JP2012127642A - 押出で製造される薄膜型ヒートパイプ - Google Patents
押出で製造される薄膜型ヒートパイプ Download PDFInfo
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- JP2012127642A JP2012127642A JP2011263796A JP2011263796A JP2012127642A JP 2012127642 A JP2012127642 A JP 2012127642A JP 2011263796 A JP2011263796 A JP 2011263796A JP 2011263796 A JP2011263796 A JP 2011263796A JP 2012127642 A JP2012127642 A JP 2012127642A
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- heat pipe
- hole
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- pipe according
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- 239000010409 thin film Substances 0.000 title claims abstract description 79
- 238000001125 extrusion Methods 0.000 title claims abstract description 9
- 239000012530 fluid Substances 0.000 claims abstract description 26
- 239000010408 film Substances 0.000 claims abstract 4
- 238000000926 separation method Methods 0.000 claims description 12
- 239000012528 membrane Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000004049 embossing Methods 0.000 claims description 2
- 239000007788 liquid Substances 0.000 abstract description 19
- 238000001816 cooling Methods 0.000 abstract description 6
- 230000035515 penetration Effects 0.000 abstract 2
- 230000000694 effects Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C23/00—Extruding metal; Impact extrusion
- B21C23/02—Making uncoated products
- B21C23/04—Making uncoated products by direct extrusion
- B21C23/08—Making wire, bars, tubes
- B21C23/085—Making tubes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4878—Mechanical treatment, e.g. deforming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C23/00—Extruding metal; Impact extrusion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/16—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes extruded
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49353—Heat pipe device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49355—Solar energy device making
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
【解決手段】押出で製作され、平板形状を有するボディ部と、ボディ部内に長手方向に形成された貫通ホールと、貫通ホールの内壁側面部の少なくとも一側に形成され、作動流体が流動されるように構成された少なくとも1つの溝とを備え、溝が形成されていない部分を通じて相対的に蒸気流動空間を大きく確保することができると共に、気体と液体との間の界面摩擦流動抵抗を低減することができ、厚さを極力薄くすることができるため、薄膜型冷却素子の構造のコンパクト化及びコスト節減を達成することができる。
【選択図】図1a
Description
Claims (14)
- 平板形状を有するボディ部と、
前記ボディ部内に長手方向に形成された貫通ホールと、
前記貫通ホールの内壁側面部の少なくとも一側に形成され、作動流体が流動されるように構成された少なくとも1つの溝と、
を含む薄膜型ヒートパイプ。 - 前記貫通ホールの内部は、真空状態に維持される、請求項1に記載の薄膜型ヒートパイプ。
- 前記溝は、前記貫通ホールの内壁に彫り込み又は浮き彫りにより形成される、請求項1に記載の薄膜型ヒートパイプ。
- 前記溝は、前記貫通ホールの内壁に設けられた少なくとも1つの凸部の間に形成される凹み空間である、請求項1に記載の薄膜型ヒートパイプ。
- 前記溝の断面は、前記作動流体に毛細管力が発生するように角部のある多角構造を有する、請求項1に記載の薄膜型ヒートパイプ。
- 前記多角構造は、三角形状、尖塔形状、長方形状及び台形形状の構造を含む、請求項5に記載の薄膜型ヒートパイプ。
- 前記貫通ホールは、少なくとも1つの分離膜により複数個の貫通ホールに分離される、請求項1に記載の薄膜型ヒートパイプ。
- 前記分離膜により分離された各貫通ホール内に形成された溝は、いずれも各貫通ホールの内壁側面部において同じ一方向にのみ形成される、請求項7に記載の薄膜型ヒートパイプ。
- 前記溝は、前記貫通ホールの内壁に設けられた凸部と前記分離膜との間に形成される凹み空間である、請求項7に記載の薄膜型ヒートパイプ。
