JP2008531966A - 平板型ヒートパイプ - Google Patents
平板型ヒートパイプ Download PDFInfo
- Publication number
- JP2008531966A JP2008531966A JP2007556965A JP2007556965A JP2008531966A JP 2008531966 A JP2008531966 A JP 2008531966A JP 2007556965 A JP2007556965 A JP 2007556965A JP 2007556965 A JP2007556965 A JP 2007556965A JP 2008531966 A JP2008531966 A JP 2008531966A
- Authority
- JP
- Japan
- Prior art keywords
- heat pipe
- flat plate
- plate heat
- present
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/02—Tubular elements of cross-section which is non-circular
- F28F1/022—Tubular elements of cross-section which is non-circular with multiple channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (3)
- 平板型ヒートパイプは、そこに形成された所定の貫通孔を有する平らなパイプ、および前記貫通孔の内側の表面から左右に延びる複数の溝を含み、前記ヒートパイプの内部が真空状態の間、作動流体の液体およびガスの状態の間のフェーズ変更のために、前記ヒートパイプ内の熱が外部に放出され、複数の溝から実現される毛管力により前記作動流体が流動することを特徴とする平板型ヒートパイプ。
- 前記貫通孔内に複数の流路を形成するための分離膜がさらに備えることを特徴とする請求項1に記載の平板型ヒートパイプ。
- 前記複数の溝のそれぞれは、前記毛細管力が実現される少なくとも1つの角を有すことを特徴とする請求項1に記載の平板型ヒートパイプ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050032212A KR100631050B1 (ko) | 2005-04-19 | 2005-04-19 | 평판형 히트 파이프 |
PCT/KR2006/000087 WO2006112586A1 (en) | 2005-04-19 | 2006-01-10 | Flat plate-type heat pipe |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008531966A true JP2008531966A (ja) | 2008-08-14 |
Family
ID=37115274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007556965A Pending JP2008531966A (ja) | 2005-04-19 | 2006-01-10 | 平板型ヒートパイプ |
Country Status (5)
Country | Link |
---|---|
US (1) | US20080185128A1 (ja) |
JP (1) | JP2008531966A (ja) |
KR (1) | KR100631050B1 (ja) |
TW (1) | TWI297766B (ja) |
WO (1) | WO2006112586A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012127642A (ja) * | 2010-12-13 | 2012-07-05 | Korea Electronics Telecommun | 押出で製造される薄膜型ヒートパイプ |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008185283A (ja) * | 2007-01-31 | 2008-08-14 | Toshiba Home Technology Corp | ヒートパイプ |
KR20080076423A (ko) * | 2007-02-16 | 2008-08-20 | 엘에스엠트론 주식회사 | 판형 히트 파이프 및 그 제조방법 |
DE602008002507D1 (de) * | 2007-08-27 | 2010-10-28 | Abb Research Ltd | Wärmetauscher für Komponenten der Leistungselektronik |
TWI413887B (zh) * | 2008-01-07 | 2013-11-01 | Compal Electronics Inc | 熱管結構 |
KR100942063B1 (ko) | 2008-03-03 | 2010-02-11 | 한국생산기술연구원 | 사각 채널형 히트 파이프 |
TW201100736A (en) * | 2009-06-17 | 2011-01-01 | Yeh Chiang Technology Corp | Superthin heat pipe |
JP5455503B2 (ja) * | 2009-08-11 | 2014-03-26 | モレックス インコーポレイテド | 熱輸送ユニット、電子機器 |
WO2011142841A2 (en) | 2010-01-14 | 2011-11-17 | University Of Virginia Patent Foundation | Multifunctional thermal management system and related method |
US8311708B2 (en) * | 2010-02-16 | 2012-11-13 | Ford Global Technologies, Llc | Adjustable grill shutter system |
US20110214841A1 (en) * | 2010-03-04 | 2011-09-08 | Kunshan Jue-Chung Electronics Co. | Flat heat pipe structure |
CN102012181A (zh) * | 2010-06-21 | 2011-04-13 | 邹飞龙 | 板式多通道异形腔热超导管 |
US20120080170A1 (en) * | 2010-10-04 | 2012-04-05 | Hsiu-Wei Yang | Plate-type heat pipe sealing structure and manufacturing method thereof |
KR20120065569A (ko) * | 2010-12-13 | 2012-06-21 | 한국전자통신연구원 | 박막형 히트 파이프 |
KR101158682B1 (ko) | 2010-12-30 | 2012-06-25 | 주식회사 케이에스비 | 다채널 평판형 히트파이프를 이용한 진공관형 태양열 집열기 |
FR2976739A3 (fr) * | 2011-06-16 | 2012-12-21 | Renault Sa | Dispositif de regulation thermique d’une batterie d’accumulateurs d’un vehicule a motorisation electrique |
KR20130050790A (ko) | 2011-11-08 | 2013-05-16 | 한국전자통신연구원 | 평판 히트 파이프 및 그 제조 방법 |
CN102661670B (zh) * | 2012-05-17 | 2014-09-03 | 程宝华 | 一种超导纳米传热板式换热器及其制造方法 |
