑动定位驱动件(3246)驱动而使滑动定位座(3240)靠近或者远离第二接收固定板(3212)；
    所述推动总成(319)用于向着晶圆盒(9)开口方向推动第一旋转组件(31)上晶圆盒(9)内的晶圆。
  2. 根据权利要求1所述的晶圆盒对位翻转机构，其特征在于，还包括：与所述第一旋转组件(31)相对设置的第二旋转组件(32)，所述第二旋转组件(32)包括用于承载晶圆盒的第二旋转座(321)，第二旋转轴(322)和第二旋转驱动电机(323)，第二旋转驱动电机(323)能够驱动第二旋转座(321)绕第二旋转轴(322)旋转；
    第二旋转座(321)包括相互垂直的第一接收固定板(3211)和第二接收固定板(3212)；
    第二定位总成(324)，包括设置于第一接收固定板(3211)上的第二滑动定位座(3240)，设置于第二滑动定位座(3240)一侧的两个第三固定定位块(3243)，设置于第二滑动定位座(3240)另一侧的两个第二滑动定位块(3244)，接收端滑动定位驱动件(3245)推动第二滑动定位块(3244)靠近或者远离第三固定定位块(3243)，以对晶圆盒(9)底部进行四角定位；还包括设置于第二接收固定板(3212)上的远离第一接收固定板(3211)一侧的位置设置有第四固定定位块(3241)。
  3. 根据权利要求1所述的晶圆盒对位翻转机构，其特征在于，所述推动总成(319)包括推杆(3191)，推动滑轨(3192)和推动驱动器(3193)，推动驱动器(3193)驱动推杆(3191)在推动滑轨(3192)上运动，使推杆(3191)穿过第一旋转座(311)上的第一过孔(31111)推动晶圆盒内的晶圆进入第二旋转组件(32)上的晶圆盒完成倒盒。
  4. 根据权利要求2所述的晶圆盒对位翻转机构，其特征在于，第一接收固定板(3211)、第二接收固定板(3212)、第一固定定位块(3143)、第二固定定位块(3241)、第三固定定位块(3243)和第四固定定位块(3241)均为L形。
  5. 根据权利要求2所述的晶圆盒对位翻转机构，其特征在于，第二发出固定板(3112)和第二接收固定板(3212)上分别设置有滚轮(33)支撑固定第一滑动定位座(3140)和第二滑动定位座(3240)。
  6. 根据权利要求2所述的晶圆盒对位翻转机构，其特征在于，滑动定位座(3240)由第二滑动定位驱动件(3246)驱动而使滑动定位座(3240)靠近或者远离第二接收固定板(3212)。
  7. 根据权利要求2所述的晶圆盒对位翻转机构，其特征在于，在第二旋转组件(32)处还设置有升降组件(329)，用于顶起第二旋转组件(32)的晶圆盒。
  8. 根据权利要求7所述的晶圆盒对位翻转机构，其特征在于，所述升降组 件(329)包括升降块(3291)及升降驱动件(3292)，升降驱动件(3292)驱动升降块(3291)从第二过孔(32111)处穿出，以将晶圆盒顶出升起。
  9. 根据权利要求2所述的晶圆盒对位翻转机构，其特征在于，第二发出固定板(3112)和第二接收固定板(3212)中间位置的还设置有用于卡住晶圆盒边缘的卡块(3242)。
  10. 根据权利要求9所述的晶圆盒对位翻转机构，其特征在于，所述卡块(3242)中间具有V形卡槽。
  11. 一种晶圆倒盒装置，其特征在于，包括：
    框架(1)；
    工作平台(2)，设置在框架(1)内；
    倒盒机构(3)，设置在工作平台(2)上，包括相对设置的第一旋转组件(31)和第二旋转组件(32)；
    空盒运输机构(4)，用于向第二旋转组件(32)提供空晶圆盒或者存储从第一旋转组件(31)运输的空晶圆盒；
    所述第一旋转组件(31)，包括用于承载晶圆盒的第一旋转座(311)，第一旋转轴(312)和第一旋转驱动电机(313)，第一旋转驱动电机(313)能够驱动第一旋转座(311)绕第一旋转轴(312)旋转，还包括固定于第一旋转座(311)上的第一定位总成(314)和推动总成(319)；
    所述第一旋转座(311)包括相互垂直的第一发出固定板(3111)，第二发出固定板(3112)；
    所述第一定位总成(314)，包括设置于第一发出固定板(3111)上的第一滑动定位座(3140)，设置于第一滑动定位座(3140)一侧的两个第一固定定位块(3143)，设置于第一滑动定位座(3140)另一侧的两个第一侧边定位块(3144)，发出端滑动定位驱动件(3145)推动晶圆盒靠近第一固定定位块(3143)以对晶圆盒(9)进行固定；还包括设置于第二发出固定板(3112)上的远离第一发出固定板(3111)一侧的位置设置有第二固定定位块(3141)；
    所述滑动定位座(3240)由第二滑动定位驱动件(3246)驱动而使滑动定位座(3240)靠近或者远离第二接收固定板(3212)；
    所述推动总成(319)用于推动第一旋转组件(31)上晶圆盒(9)内的晶圆进入第二旋转组件(32)上的晶圆盒内；
    第二旋转组件(32)包括用于承载晶圆盒的第二旋转座(321)，第二旋转轴(322)和第二旋转驱动电机(323)，第二旋转驱动电机(323)能够驱动第二旋转座(321)绕第二旋转轴(322)旋转；
    第二旋转座(321)包括相互垂直的第一接收固定板(3211)和第二接收固定板(3212)；
    第二定位总成(324)，包括设置于第一接收固定板(3211)上的第二滑动定位座(3240)，设置于第二滑动定位座(3240)一侧的两个第三固定定位块(3243)，设置于第二滑动定位座(3240)另一侧的两个第二侧边定位块(3244)，接收端滑动定位驱动件(3245)推动晶圆盒靠近第三固定定位块(3243)以对进行固定；还包括设置于第二接收固定板(3212)上的远离第一接收固定板(3211)一侧的位置设置有第四固定定位块(3241)。
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CN116469830A (zh) * 2023-06-19 2023-07-21 北京芯士联半导体科技有限公司 一种刻蚀机晶圆盒翻转装置
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CN117476525A (zh) * 2023-12-27 2024-01-30 苏州芯慧联半导体科技有限公司 一种晶圆盒开盖设备

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CN117476525A (zh) * 2023-12-27 2024-01-30 苏州芯慧联半导体科技有限公司 一种晶圆盒开盖设备
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