JP2011526052A5 - - Google Patents

Download PDF

Info

Publication number
JP2011526052A5
JP2011526052A5 JP2011512492A JP2011512492A JP2011526052A5 JP 2011526052 A5 JP2011526052 A5 JP 2011526052A5 JP 2011512492 A JP2011512492 A JP 2011512492A JP 2011512492 A JP2011512492 A JP 2011512492A JP 2011526052 A5 JP2011526052 A5 JP 2011526052A5
Authority
JP
Japan
Prior art keywords
encapsulating composition
adhesive encapsulating
weight
emitting unit
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011512492A
Other languages
English (en)
Japanese (ja)
Other versions
JP5270755B2 (ja
JP2011526052A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2009/041510 external-priority patent/WO2009148716A2/en
Publication of JP2011526052A publication Critical patent/JP2011526052A/ja
Publication of JP2011526052A5 publication Critical patent/JP2011526052A5/ja
Application granted granted Critical
Publication of JP5270755B2 publication Critical patent/JP5270755B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011512492A 2008-06-02 2009-04-23 接着剤封入組成物及びそれで作られた電子デバイス Active JP5270755B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US5806708P 2008-06-02 2008-06-02
US61/058,067 2008-06-02
PCT/US2009/041510 WO2009148716A2 (en) 2008-06-02 2009-04-23 Adhesive encapsulating composition and electronic devices made therewith

Publications (3)

Publication Number Publication Date
JP2011526052A JP2011526052A (ja) 2011-09-29
JP2011526052A5 true JP2011526052A5 (OSRAM) 2012-06-14
JP5270755B2 JP5270755B2 (ja) 2013-08-21

Family

ID=41398750

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011512492A Active JP5270755B2 (ja) 2008-06-02 2009-04-23 接着剤封入組成物及びそれで作られた電子デバイス

Country Status (7)

