JP2011525444A5 - - Google Patents

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Publication number
JP2011525444A5
JP2011525444A5 JP2011516458A JP2011516458A JP2011525444A5 JP 2011525444 A5 JP2011525444 A5 JP 2011525444A5 JP 2011516458 A JP2011516458 A JP 2011516458A JP 2011516458 A JP2011516458 A JP 2011516458A JP 2011525444 A5 JP2011525444 A5 JP 2011525444A5
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JP
Japan
Prior art keywords
adhesive composition
melt adhesive
substrate
hot melt
parts
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JP2011516458A
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English (en)
Japanese (ja)
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JP2011525444A (ja
JP5620373B2 (ja
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Priority claimed from PCT/US2009/047721 external-priority patent/WO2010008749A1/en
Publication of JP2011525444A publication Critical patent/JP2011525444A/ja
Publication of JP2011525444A5 publication Critical patent/JP2011525444A5/ja
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Publication of JP5620373B2 publication Critical patent/JP5620373B2/ja
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JP2011516458A 2008-06-24 2009-06-18 ホットメルト接着剤組成物並びにそれらの製造及び使用のための方法 Active JP5620373B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US7503008P 2008-06-24 2008-06-24
US61/075,030 2008-06-24
PCT/US2009/047721 WO2010008749A1 (en) 2008-06-24 2009-06-18 Hot melt adhesive compositions and methods for their preparation and use

Publications (3)

Publication Number Publication Date
JP2011525444A JP2011525444A (ja) 2011-09-22
JP2011525444A5 true JP2011525444A5 (cg-RX-API-DMAC7.html) 2014-02-06
JP5620373B2 JP5620373B2 (ja) 2014-11-05

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JP2011516458A Active JP5620373B2 (ja) 2008-06-24 2009-06-18 ホットメルト接着剤組成物並びにそれらの製造及び使用のための方法

Country Status (9)

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US (1) US8580073B2 (cg-RX-API-DMAC7.html)
EP (1) EP2291482A1 (cg-RX-API-DMAC7.html)
JP (1) JP5620373B2 (cg-RX-API-DMAC7.html)
KR (1) KR101624522B1 (cg-RX-API-DMAC7.html)
CN (1) CN102076807B (cg-RX-API-DMAC7.html)
AU (1) AU2009271424B2 (cg-RX-API-DMAC7.html)
CA (1) CA2727081C (cg-RX-API-DMAC7.html)
MX (1) MX2010013887A (cg-RX-API-DMAC7.html)
WO (1) WO2010008749A1 (cg-RX-API-DMAC7.html)

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