KR100631050B1 - 평판형 히트 파이프 - Google Patents
평판형 히트 파이프 Download PDFInfo
- Publication number
- KR100631050B1 KR100631050B1 KR1020050032212A KR20050032212A KR100631050B1 KR 100631050 B1 KR100631050 B1 KR 100631050B1 KR 1020050032212 A KR1020050032212 A KR 1020050032212A KR 20050032212 A KR20050032212 A KR 20050032212A KR 100631050 B1 KR100631050 B1 KR 100631050B1
- Authority
- KR
- South Korea
- Prior art keywords
- heat pipe
- present
- hole
- flat panel
- panel type
- Prior art date
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/02—Tubular elements of cross-section which is non-circular
- F28F1/022—Tubular elements of cross-section which is non-circular with multiple channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (3)
- 제 1 항에 있어서, 상기 관통홀 내에 복수개의 유로가 형성되도록 분리막이 더 형성되는 것을 특징으로 하는 평판형 히트 파이프.
- 삭제
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050032212A KR100631050B1 (ko) | 2005-04-19 | 2005-04-19 | 평판형 히트 파이프 |
TW094145188A TWI297766B (en) | 2005-04-19 | 2005-12-20 | Flat plate-type heat pipe |
JP2007556965A JP2008531966A (ja) | 2005-04-19 | 2006-01-10 | 平板型ヒートパイプ |
US11/815,364 US20080185128A1 (en) | 2005-04-19 | 2006-01-10 | Flat Plate-Type Heat Pipe |
PCT/KR2006/000087 WO2006112586A1 (en) | 2005-04-19 | 2006-01-10 | Flat plate-type heat pipe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050032212A KR100631050B1 (ko) | 2005-04-19 | 2005-04-19 | 평판형 히트 파이프 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100631050B1 true KR100631050B1 (ko) | 2006-10-04 |
Family
ID=37115274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050032212A KR100631050B1 (ko) | 2005-04-19 | 2005-04-19 | 평판형 히트 파이프 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20080185128A1 (ko) |
JP (1) | JP2008531966A (ko) |
KR (1) | KR100631050B1 (ko) |
TW (1) | TWI297766B (ko) |
WO (1) | WO2006112586A1 (ko) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008100007A1 (en) * | 2007-02-16 | 2008-08-21 | Ls Mtron, Ltd. | Flat plate heat pipe and method for manufacturing the same |
KR100942063B1 (ko) | 2008-03-03 | 2010-02-11 | 한국생산기술연구원 | 사각 채널형 히트 파이프 |
KR101158682B1 (ko) | 2010-12-30 | 2012-06-25 | 주식회사 케이에스비 | 다채널 평판형 히트파이프를 이용한 진공관형 태양열 집열기 |
WO2014051289A1 (ko) * | 2012-09-28 | 2014-04-03 | 전자부품연구원 | 집광형 태양전지 모듈 |
WO2015084064A1 (ko) * | 2013-12-05 | 2015-06-11 | 티티엠주식회사 | 엇댄 구조의 윅을 갖는 박형 히트파이프 |
US9179577B2 (en) | 2011-11-08 | 2015-11-03 | Electronics And Telecommunications Research Institute | Flat heat pipe and fabrication method thereof |
WO2016204328A1 (ko) * | 2015-06-19 | 2016-12-22 | 티티엠주식회사 | 박형 히트파이프 및 이를 위한 제조방법 |
CN108253827A (zh) * | 2016-12-28 | 2018-07-06 | 神讯电脑(昆山)有限公司 | 铝挤型热板及其制造方法 |
Families Citing this family (25)
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JP2008185283A (ja) * | 2007-01-31 | 2008-08-14 | Toshiba Home Technology Corp | ヒートパイプ |
EP2031332B1 (en) * | 2007-08-27 | 2010-09-15 | ABB Research LTD | Heat exchanger for power-electronics components |
TWI413887B (zh) * | 2008-01-07 | 2013-11-01 | Compal Electronics Inc | 熱管結構 |
TW201100736A (en) * | 2009-06-17 | 2011-01-01 | Yeh Chiang Technology Corp | Superthin heat pipe |
JP5455503B2 (ja) * | 2009-08-11 | 2014-03-26 | モレックス インコーポレイテド | 熱輸送ユニット、電子機器 |
US10107560B2 (en) | 2010-01-14 | 2018-10-23 | University Of Virginia Patent Foundation | Multifunctional thermal management system and related method |
US8311708B2 (en) * | 2010-02-16 | 2012-11-13 | Ford Global Technologies, Llc | Adjustable grill shutter system |
US20110214841A1 (en) * | 2010-03-04 | 2011-09-08 | Kunshan Jue-Chung Electronics Co. | Flat heat pipe structure |
CN102012181A (zh) * | 2010-06-21 | 2011-04-13 | 邹飞龙 | 板式多通道异形腔热超导管 |
US20120080170A1 (en) * | 2010-10-04 | 2012-04-05 | Hsiu-Wei Yang | Plate-type heat pipe sealing structure and manufacturing method thereof |
KR20120065575A (ko) * | 2010-12-13 | 2012-06-21 | 한국전자통신연구원 | 압출로 제작되는 박막형 히트파이프 |
KR20120065569A (ko) * | 2010-12-13 | 2012-06-21 | 한국전자통신연구원 | 박막형 히트 파이프 |
FR2976739A3 (fr) * | 2011-06-16 | 2012-12-21 | Renault Sa | Dispositif de regulation thermique d’une batterie d’accumulateurs d’un vehicule a motorisation electrique |