KR20140029633A (ko) * | 2012-08-29 | 2014-03-11 | 한국전자통신연구원 | 모세관력이 향상된 방열소자 및 그 제조방법 |
KR101465628B1 (ko) * | 2012-09-28 | 2014-11-28 | 전자부품연구원 | 집광형 태양전지 모듈 |
FR2998657B1 (fr) * | 2012-11-28 | 2015-01-30 | Renault Sa | Caloduc reversible plat |
TW201437591A (zh) * | 2013-03-26 | 2014-10-01 | Asustek Comp Inc | 熱管結構 |
US20140352926A1 (en) * | 2013-05-31 | 2014-12-04 | Cooler Master Co., Ltd. | Shell structure for handheld device |
US9421648B2 (en) * | 2013-10-31 | 2016-08-23 | Asia Vital Components Co., Ltd. | Manufacturing method of heat pipe structure |
KR101600667B1 (ko) * | 2013-12-05 | 2016-03-07 | 티티엠주식회사 | 엇댄 구조의 윅을 갖는 박형 히트파이프 |
US10698458B2 (en) * | 2014-06-02 | 2020-06-30 | Microsoft Technology Licensing, Llc | Integrated vapor chamber for thermal management of computing devices |
WO2016121115A1 (ja) * | 2015-01-30 | 2016-08-04 | 三菱電機株式会社 | 熱交換器および冷凍サイクル装置 |
KR102219482B1 (ko) | 2015-03-03 | 2021-02-25 | 한국전자통신연구원 | 반도체 소자 |
CN107835926A (zh) * | 2015-06-19 | 2018-03-23 | 株式会社Innotm | 薄型热管及其制造方法 |
CN105352351B (zh) * | 2015-11-03 | 2018-07-06 | 刘树宇 | 一种均温板改进结构 |
US10694641B2 (en) * | 2016-04-29 | 2020-06-23 | Intel Corporation | Wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms |
CN108253827B (zh) * | 2016-12-28 | 2020-06-23 | 神讯电脑(昆山)有限公司 | 铝挤型热板及其制造方法 |
WO2018198354A1 (ja) * | 2017-04-28 | 2018-11-01 | 株式会社村田製作所 | ベーパーチャンバー |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000193385A (ja) * | 1998-12-24 | 2000-07-14 | Furukawa Electric Co Ltd:The | 平面型ヒートパイプ |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5179043A (en) * | 1989-07-14 | 1993-01-12 | The Texas A&M University System | Vapor deposited micro heat pipes |
US5219021A (en) * | 1991-10-17 | 1993-06-15 | Grumman Aerospace Corporation | Large capacity re-entrant groove heat pipe |
US5309986A (en) * | 1992-11-30 | 1994-05-10 | Satomi Itoh | Heat pipe |
JPH11101585A (ja) * | 1997-09-29 | 1999-04-13 | Furukawa Electric Co Ltd:The | 板型ヒートパイプとその実装構造 |
US6216343B1 (en) * | 1999-09-02 | 2001-04-17 | The United States Of America As Represented By The Secretary Of The Air Force | Method of making micro channel heat pipe having corrugated fin elements |
KR200259040Y1 (ko) * | 2001-09-04 | 2001-12-31 | 주식회사 한국에치피티 | 평판형 히트파이프 |
KR200297491Y1 (ko) * | 2002-08-26 | 2002-12-11 | (주) 대홍기업 | 평판형 히트파이프와 히트싱크 |
US20040112572A1 (en) * | 2002-12-17 | 2004-06-17 | Moon Seok Hwan | Micro heat pipe with poligonal cross-section manufactured via extrusion or drawing |
-
2005
- 2005-04-19 KR KR1020050032212A patent/KR100631050B1/ko active IP Right Grant
- 2005-12-20 TW TW094145188A patent/TWI297766B/zh not_active IP Right Cessation
-
2006
- 2006-01-10 JP JP2007556965A patent/JP2008531966A/ja active Pending
- 2006-01-10 US US11/815,364 patent/US20080185128A1/en not_active Abandoned
- 2006-01-10 WO PCT/KR2006/000087 patent/WO2006112586A1/en active Application Filing
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000193385A (ja) * | 1998-12-24 | 2000-07-14 | Furukawa Electric Co Ltd:The | 平面型ヒートパイプ |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012127642A (ja) * | 2010-12-13 | 2012-07-05 | Korea Electronics Telecommun | 押出で製造される薄膜型ヒートパイプ |
Also Published As
Publication number | Publication date |
---|---|
WO2006112586A1 (en) | 2006-10-26 |
KR100631050B1 (ko) | 2006-10-04 |
US20080185128A1 (en) | 2008-08-07 |
TWI297766B (en) | 2008-06-11 |
TW200638016A (en) | 2006-11-01 |
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A131 | Notification of reasons for refusal |
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