CN114023682A - 一种晶圆盒对位翻转机构 - Google Patents
一种晶圆盒对位翻转机构 Download PDFInfo
- Publication number
- CN114023682A CN114023682A CN202111244336.9A CN202111244336A CN114023682A CN 114023682 A CN114023682 A CN 114023682A CN 202111244336 A CN202111244336 A CN 202111244336A CN 114023682 A CN114023682 A CN 114023682A
- Authority
- CN
- China
- Prior art keywords
- positioning
- fixing plate
- rotating
- wafer
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000007246 mechanism Effects 0.000 title claims abstract description 32
- 230000007306 turnover Effects 0.000 title abstract description 4
- 235000012431 wafers Nutrition 0.000 claims description 122
- 240000004282 Grewia occidentalis Species 0.000 claims description 2
- 238000000926 separation method Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 9
- 238000004140 cleaning Methods 0.000 description 3
- 239000012459 cleaning agent Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
- -1 photoresist Chemical class 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (10)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111244336.9A CN114023682B (zh) | 2021-10-26 | 2021-10-26 | 一种晶圆盒对位翻转机构 |
CN202180077560.5A CN116648779A (zh) | 2021-10-26 | 2021-12-17 | 一种晶圆盒定位固定机构 |
PCT/CN2021/139137 WO2023070900A1 (zh) | 2021-10-26 | 2021-12-17 | 一种晶圆盒对位翻转机构及装置 |
KR1020237021839A KR20240079188A (ko) | 2021-10-26 | 2021-12-17 | 웨이퍼 박스 정렬 반전 기구 및 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111244336.9A CN114023682B (zh) | 2021-10-26 | 2021-10-26 | 一种晶圆盒对位翻转机构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN114023682A true CN114023682A (zh) | 2022-02-08 |
CN114023682B CN114023682B (zh) | 2022-06-10 |
Family
ID=80057582
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111244336.9A Active CN114023682B (zh) | 2021-10-26 | 2021-10-26 | 一种晶圆盒对位翻转机构 |
CN202180077560.5A Pending CN116648779A (zh) | 2021-10-26 | 2021-12-17 | 一种晶圆盒定位固定机构 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202180077560.5A Pending CN116648779A (zh) | 2021-10-26 | 2021-12-17 | 一种晶圆盒定位固定机构 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR20240079188A (zh) |
CN (2) | CN114023682B (zh) |
WO (1) | WO2023070900A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116469830B (zh) * | 2023-06-19 | 2023-08-22 | 北京芯士联半导体科技有限公司 | 一种刻蚀机晶圆盒翻转装置 |
CN116500054B (zh) * | 2023-06-26 | 2023-11-07 | 季华实验室 | 一种Micro-LED的检测装置 |
CN117476525B (zh) * | 2023-12-27 | 2024-03-12 | 苏州芯慧联半导体科技有限公司 | 一种晶圆盒开盖设备 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110517980A (zh) * | 2019-09-25 | 2019-11-29 | 沈阳芯达半导体设备有限公司 | 一种半导体行业用晶圆自动传送机构 |
CN112736002A (zh) * | 2020-12-31 | 2021-04-30 | 至微半导体(上海)有限公司 | 一种晶圆清洗设备晶圆片高速装载方法 |
CN113270349A (zh) * | 2020-12-31 | 2021-08-17 | 至微半导体(上海)有限公司 | 一种晶圆片高速装载输送方法及卸载输送方法 |
CN214175990U (zh) * | 2020-12-31 | 2021-09-10 | 至微半导体(上海)有限公司 | 一种晶圆清洗设备晶圆片高速装载系统 |
WO2021208550A1 (zh) * | 2020-04-17 | 2021-10-21 | 天津环博科技有限责任公司 | 一种立式上料插片一体机 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI304628B (en) * | 2006-08-04 | 2008-12-21 | King Yuan Electronics Co Ltd | Assisting apparatus for a wafer cassette |
WO2016098930A1 (ko) * | 2014-12-19 | 2016-06-23 | 주식회사 썬닉스 | 다방향 웨이퍼 이송 시스템 |
CN113690169B (zh) * | 2021-10-26 | 2022-01-25 | 亚电科技南京有限公司 | 一种晶圆倒盒装置 |
-
2021
- 2021-10-26 CN CN202111244336.9A patent/CN114023682B/zh active Active
- 2021-12-17 CN CN202180077560.5A patent/CN116648779A/zh active Pending
- 2021-12-17 KR KR1020237021839A patent/KR20240079188A/ko unknown
- 2021-12-17 WO PCT/CN2021/139137 patent/WO2023070900A1/zh active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110517980A (zh) * | 2019-09-25 | 2019-11-29 | 沈阳芯达半导体设备有限公司 | 一种半导体行业用晶圆自动传送机构 |
WO2021208550A1 (zh) * | 2020-04-17 | 2021-10-21 | 天津环博科技有限责任公司 | 一种立式上料插片一体机 |
CN112736002A (zh) * | 2020-12-31 | 2021-04-30 | 至微半导体(上海)有限公司 | 一种晶圆清洗设备晶圆片高速装载方法 |
CN113270349A (zh) * | 2020-12-31 | 2021-08-17 | 至微半导体(上海)有限公司 | 一种晶圆片高速装载输送方法及卸载输送方法 |
CN214175990U (zh) * | 2020-12-31 | 2021-09-10 | 至微半导体(上海)有限公司 | 一种晶圆清洗设备晶圆片高速装载系统 |
Also Published As
Publication number | Publication date |
---|---|
CN114023682B (zh) | 2022-06-10 |
WO2023070900A1 (zh) | 2023-05-04 |
CN116648779A (zh) | 2023-08-25 |
KR20240079188A (ko) | 2024-06-04 |
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Legal Events
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220808 Address after: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Patentee after: Jiangsu Yadian Technology Co.,Ltd. Address before: 225500 No.199, Keji Road, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Patentee before: Jiangsu Yadian Technology Co.,Ltd. Patentee before: Yadian Technology Nanjing Co.,Ltd. |
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CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Patentee after: Jiangsu Yadian Technology Co.,Ltd. Address before: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Patentee before: Jiangsu Yadian Technology Co.,Ltd. |