Country Link
US (1) US20110073901A1 (OSRAM)
EP (1) EP2291479B1 (OSRAM)
JP (1) JP5270755B2 (OSRAM)
KR (1) KR20110020862A (OSRAM)
CN (1) CN102076803B (OSRAM)
TW (1) TW201005063A (OSRAM)
WO (1) WO2009148716A2 (OSRAM)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9024455B2 (en) * 2010-05-26 2015-05-05 Hitachi Chemical Company, Ltd. Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device
US8232350B2 (en) * 2008-06-02 2012-07-31 3M Innovative Properties Company Adhesive encapsulating composition and electronic devices made therewith
US8524358B2 (en) * 2009-11-04 2013-09-03 Klockner Pentaplast Of America, Inc. Configuration of multiple thermoformable film layers for rigid packaging requiring moisture and oxygen protection
CN102666764B (zh) 2009-11-19 2015-09-30 3M创新有限公司 包含与丙烯酸类聚合物氢键结合的官能化聚异丁烯的压敏粘合剂
CN102666714B (zh) 2009-11-19 2015-04-29 3M创新有限公司 包含合成橡胶和与丙烯酸类聚合物结合的官能化合成橡胶的共混物的压敏粘合剂
JP2011151388A (ja) * 2009-12-24 2011-08-04 Mitsubishi Plastics Inc 太陽電池封止材及びそれを用いて作製された太陽電池モジュール
WO2011132589A1 (ja) * 2010-04-22 2011-10-27 ダイセル化学工業株式会社 光半導体保護材及びその前駆体並びに光半導体保護材の製造方法
TWI522438B (zh) 2010-11-02 2016-02-21 Lg化學股份有限公司 黏著層及利用其封裝有機電子裝置之方法
JP2014500354A (ja) 2010-11-16 2014-01-09 スリーエム イノベイティブ プロパティズ カンパニー 紫外線硬化性無水物変性ポリ(イソブチレン)
US8663407B2 (en) 2010-11-17 2014-03-04 3M Innovative Properties Company Isobutylene (Co)polymeric adhesive composition
US8629209B2 (en) 2010-12-02 2014-01-14 3M Innovative Properties Company Moisture curable isobutylene adhesive copolymers
TWI552883B (zh) * 2011-07-25 2016-10-11 Lintec Corp Gas barrier film laminates and electronic components
CN103842459B (zh) * 2011-09-29 2016-02-10 三井化学株式会社 粘接性组合物以及使用其的图像显示装置
KR101472199B1 (ko) * 2012-01-06 2014-12-11 주식회사 엘지화학 봉지용 필름
US8481626B1 (en) 2012-01-16 2013-07-09 Itron, Inc. Wax-based encapsulant/moisture barrier for use with electronics received in water meter pits
US8728568B2 (en) 2012-01-16 2014-05-20 Itron, Inc. Method for encapsulation of electronics received in water meter pits with an improved wax-based encapsulant/moisture barrier
WO2013137621A1 (ko) * 2012-03-12 2013-09-19 주식회사 엘지화학 점착제 조성물
US20150050432A1 (en) * 2012-03-28 2015-02-19 Showa Denko K.K. Polymerizable composition, polymerization product, adhesive sheet, method for manufacturing an image display device, and image display device
CN104507979B (zh) 2012-03-29 2017-12-15 3M创新有限公司 包含含有侧接可自由基聚合的季铵取代基的聚(异丁烯)共聚物的粘合剂
WO2013169317A1 (en) 2012-05-11 2013-11-14 3M Innovative Properties Company Adhesives comprising reaction product of halogenated poly(isobutylene) copolymers and polyamines
US20150107669A1 (en) * 2012-05-22 2015-04-23 Sekisui Chemical Co., Ltd. Sheet-shaped seal member, and layered sheet-shaped seal member
WO2014021698A1 (ko) 2012-08-03 2014-02-06 주식회사 엘지화학 접착 필름 및 이를 이용한 유기전자장치의 봉지 방법
EP2885363B1 (en) 2012-08-14 2018-02-07 3M Innovative Properties Company Adhesives comprising grafted isobutylene copolymer
US9269623B2 (en) 2012-10-25 2016-02-23 Rohm And Haas Electronic Materials Llc Ephemeral bonding
US9007538B2 (en) 2012-10-31 2015-04-14 Industrial Technology Research Institute Barrier functional film and manufacturing thereof, environmental sensitive electronic device, and display apparatus