- 前記溝の内部に円形のワイヤ束が設けられる、請求項1に記載の薄膜型ヒートパイプ。
- 押出工程を用いて平板形状を有するボディ部を形成するステップと、
前記ボディ部内に長手方向に貫通ホールを形成するステップと、
前記貫通ホールの内壁側面部の少なくとも一方へ作動流体が流動されるように構成された少なくとも1つの溝を形成するステップと、
を含む薄膜型ヒートパイプの製造方法。 - 前記貫通ホールを複数個の貫通ホールに分離させるための少なくとも1つの分離膜を形成するステップをさらに含む、請求項11に記載の薄膜型ヒートパイプの製造方法。
- 前記溝の内部に円形のワイヤ束を設けるステップをさらに含む、請求項11に記載の薄膜型ヒートパイプの製造方法。
- 前記少なくとも1つの溝を形成するステップでは、前記貫通ホールの内壁に少なくとも1つの凸部を形成する、請求項11に記載の薄膜型ヒートパイプの製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100126778A KR20120065575A (ko) | 2010-12-13 | 2010-12-13 | 압출로 제작되는 박막형 히트파이프 |
KR10-2010-0126778 | 2010-12-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012127642A true JP2012127642A (ja) | 2012-07-05 |
JP5528419B2 JP5528419B2 (ja) | 2014-06-25 |
Family
ID=46198128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011263796A Expired - Fee Related JP5528419B2 (ja) | 2010-12-13 | 2011-12-01 | 押出で製造される薄膜型ヒートパイプ |
Country Status (3)
Country | Link |
---|---|
US (2) | US20120145358A1 (ja) |
JP (1) | JP5528419B2 (ja) |
KR (1) | KR20120065575A (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2015059693A (ja) * | 2013-09-18 | 2015-03-30 | 東芝ホームテクノ株式会社 | シート型ヒートパイプまたは携帯情報端末 |
JP2015200484A (ja) * | 2014-04-03 | 2015-11-12 | 崇賢 ▲黄▼ | ベイパーチャンバ及びその製造方法 |
JP2016017702A (ja) * | 2014-07-09 | 2016-02-01 | 東芝ホームテクノ株式会社 | シート型ヒートパイプ |
WO2019088301A1 (ja) * | 2017-11-06 | 2019-05-09 | 大日本印刷株式会社 | ベーパーチャンバ、電子機器、ベーパーチャンバ用シート、並びに、ベーパーチャンバ用シート及びベーパーチャンバの製造方法 |
JP2019128143A (ja) * | 2018-01-22 | 2019-08-01 | 大日本印刷株式会社 | ベーパーチャンバ、電子機器、及び、ベーパーチャンバ用シート |
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FR2998657B1 (fr) * | 2012-11-28 | 2015-01-30 | Renault Sa | Caloduc reversible plat |
US9549486B2 (en) * | 2013-07-24 | 2017-01-17 | Asia Vital Components Co., Ltd. | Raised bodied vapor chamber structure |
KR101600667B1 (ko) * | 2013-12-05 | 2016-03-07 | 티티엠주식회사 | 엇댄 구조의 윅을 갖는 박형 히트파이프 |
CN105318753A (zh) * | 2014-06-17 | 2016-02-10 | 珠海兴业新能源科技有限公司 | 独立相变传热式抗冻防腐热管 |
GB2527338B (en) * | 2014-06-19 | 2018-11-07 | ECONOTHERM UK Ltd | Heat transfer apparatus |
CN104457360B (zh) * | 2015-01-02 | 2016-11-09 | 季弘 | 具有毛细窄缝的板式热管 |
US10458719B2 (en) * | 2015-01-22 | 2019-10-29 | Pimems, Inc. | High performance two-phase cooling apparatus |
WO2016204328A1 (ko) * | 2015-06-19 | 2016-12-22 | 티티엠주식회사 | 박형 히트파이프 및 이를 위한 제조방법 |
WO2017073715A1 (ja) * | 2015-10-29 | 2017-05-04 | 株式会社Uacj | アルミニウム製押出扁平多穴管及び熱交換器 |
CN105910478B (zh) * | 2016-04-14 | 2018-05-29 | 青岛海尔特种电冰箱有限公司 | 均温容器及具有该均温容器的冰箱 |
US10694641B2 (en) | 2016-04-29 | 2020-06-23 | Intel Corporation | Wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms |
TWM532046U (zh) * | 2016-06-02 | 2016-11-11 | Tai Sol Electronics Co Ltd | 具有液汽分離結構的均溫板 |
CN107660099B (zh) * | 2016-07-26 | 2024-05-24 | 东莞钱锋特殊胶粘制品有限公司 | 平板薄膜式散热装置 |
CN106604621B (zh) * | 2017-01-23 | 2019-04-09 | 苏州天脉导热科技股份有限公司 | 微通道铝均热板 |
KR102458425B1 (ko) * | 2017-10-13 | 2022-10-27 | 한국전자통신연구원 | 방열장치 |