CN102661670B (zh) * | 2012-05-17 | 2014-09-03 | 程宝华 | 一种超导纳米传热板式换热器及其制造方法 |
KR20140029633A (ko) * | 2012-08-29 | 2014-03-11 | 한국전자통신연구원 | 모세관력이 향상된 방열소자 및 그 제조방법 |
FR2998657B1 (fr) * | 2012-11-28 | 2015-01-30 | Renault Sa | Caloduc reversible plat |
TW201437591A (zh) * | 2013-03-26 | 2014-10-01 | Asustek Comp Inc | 熱管結構 |
US20140352926A1 (en) * | 2013-05-31 | 2014-12-04 | Cooler Master Co., Ltd. | Shell structure for handheld device |
US9421648B2 (en) * | 2013-10-31 | 2016-08-23 | Asia Vital Components Co., Ltd. | Manufacturing method of heat pipe structure |
US10698458B2 (en) * | 2014-06-02 | 2020-06-30 | Microsoft Technology Licensing, Llc | Integrated vapor chamber for thermal management of computing devices |
JP6388670B2 (ja) * | 2015-01-30 | 2018-09-12 | 三菱電機株式会社 | 冷凍サイクル装置 |
KR102219482B1 (ko) | 2015-03-03 | 2021-02-25 | 한국전자통신연구원 | 반도체 소자 |
CN105352351B (zh) * | 2015-11-03 | 2018-07-06 | 刘树宇 | 一种均温板改进结构 |
US10694641B2 (en) | 2016-04-29 | 2020-06-23 | Intel Corporation | Wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms |
WO2018198354A1 (ja) * | 2017-04-28 | 2018-11-01 | 株式会社村田製作所 | ベーパーチャンバー |
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US5179043A (en) * | 1989-07-14 | 1993-01-12 | The Texas A&M University System | Vapor deposited micro heat pipes |
US5219021A (en) * | 1991-10-17 | 1993-06-15 | Grumman Aerospace Corporation | Large capacity re-entrant groove heat pipe |
US5309986A (en) * | 1992-11-30 | 1994-05-10 | Satomi Itoh | Heat pipe |
JPH11101585A (ja) * | 1997-09-29 | 1999-04-13 | Furukawa Electric Co Ltd:The | 板型ヒートパイプとその実装構造 |
JP2000193385A (ja) * | 1998-12-24 | 2000-07-14 | Furukawa Electric Co Ltd:The | 平面型ヒートパイプ |
US6216343B1 (en) * | 1999-09-02 | 2001-04-17 | The United States Of America As Represented By The Secretary Of The Air Force | Method of making micro channel heat pipe having corrugated fin elements |
KR200259040Y1 (ko) * | 2001-09-04 | 2001-12-31 | 주식회사 한국에치피티 | 평판형 히트파이프 |
KR200297491Y1 (ko) * | 2002-08-26 | 2002-12-11 | (주) 대홍기업 | 평판형 히트파이프와 히트싱크 |
US20040112572A1 (en) * | 2002-12-17 | 2004-06-17 | Moon Seok Hwan | Micro heat pipe with poligonal cross-section manufactured via extrusion or drawing |
-
2005
- 2005-04-19 KR KR1020050032212A patent/KR100631050B1/ko active IP Right Grant
- 2005-12-20 TW TW094145188A patent/TWI297766B/zh not_active IP Right Cessation
-
2006
- 2006-01-10 US US11/815,364 patent/US20080185128A1/en not_active Abandoned
- 2006-01-10 JP JP2007556965A patent/JP2008531966A/ja active Pending
- 2006-01-10 WO PCT/KR2006/000087 patent/WO2006112586A1/en active Application Filing
Non-Patent Citations (2)
Title |
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11101585 |
12193385 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008100007A1 (en) * | 2007-02-16 | 2008-08-21 | Ls Mtron, Ltd. | Flat plate heat pipe and method for manufacturing the same |
KR100942063B1 (ko) | 2008-03-03 | 2010-02-11 | 한국생산기술연구원 | 사각 채널형 히트 파이프 |
KR101158682B1 (ko) | 2010-12-30 | 2012-06-25 | 주식회사 케이에스비 | 다채널 평판형 히트파이프를 이용한 진공관형 태양열 집열기 |
US9179577B2 (en) | 2011-11-08 | 2015-11-03 | Electronics And Telecommunications Research Institute | Flat heat pipe and fabrication method thereof |
WO2014051289A1 (ko) * | 2012-09-28 | 2014-04-03 | 전자부품연구원 | 집광형 태양전지 모듈 |
KR101465628B1 (ko) | 2012-09-28 | 2014-11-28 | 전자부품연구원 | 집광형 태양전지 모듈 |
WO2015084064A1 (ko) * | 2013-12-05 | 2015-06-11 | 티티엠주식회사 | 엇댄 구조의 윅을 갖는 박형 히트파이프 |
KR20150065426A (ko) * | 2013-12-05 | 2015-06-15 | 티티엠주식회사 | 엇댄 구조의 윅을 갖는 박형 히트파이프 |
KR101600667B1 (ko) * | 2013-12-05 | 2016-03-07 | 티티엠주식회사 | 엇댄 구조의 윅을 갖는 박형 히트파이프 |
WO2016204328A1 (ko) * | 2015-06-19 | 2016-12-22 | 티티엠주식회사 | 박형 히트파이프 및 이를 위한 제조방법 |
CN108253827A (zh) * | 2016-12-28 | 2018-07-06 | 神讯电脑(昆山)有限公司 | 铝挤型热板及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20080185128A1 (en) | 2008-08-07 |
WO2006112586A1 (en) | 2006-10-26 |
TW200638016A (en) | 2006-11-01 |
JP2008531966A (ja) | 2008-08-14 |
TWI297766B (en) | 2008-06-11 |
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