JP6244088B2 (ja) * 2012-11-29 2017-12-06 東京応化工業株式会社 接着剤組成物、接着フィルムおよび積層体
JP5914397B2 (ja) 2013-03-19 2016-05-11 富士フイルム株式会社 機能性フィルム
CN103436203B (zh) * 2013-07-08 2015-06-03 北京京东方光电科技有限公司 封框胶及其制备方法和显示装置
KR20150016876A (ko) * 2013-08-05 2015-02-13 주식회사 엘지화학 점착제 조성물, 점착 필름 및 이를 이용한 유기전자장치의 봉지방법
WO2015046881A1 (ko) 2013-09-24 2015-04-02 주식회사 엘지화학 점착성 조성물
US9315696B2 (en) * 2013-10-31 2016-04-19 Dow Global Technologies Llc Ephemeral bonding
US20150166789A1 (en) * 2013-12-18 2015-06-18 Sabic Innovative Plastics Ip B.V. Poly(phenylene ether) fiber, method of forming, and articles therefrom
KR20150097359A (ko) * 2014-02-18 2015-08-26 주식회사 엘지화학 봉지 필름 및 이를 포함하는 유기전자장치
KR20170013914A (ko) * 2014-06-27 2017-02-07 후지필름 가부시키가이샤 유기 전자 장치용 밀봉 부재
CN104282728B (zh) * 2014-10-10 2017-03-15 深圳市华星光电技术有限公司 一种白光oled显示器及其封装方法
CN104479574B (zh) * 2014-12-31 2017-03-08 广州鹿山新材料股份有限公司 一种增透的聚烯烃光伏组件封装胶膜及其制备方法
WO2016152389A1 (ja) 2015-03-25 2016-09-29 リケンテクノス株式会社 熱可塑性樹脂組成物、接着性塗料、及びこれを用いた積層体
JP6550275B2 (ja) * 2015-06-15 2019-07-24 東京応化工業株式会社 ナノインプリント用組成物、硬化物、パターン形成方法及びパターンを含む物品
CN107743652A (zh) * 2015-07-22 2018-02-27 英特尔公司 多层封装
DE102015222027A1 (de) * 2015-11-09 2017-05-11 Tesa Se Barriereklebemasse mit polymerem Gettermaterial
CN108602309B (zh) * 2016-02-01 2022-04-12 3M创新有限公司 阻挡复合物
KR102563022B1 (ko) * 2016-04-04 2023-08-07 덕산네오룩스 주식회사 유기전기발광소자용 봉지 화합물, 조성물 및 이를 포함하는 봉지화된 장치
US10121990B2 (en) * 2016-04-28 2018-11-06 Electronics And Telecommunications Research Institute Organic light emitting devices and methods of fabricating the same
JP6992751B2 (ja) * 2016-06-28 2022-01-13 日本ゼオン株式会社 半導体パッケージ製造用支持体、半導体パッケージ製造用支持体の使用、及び半導体パッケージの製造方法
CN105938873A (zh) 2016-07-01 2016-09-14 武汉华星光电技术有限公司 一种柔性显示装置及其制造方法
CN107658231B (zh) * 2016-07-26 2019-08-02 中国科学院苏州纳米技术与纳米仿生研究所 电子器件的干法封装方法及电子器件封装结构
CN109564927B (zh) * 2016-07-29 2023-06-20 特里纳米克斯股份有限公司 光学传感器和用于光学检测的检测器
BR112019003127A2 (pt) 2016-08-15 2019-05-21 Klöckner Pentaplast Of America, Inc laminado de enchimento a quente
WO2018193392A1 (en) 2017-04-21 2018-10-25 3M Innovative Properties Company Barrier adhesive compositions and articles
KR102505265B1 (ko) * 2017-06-23 2023-03-06 삼성디스플레이 주식회사 전자 장치
US11591501B2 (en) 2017-12-06 2023-02-28 3M Innovative Properties Company Barrier adhesive compositions and articles
US11349103B2 (en) * 2018-03-15 2022-05-31 Dell Products L.P. Display assembly apparatus and methods for information handling systems
DE102018112817A1 (de) 2018-05-29 2019-12-05 Klöckner Pentaplast Gmbh Transparente Polymerfolie mit Verfärbungskompensation
JP7388228B2 (ja) * 2020-02-14 2023-11-29 住友ベークライト株式会社 光硬化性接着剤組成物、フィルム、および光学部品
JP2021172812A (ja) * 2020-04-21 2021-11-01 Jsr株式会社 熱可塑性エラストマー組成物及び成形体
US20230322978A1 (en) * 2020-08-28 2023-10-12 Rimtec Corporation Cycloolefin resin cured product having oxygen barrier properties
CA3196216A1 (en) 2020-11-18 2022-05-27 Wade Jackson Kammauff Thermoformed packaging and methods of forming the same
WO2022221874A1 (en) 2021-04-15 2022-10-20 H.B. Fuller Company Hot melt composition in the form of a film for use in thin film photovoltaic modules

