JP2012044129A - 排熱器のコアチューブ座及びその製造方法 - Google Patents
排熱器のコアチューブ座及びその製造方法 Download PDFInfo
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- JP2012044129A JP2012044129A JP2010200719A JP2010200719A JP2012044129A JP 2012044129 A JP2012044129 A JP 2012044129A JP 2010200719 A JP2010200719 A JP 2010200719A JP 2010200719 A JP2010200719 A JP 2010200719A JP 2012044129 A JP2012044129 A JP 2012044129A
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- heat
- punching
- hollow tube
- core tube
- tube seat
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- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 238000004080 punching Methods 0.000 claims abstract description 48
- 239000000463 material Substances 0.000 claims abstract description 16
- 238000005520 cutting process Methods 0.000 claims abstract description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 16
- 229910052782 aluminium Inorganic materials 0.000 claims description 16
- 238000000748 compression moulding Methods 0.000 claims description 8
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 description 7
- 238000009826 distribution Methods 0.000 description 4
- 239000002699 waste material Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000001464 adherent effect Effects 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 239000013058 crude material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
- F28F1/20—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being attachable to the element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/40—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only inside the tubular element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/42—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being both outside and inside the tubular element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4878—Mechanical treatment, e.g. deforming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
- B23P2700/10—Heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49377—Tube with heat transfer means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Geometry (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Extrusion Of Metal (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Forging (AREA)
Abstract
【解決手段】予め圧搾成型を通じて予定量のアルミインゴット粗材を一端に閉鎖面を具える中空の管に形成し、更にその中空管の管体外壁に複数回の押し抜き切削加工を行い、管体の外壁は押し抜き切削によって高密度かつ垂直に隣接分布する複数本の挟み溝を形成し、これによって排熱器のコアチューブ座を構成し、更に高密度分布の挟み溝を用いて逐一排熱フィンを嵌め込み設置し、高密度排熱フィンを具える排熱器を構成する。
【選択図】図2
Description
(1)一定量のアルミインゴット粗材1を予め準備する。
(2)前記一定量のアルミインゴット粗材1を用い、先ず圧搾型圧搾成型を通し、一端に閉鎖面11を具える中空の管10に形成する。
(3)更に前記中空の管10の管体外壁に対して複数回の押し抜き切削加工を行い、管体外壁は押し抜き切削されて高密度かつ垂直に隣接分布する複数本の挟み溝12に形成され、これによってコアチューブ座100を構成する。
11 閉鎖面
10 中空管
12 挟み溝
100 コアチューブ座
200 排熱フィン
300 排熱器
13 柱状体
14 ねじ孔
121 第一突起
122 第二突起
Claims (11)
- 排熱器のコアチューブ座の製造方法であり、それの実施手順は順番に次のものを含む:
(1)一定量のアルミインゴット粗材を予め準備する。
(2)前記一定量のアルミインゴット粗材を用い、先ず圧搾型圧搾成型を通し、一端に閉鎖面を具える中空の管に形成する。
(3)更に前記中空の管の管体外壁に対して複数回の押し抜き切削加工を行い、管体外壁は押し抜き切削されて高密度かつ垂直に隣接分布する複数本の挟み溝に形成され、これによってコアチューブ座を構成する。
以上の実施手順を特徴とする排熱器のコアチューブ座の製造方
法。 - 前記押し抜き切削は荒押し抜き、細押し抜き及び精密押し抜き等多数回の手順を含み、中空管の外壁は違った押し抜き切削ツールを通し、荒押し抜き後は更に一回以上の細押し抜き及び一回以上の精密押し抜き等手順を経ることを特徴とする請求項1記載の排熱器のコアチューブ座の製造方法。
