JP2011522065A - エポキシ系組成物、接着フィルム、ダイシングダイボンディングフィルム及び半導体装置 - Google Patents
エポキシ系組成物、接着フィルム、ダイシングダイボンディングフィルム及び半導体装置 Download PDFInfo
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- JP2011522065A JP2011522065A JP2011506202A JP2011506202A JP2011522065A JP 2011522065 A JP2011522065 A JP 2011522065A JP 2011506202 A JP2011506202 A JP 2011506202A JP 2011506202 A JP2011506202 A JP 2011506202A JP 2011522065 A JP2011522065 A JP 2011522065A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
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- C—CHEMISTRY; METALLURGY
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Abstract
本発明は、下記一般式1の条件を満足するエポキシ系組成物を提供する。
[一般式1]
X=5%乃至20%
上記一般式1において、Xは、上記エポキシ系組成物を110℃の温度で3分間乾燥した後に測定したゲル(gel)含量を示す。
Description
[一般式1]
X=5%乃至20%
上記一般式1において、Xは、上記エポキシ系組成物を110℃の温度で3分間乾燥した後に測定したゲル(gel)含量を示す。
[一般式1]
X=5%乃至20%
上記一般式1において、Xは、上記エポキシ系組成物を110℃の温度で3分間乾燥した後に測定したゲル含量を示す。
本発明は、エポキシ系組成物に含まれる各成分をブレンディングして組成物を製造し、所定条件で乾燥した後に測定されたゲル含量を制御する。本発明の一態様において、上記ゲル含量は、組成物の基材などにコーティングした直後のゲル含量であることができる。これによって、本発明のエポキシ系組成物は、含まれる熱可塑性樹脂のガラス転移温度を低く維持しながらも、優れた弾性特性を維持することができる。
例えば、本発明の接着フィルムは、本発明のエポキシ系組成物を溶剤に溶解または分散して樹脂ワニスを製造する第1段階と、上記樹脂ワニスを基材フィルムに塗布する第2段階と、上記樹脂ワニスが塗布された基材フィルムを加熱して溶剤を除去する第3段階により製造されることができる。
撹拌器、窒素置換器及び温度計を具備した4口−3L−反応器にブチルアクリレート(BA)200g、エチルアクリレート(EA)200g、アクリロニトリル140g、グリシジルメタクリレート16g、アクリル酸8g及び脱イオン化された蒸留水1500gを投与した。次に、上記反応器に懸濁化剤として水に4%に希釈されたポリビニルアルコール(商品名:NH−17、Nippon gohsei製)4g及び分子量調節剤としてドデシルメルカプト(dodecyl mercaptan)0.3gを投与して混合物を製造した。製造された混合物に約1時間窒素置換を行い、55℃に昇温させて設定温度に到達した時、開始剤としてエチルアセテートに2%に希釈したジエチルヘキシルぺルオキシジカーボネート(商品名:Trigonox EHP、Akzo Nobel製)4gを入れて重合反応を開始した。反応開始後、4時間が経過した時点で反応を終決させ、脱イオン化された蒸留水で数回洗浄した後、遠心分離器と真空オーブンを使用して乾燥させて、90%の収率で重合体ビーズを収得した。ゲル透過クロマトグラフィーで測定した上記重合体の重量平均分子量は75万であり、分子量分布は3.0であった。追加にDSC(Differential Scanning Calorimeter)で測定した重合体のガラス転移温度は、5℃であった。収得した重合体ビーズは、メチルエチルケトン(MEK)に3時間充分に溶解させて使用した。
ブチルアクリレート200g、エチルアクリレート200g、アクリロニトリル140g、グリシジルメタクリレート16g及び脱イオン化された蒸留水1500gを使用したことを除いて、上記製造例1と同一の方法で重合体ビーズを収得した。製造された重合体の重量平均分子量は80万、分子量分布は3.2、ガラス転移温度は5℃であった。製造された重合体ビーズをメチルエチルケトン(MEK)に10時間溶解させて、ビーズ形態が溶剤内でなくなり、膨潤された状態が維持されるようにして熱可塑性樹脂を製造した。
製造された重合体ビーズを溶剤に3日間充分に溶解させて使用したことを除いて、上記製造例2と同一の方法で熱可塑性樹脂を製造した。
ブチルアクリレート150g、エチルアクリレート250g、アクリロニトリル140g、グリシジルメタクリレート16g、アクリル酸8g及び脱イオン化された蒸留水1500gを使用したことを除いて、製造例2と同一の方法で重合体ビーズを製造した。製造された重合体の重量平均分子量は77万、分子量分布は3.0、ガラス転移温度は25℃であった。収得した重合体ビーズは、メチルエチルケトン(MEK)に3時間充分に溶解させて使用した。
製造例1で製造されたグリシジル基及びカルボキシル基含有アクリル系共重合体(Tg=5℃、Mw=75万)100重量部に対して、軟化点が80℃の芳香族系エポキシ樹脂(ノボラック型エポキシ樹脂)66重量部、軟化点が90℃のフェノール樹脂(フェノールノボラック樹脂)34重量部、硬化促進剤として2−フェニル−4−メチルイミダゾール(2P4MZ)0.3重量部及び充填剤として溶融シリカ(平均粒径75nm)15重量部を混合した組成物をメチルエチルケトン(MEK)に撹拌混合して樹脂ワニスを製造した。