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3657159A (en) * 1968-10-14 1972-04-18 Hercules Inc Epoxide polymerization catalysts comprising complex organoaluminate compounds of silicon tin or phosphorus
US3657149A (en) * 1968-10-14 1972-04-18 Hercules Inc Catalyst compositions
EP0192965B1 (en) * 1985-01-30 1990-04-04 Kao Corporation Absorbent article
JPH0329291A (ja) * 1989-06-27 1991-02-07 Sumitomo Bakelite Co Ltd 有機分散型elランプ用捕水フィルム
US5188875A (en) * 1989-08-25 1993-02-23 Mitsui Petrochemical Industries, Ltd. Information recording medium and adhesive composition therefor
US5238519A (en) * 1990-10-17 1993-08-24 United Solar Systems Corporation Solar cell lamination apparatus
US5252694A (en) * 1992-01-22 1993-10-12 Minnesota Mining And Manufacturing Company Energy-polymerization adhesive, coating, film and process for making the same
JPH05306311A (ja) * 1992-04-30 1993-11-19 Mitsubishi Petrochem Co Ltd グラフト変性共重合体の製造法
US5721289A (en) * 1994-11-04 1998-02-24 Minnesota Mining And Manufacturing Company Stable, low cure-temperature semi-structural pressure sensitive adhesive
KR100363979B1 (ko) * 1994-11-17 2003-01-30 시바 스페셜티 케미칼스 홀딩 인크. 교차결합가능한단량체및조성물및교차결합된중합체
JP3222361B2 (ja) * 1995-08-15 2001-10-29 キヤノン株式会社 太陽電池モジュールの製造方法及び太陽電池モジュール
AU731869B2 (en) * 1998-11-12 2001-04-05 Kaneka Corporation Solar cell module
US6226890B1 (en) * 2000-04-07 2001-05-08 Eastman Kodak Company Desiccation of moisture-sensitive electronic devices
EP1357405A4 (en) * 2001-01-31 2007-08-22 Zeon Corp LIGHTING PLATE AND LIGHTING UNIT
DE10141379A1 (de) * 2001-08-23 2003-04-30 Tesa Ag Oberflächenschutzfolie für lackierte Flächen mit einem Kleber auf Basis von hydrierten Blockcopolymeren
US6946676B2 (en) * 2001-11-05 2005-09-20 3M Innovative Properties Company Organic thin film transistor with polymeric interface
US6835950B2 (en) * 2002-04-12 2004-12-28 Universal Display Corporation Organic electronic devices with pressure sensitive adhesive layer
US20050227082A1 (en) * 2002-06-17 2005-10-13 Hironobu Shimazu Adhesive for sealing organic electroluminescent element and use thereof
US20040253464A1 (en) * 2002-07-30 2004-12-16 Thorsten Krawinkel Surface protection film for painted surfaces with an adhesive based on hydrogenated block copolymers
EP1308084A1 (en) * 2002-10-02 2003-05-07 Ciba SC Holding AG Synergistic UV absorber combination
US6790914B2 (en) * 2002-11-29 2004-09-14 Jsr Corporation Resin film and applications thereof
US6975067B2 (en) * 2002-12-19 2005-12-13 3M Innovative Properties Company Organic electroluminescent device and encapsulation method
US7018713B2 (en) * 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US7279777B2 (en) * 2003-05-08 2007-10-09 3M Innovative Properties Company Organic polymers, laminates, and capacitors
US20040238846A1 (en) * 2003-05-30 2004-12-02 Georg Wittmann Organic electronic device
US7535017B2 (en) * 2003-05-30 2009-05-19 Osram Opto Semiconductors Gmbh Flexible multilayer packaging material and electronic devices with the packaging material
US20050090566A1 (en) * 2003-10-01 2005-04-28 Nitzman Alan F. Synthetic resins in casein-stabilized rosin size emulsions
JP4206899B2 (ja) * 2003-10-27 2009-01-14 Jsr株式会社 面実装型led素子
DE10357321A1 (de) * 2003-12-05 2005-07-21 Tesa Ag Hochtackige Klebmasse, Verfahren zu deren Herstellung und deren Verwendung
JP4410055B2 (ja) * 2004-08-02 2010-02-03 日東電工株式会社 位相差粘着剤層、その製造方法、粘着型光学フィルム、その製造方法および画像表示装置
JP2005347204A (ja) * 2004-06-07 2005-12-15 Canon Inc 有機el素子及びその製造方法
JP2006008761A (ja) * 2004-06-23 2006-01-12 Tosoh Corp ホットメルト接着剤組成物
US7316756B2 (en) * 2004-07-27 2008-01-08 Eastman Kodak Company Desiccant for top-emitting OLED
US7875686B2 (en) * 2004-08-18 2011-01-25 Promerus Llc Polycycloolefin polymeric compositions for semiconductor applications
US20060063015A1 (en) * 2004-09-23 2006-03-23 3M Innovative Properties Company Protected polymeric film
US7329465B2 (en) * 2004-10-29 2008-02-12 3M Innovative Properties Company Optical films incorporating cyclic olefin copolymers
WO2006049951A1 (en) * 2004-10-29 2006-05-11 3M Innovative Properties Company Optical films incorporating cyclic olefin copolymers
TWI389925B (zh) * 2004-11-09 2013-03-21 Idemitsu Kosan Co Optoelectronic semiconductors
JPWO2006057218A1 (ja) * 2004-11-24 2008-06-05 株式会社カネカ 硬化性組成物およびその硬化性組成物により封止、被覆された半導体装置
JPWO2006067950A1 (ja) * 2004-12-22 2008-06-12 Jsr株式会社 環状オレフィン系付加共重合体の製造方法、環状オレフィン系付加共重合体およびその用途
JP2006186175A (ja) * 2004-12-28 2006-07-13 Nippon Zeon Co Ltd 電子部品用樹脂膜形成材料及びそれを用いた積層体
JP5242168B2 (ja) * 2005-01-04 2013-07-24 ダウ・コーニング・コーポレイション 有機硅素官能性硼素アミン触媒錯体およびこれから調製された硬化性組成物
JP2007065575A (ja) * 2005-09-02 2007-03-15 Jsr Corp 光学フィルム、偏光板および液晶表示装置
EP1937779A1 (en) * 2005-10-12 2008-07-02 Ciba Holding Inc. Encapsulated luminescent pigments
JP5213303B2 (ja) * 2006-01-17 2013-06-19 スリーエム イノベイティブ プロパティズ カンパニー 光硬化性吸湿性組成物及び有機el素子
JP2007197517A (ja) * 2006-01-24 2007-08-09 Three M Innovative Properties Co 接着性封止組成物、封止フィルム及び有機el素子
EP2004746B1 (en) * 2006-03-29 2018-08-01 Henkel AG & Co. KGaA Radiation-curable rubber adhesive/sealant
CN101454388B (zh) * 2006-05-23 2012-04-18 西巴控股有限公司 作为表面改性剂的n-取代的全氟烷基化的吡咯烷
JP5365891B2 (ja) * 2006-10-13 2013-12-11 日本ゼオン株式会社 発光素子用樹脂組成物、発光素子用積層体、発光素子
WO2009022736A1 (ja) * 2007-08-16 2009-02-19 Fujifilm Corporation ヘテロ環化合物、紫外線吸収剤及びこれを含む組成物
US8846169B2 (en) * 2007-12-28 2014-09-30 3M Innovative Properties Company Flexible encapsulating film systems
US8486501B2 (en) * 2008-03-14 2013-07-16 Otsuka Pharmaceutical Factory, Inc. Plastic ampule and colored plastic container