- 前記一定量のアルミインゴット粗材を圧搾成型する場合、中空管の内壁には予め複数個の柱状体が設けられてあることを特徴とする請求項1記載の排熱器のコアチューブ座の製造方法。
- 前記中空管の管体が押し抜き切削加工された後、更に複数個の柱状体に穴あけ加工を行い、複数個のねじ孔を設けることを特徴とする請求項3記載の排熱器のコアチューブ座の製造方法。
- 前記中空管の管体が押し抜き切削加工された後、更に中空管体の閉鎖面に一つ以上のねじ孔を設けることを特徴とする請求項1記載の排熱器のコアチューブ座の製造方法。
- 前記中空管の管体が圧搾成型を経た後、円形または四角形の管体に形成されることを特徴とする請求項1記載の排熱器のコアチューブ座の製造方法。
- 排熱器のコアチューブ座の一種で、それは一体連接され、かつ一端は閉鎖面の中空管体を具え、中空管の管体外壁は押し抜き切削を通じて排熱フィンの逐一嵌め付け挟み設置に供され、高密度かつ垂直に隣接分布する複数個の挟み溝を備えることを特徴とする排熱器のコアチューブ座。
- 前記中空管体の複数個の挟み溝はすべて押し抜き切削加工され、第一突起及び第二突起を備えるように形成されることを特徴とする請求項7記載の排熱器のコアチューブ座。
- 前記排熱器のコアチューブ座の中空管体の内壁には予め複数個の柱状体が設けられ、各柱状体にはねじ孔が設けられてあることを特徴とする請求項7記載の排熱器のコアチューブ座。
- 前記中空管体の閉鎖面に一つ以上のねじ孔が設けられてあることを特徴とする請求項7記載の排熱器のコアチューブ座。
- 前記中空管体は円形または四角形の管体に成型されてあることを特徴とする請求項7記載の排熱器のコアチューブ座。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW099127906 | 2010-08-20 | ||
TW099127906A TW201043357A (en) | 2010-08-20 | 2010-08-20 | Core tube base for heat radiator and method for manufacturing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2012044129A true JP2012044129A (ja) | 2012-03-01 |
Family
ID=43993224
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010200719A Pending JP2012044129A (ja) | 2010-08-20 | 2010-09-08 | 排熱器のコアチューブ座及びその製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20120043067A1 (ja) |
JP (1) | JP2012044129A (ja) |
KR (1) | KR20120018039A (ja) |
DE (2) | DE202010008604U1 (ja) |
TW (1) | TW201043357A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102699632A (zh) * | 2012-06-04 | 2012-10-03 | 宁波安拓实业有限公司 | 一种减震器衬套毛坯的制造工艺 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102527758B (zh) * | 2012-01-20 | 2014-12-03 | 东莞汉旭五金塑胶科技有限公司 | 散热器铝底座的挤压成型模具及其制法 |
CN103296812B (zh) * | 2012-03-05 | 2017-02-08 | 德昌电机(深圳)有限公司 | 马达定子及具有该定子的马达 |
CN103406737B (zh) * | 2013-08-21 | 2017-02-22 | 安徽鸿路钢结构(集团)股份有限公司 | 双角度圆管柱组装工法 |
US11134618B2 (en) * | 2016-08-30 | 2021-10-05 | Current Lighting Solutions, Llc | Luminaire including a heat dissipation structure |
US11313631B2 (en) * | 2020-07-07 | 2022-04-26 | Hfc Industry Limited | Composite heat sink having anisotropic heat transfer metal-graphite composite fins |
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JPH08181259A (ja) * | 1994-12-22 | 1996-07-12 | Showa Alum Corp | ピンフィンヒートシンクの製造方法 |
JPH09321186A (ja) * | 1996-05-24 | 1997-12-12 | Janome Sewing Mach Co Ltd | ヒートシンク製造方法 |
JP2000083343A (ja) * | 1998-09-03 | 2000-03-21 | Mitsubishi Electric Corp | モーターフレーム及びモーターフレームの製造方法 |
JP2000513483A (ja) * | 1996-06-21 | 2000-10-10 | シーメンス アクチエンゲゼルシヤフト | 可撓性導電線を有する低電圧遮断器の開閉接点装置 |
JP2004100021A (ja) * | 2002-09-12 | 2004-04-02 | Kobe Steel Ltd | 切削用鋼材及び機械構造用部品 |
US7028757B1 (en) * | 2004-10-21 | 2006-04-18 | Hewlett-Packard Development Company, L.P. | Twin fin arrayed cooling device with liquid chamber |
JP2006114567A (ja) * | 2004-10-12 | 2006-04-27 | Furukawa Electric Co Ltd:The | フィンを備えたヒートシンクおよびその製造方法 |
US20090117402A1 (en) * | 2007-11-06 | 2009-05-07 | Kao Y H | Thermal module |
JP2010040996A (ja) * | 2008-08-08 | 2010-02-18 | Furukawa Electric Co Ltd:The | ヒートシンク |