CN110012637A (zh) * | 2018-01-05 | 2019-07-12 | 神讯电脑(昆山)有限公司 | 热导板及散热装置 |
JP7028659B2 (ja) * | 2018-01-30 | 2022-03-02 | 新光電気工業株式会社 | ループ型ヒートパイプ、ループ型ヒートパイプの製造方法 |
FR3080172B1 (fr) * | 2018-04-11 | 2020-05-08 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Caloduc a pompage capillaire a rainures reentrantes offrant un fonctionnement ameliore |
CN110542327B (zh) * | 2018-05-29 | 2021-05-28 | 佳世诠股份有限公司 | 平板状的热交换器及冷冻装置 |
JP7153515B2 (ja) * | 2018-09-25 | 2022-10-14 | 新光電気工業株式会社 | ループ型ヒートパイプ |
JP7197346B2 (ja) * | 2018-12-19 | 2022-12-27 | 新光電気工業株式会社 | ループ型ヒートパイプ |
DE102021120492A1 (de) * | 2021-08-06 | 2023-02-09 | Volkswagen Aktiengesellschaft | Batteriezelle |
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JPS58127091A (ja) * | 1982-01-25 | 1983-07-28 | Fujikura Ltd | 長尺熱輸送用ヒ−トパイプ |
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JP2008531966A (ja) * | 2005-04-19 | 2008-08-14 | 韓國電子通信研究院 | 平板型ヒートパイプ |
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TWI285251B (en) * | 2005-09-15 | 2007-08-11 | Univ Tsinghua | Flat-plate heat pipe containing channels |
-
2010
- 2010-12-13 KR KR1020100126778A patent/KR20120065575A/ko not_active Application Discontinuation
-
2011
- 2011-11-02 US US13/287,193 patent/US20120145358A1/en not_active Abandoned
- 2011-12-01 JP JP2011263796A patent/JP5528419B2/ja not_active Expired - Fee Related
-
2015
- 2015-08-13 US US14/825,412 patent/US20150348802A1/en not_active Abandoned
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JPS58127091A (ja) * | 1982-01-25 | 1983-07-28 | Fujikura Ltd | 長尺熱輸送用ヒ−トパイプ |
JPS6264421A (ja) * | 1985-09-13 | 1987-03-23 | Kobe Steel Ltd | 伝熱管の製造方法 |
JPH01145300A (ja) * | 1987-11-30 | 1989-06-07 | Natl Space Dev Agency Japan(Nasda) | 熱交換装置 |
JPH0579260U (ja) * | 1992-03-12 | 1993-10-29 | 株式会社東芝 | 平板型ヒートパイプ |
JPH08303970A (ja) * | 1995-04-28 | 1996-11-22 | Fujikura Ltd | 携帯型パソコン冷却用の偏平ヒートパイプおよびその製造方法 |
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JP2008531966A (ja) * | 2005-04-19 | 2008-08-14 | 韓國電子通信研究院 | 平板型ヒートパイプ |
JP2007113864A (ja) * | 2005-10-21 | 2007-05-10 | Sony Corp | 熱輸送装置及び電子機器 |
JP2007212028A (ja) * | 2006-02-08 | 2007-08-23 | Fujikura Ltd | ヒートパイプ |
WO2010060342A1 (zh) * | 2008-11-03 | 2010-06-03 | Zhao Yaohua | 具有微孔管阵列的热管及其加工工艺及换热系统 |
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JP2015200484A (ja) * | 2014-04-03 | 2015-11-12 | 崇賢 ▲黄▼ | ベイパーチャンバ及びその製造方法 |
JP2016017702A (ja) * | 2014-07-09 | 2016-02-01 | 東芝ホームテクノ株式会社 | シート型ヒートパイプ |
WO2019088301A1 (ja) * | 2017-11-06 | 2019-05-09 | 大日本印刷株式会社 | ベーパーチャンバ、電子機器、ベーパーチャンバ用シート、並びに、ベーパーチャンバ用シート及びベーパーチャンバの製造方法 |
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JP7563514B2 (ja) | 2018-01-22 | 2024-10-08 | 大日本印刷株式会社 | ベーパーチャンバ、電子機器、及び、ベーパーチャンバ用シート |
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US20150348802A1 (en) | 2015-12-03 |
US20120145358A1 (en) | 2012-06-14 |
KR20120065575A (ko) | 2012-06-21 |
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