Similar Documents

Publication Publication Date Title
JP2011526052A5 (OSRAM)
JP2011526629A5 (OSRAM)
WO2009148716A3 (en) Adhesive encapsulating composition and electronic devices made therewith
WO2009148722A3 (en) Adhesive encapsulating composition and electronic devices made therewith
EP2369648A3 (en) Light-emitting device
JP2012033510A5 (ja) 発光装置
JP2010182668A5 (ja) 発光装置
JP2013138020A5 (ja) 発光装置
JP2014533757A5 (OSRAM)
JP2012504307A5 (OSRAM)
JP2007191511A5 (OSRAM)
JP2015507680A5 (OSRAM)
JP2013511594A5 (OSRAM)
JP2012209251A5 (ja) 発光素子および発光装置
JP2012227137A5 (ja) 発光装置
JP2012253013A5 (ja) 発光素子
JP2011522088A5 (OSRAM)
EP2833407A3 (en) White organic light emitting diode device
RU2018120504A (ru) Термически обратимая поперечная сшивка полимеров для чувствительных к давлению клеев
EP2320138A3 (en) Lighting device
TW201144299A (en) Heterocyclic compound, light-emitting element, light-emitting device, electronic device, and lighting device
TW201614889A (en) Porous films for use in light-emitting devices
MX2014009171A (es) Adhesivo sensible a la presion.
TW200940683A (en) Novel organic electroluminescent compounds and organic electroluminescent device using the same
JP2012231661A5 (ja) 発光装置