US20100044009A1 (en) * | 2008-08-20 | 2010-02-25 | Shyh-Ming Chen | Annular heat dissipating device |
JP3158105U (ja) * | 2009-11-26 | 2010-03-18 | 崇賢 ▲黄▼ | 電子素子の放熱構造体 |
US20100084116A1 (en) * | 2008-10-07 | 2010-04-08 | Shyh-Ming Chen | Structure of heat sink |
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US20050211416A1 (en) * | 2003-10-17 | 2005-09-29 | Kenya Kawabata | Heat sink with fins and a method for manufacturing the same |
US8020608B2 (en) * | 2004-08-31 | 2011-09-20 | Hewlett-Packard Development Company, L.P. | Heat sink fin with stator blade |
US7296619B2 (en) * | 2004-10-21 | 2007-11-20 | Hewlett-Packard Development Company, L.P. | Twin fin arrayed cooling device with heat spreader |
CN101451694B (zh) * | 2007-12-07 | 2012-10-10 | 富准精密工业(深圳)有限公司 | 发光二极管灯具 |
US8196643B2 (en) * | 2009-01-20 | 2012-06-12 | Shyh Ming Chen | Ring heat dissipating device formed by punching and riveting through a shaping mold |
-
2010
- 2010-08-20 TW TW099127906A patent/TW201043357A/zh not_active IP Right Cessation
- 2010-09-08 JP JP2010200719A patent/JP2012044129A/ja active Pending
- 2010-09-20 US US12/885,573 patent/US20120043067A1/en not_active Abandoned
- 2010-09-22 DE DE202010008604U patent/DE202010008604U1/de not_active Expired - Lifetime
- 2010-09-27 KR KR1020100093182A patent/KR20120018039A/ko not_active Application Discontinuation
-
2011
- 2011-01-20 DE DE102011000230A patent/DE102011000230A1/de not_active Withdrawn
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH08181259A (ja) * | 1994-12-22 | 1996-07-12 | Showa Alum Corp | ピンフィンヒートシンクの製造方法 |
JPH09321186A (ja) * | 1996-05-24 | 1997-12-12 | Janome Sewing Mach Co Ltd | ヒートシンク製造方法 |
JP2000513483A (ja) * | 1996-06-21 | 2000-10-10 | シーメンス アクチエンゲゼルシヤフト | 可撓性導電線を有する低電圧遮断器の開閉接点装置 |
JP2000083343A (ja) * | 1998-09-03 | 2000-03-21 | Mitsubishi Electric Corp | モーターフレーム及びモーターフレームの製造方法 |
JP2004100021A (ja) * | 2002-09-12 | 2004-04-02 | Kobe Steel Ltd | 切削用鋼材及び機械構造用部品 |
JP2006114567A (ja) * | 2004-10-12 | 2006-04-27 | Furukawa Electric Co Ltd:The | フィンを備えたヒートシンクおよびその製造方法 |
US7028757B1 (en) * | 2004-10-21 | 2006-04-18 | Hewlett-Packard Development Company, L.P. | Twin fin arrayed cooling device with liquid chamber |
US20090117402A1 (en) * | 2007-11-06 | 2009-05-07 | Kao Y H | Thermal module |
JP2010040996A (ja) * | 2008-08-08 | 2010-02-18 | Furukawa Electric Co Ltd:The | ヒートシンク |
US20100044009A1 (en) * | 2008-08-20 | 2010-02-25 | Shyh-Ming Chen | Annular heat dissipating device |
US20100084116A1 (en) * | 2008-10-07 | 2010-04-08 | Shyh-Ming Chen | Structure of heat sink |
JP3158105U (ja) * | 2009-11-26 | 2010-03-18 | 崇賢 ▲黄▼ | 電子素子の放熱構造体 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102699632A (zh) * | 2012-06-04 | 2012-10-03 | 宁波安拓实业有限公司 | 一种减震器衬套毛坯的制造工艺 |
Also Published As
Publication number | Publication date |
---|---|
TW201043357A (en) | 2010-12-16 |
TWI373385B (ja) | 2012-10-01 |
DE102011000230A1 (de) | 2012-02-23 |
KR20120018039A (ko) | 2012-02-29 |
US20120043067A1 (en) | 2012-02-23 |
DE202010008604U1 (de) | 2011-05-12 |
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