製造された樹脂ワニスを厚さ38μmの基材フィルム(離型処理されたポリエステルフィルム;RS−21G、SKC製)に塗布し、110℃で3分間乾燥し、塗膜厚さが20μmの接着フィルムを製作した。次に製造された接着フィルムにダイシングテープ(Lintec Adwill D−175)をラミネーションし、ダイシングダイボンディングフィルムを製作した。
熱可塑性樹脂として製造例2で製造されたエポキシ基含有アクリル系共重合体(Tg=5℃、Mw=80万)を使用したことを除いて、実施例1と同一の方法でダイシングダイボンディングフィルムを製造した。
熱可塑性樹脂として製造例3で製造されたアクリル系共重合体(Tg=5℃、Mw=80万)を使用したことを除いて、実施例1と同一の方法でダイシングダイボンディングフィルムを製造した。
熱可塑性樹脂として製造例4で製造されたアクリル系共重合体(Tg=25℃、Mw=77万)を使用したことを除いて、実施例1と同一の方法で樹脂ワニスを製造し、製造された樹脂ワニスを厚さ38μmの基材フィルム(離型処理されたポリエステルフィルム;RS−21G、SKC製)に塗布した後、110℃で10分間乾燥し、接着フィルムを製作したことを除いて、実施例1と同一の方法でダイシングダイボンディングフィルムを製作した。
1.ゲル含量の測定
かご形状の300メッシュSUS(W1)に実施例及び比較例に製造された接着剤を一定量(重量:W2)入れ、THFに浸漬させた後、25℃で20時間維持した。この時、SUSは、THFにすべて浸されず、接着剤だけが浸される程度に制御した。その後、SUSメッシュを取り出し、THFがすべて揮発される程度に充分に乾燥させた後、SUS及び未溶解状態の膨潤された接着剤重量(SUSメッシュ重量+未溶解状態の膨潤された接着剤重量=W3)を測定し、下記一般式2によってゲル含量を測定した。
接着フィルムの弾性特性を測定するために、Texture Analyzer(Stable Micro System社(英国))を利用して接着フィルムの常温引張特性を評価した。具体的に接着フィルムを幅10mm及び長さ50mmのサイズに切断してサンプルを製作し、サンプル中央部を25mm残した状態で両端をテーピング(Taping)した。次に、テーピングされた両端を装置に固定し、0.3mm/secの速度に引張しながら、引張曲線を作成した。上記引張曲線から弾性領域の初期勾配及び弾性領域と塑性領域の転換点である降伏強度を求めた。この時、求められた降伏強度の値が大きければ、弾性特性が高く、降伏強度の値が低ければ、弾性特性も低いものと判断することができる。
100μmのウエハ及びウエハリングマウンタを利用して50℃でダイシングダイボンディングフィルムをラミネーションした後、ダイシング装置を利用してrpm40K、速度20mm/sec、チップサイズ2mmx2mmの条件でダイシングした後、ダイ上のバーが発生した個数を確認し、バー発生率(%)を測定した。
表面の温度が130℃のホットプレート上に実施例及び比較例のダイシングダイボンディングフィルムを載置し、上記で使用されたTexture Analyzer及び直径1インチのボールタイププローブを使用してタック特性を測定した。この時、プローブに印加される力は800gfであり、接触時間は0.1秒であり、プローブを取り外す速度は0.1mm/secであった。
5mm×5mmの約600μm乃至700μmのウエハのミラー面に実施例及び比較例の接着フィルムを60℃でラミネーションし、ウエハを個片化したダイサイズ程度の接着フィルムを準備した。次に、SUSプレート基材上に130℃で上記ダイボンディングフィルムがあるウエハダイを付着し、150℃の温度で30分間硬化を進行させた。次に上記Texture Analyzerを使用して、180℃でウエハダイを0.1mm/sec速度で押しながら力を測定し、高温せん断力を評価した。
2 配線基板
10 基材フィルム
20 接着層
30 ダイシングテープ
40 接着部
50 基材フィルム
60 粘着層
Claims (20)
- 下記一般式1の条件を満足するエポキシ系組成物:
[一般式1]
X=5%乃至20%
上記一般式1において、Xは、上記エポキシ系組成物を110℃の温度で3分間乾燥した後に測定したゲル含量を示す。 - ゲル含量が5%以上20%未満である、請求項1に記載のエポキシ系組成物。
- (a)熱可塑性樹脂、(b)エポキシ樹脂及び(c)硬化剤を含む、請求項1に記載のエポキシ系組成物。
- (a)熱可塑性樹脂は、内部架橋構造または内部絡み合い構造を有する、請求項3に記載のエポキシ系組成物。
- 熱可塑性樹脂は、硬化前にガラス転移温度が−30℃乃至50℃である、請求項3に記載のエポキシ系組成物。
- (a)熱可塑性樹脂は重量平均分子量が10万乃至250万である、請求項3に記載のエポキシ系組成物。
- (a)熱可塑性樹脂は、グリシジル基含有単量体、ヒドロキシ基含有単量体、カルボキシル基含有単量体及びニトリル基含有単量体よりなる群から選択された1つ以上を含む単量体の重合体である、請求項3に記載のエポキシ系組成物。
- (b)エポキシ樹脂は、硬化前に自体軟化点が50℃乃至100℃である、請求項3に記載のエポキシ系組成物。
- (b)エポキシ樹脂は、エポキシ当量が180乃至1,000である、請求項3に記載のエポキシ系組成物。
- (b)エポキシ樹脂は、クレゾールノボラックエポキシ樹脂、ビスフェノールA型ノボラックエポキシ樹脂、フェノールノボラックエポキシ樹脂、4官能性エポキシ樹脂、ビフェニル型エポキシ樹脂、トリフェノールメタン型エポキシ樹脂、アルキル変性トリフェノールメタン型エポキシ樹脂、ナフタレン型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂及びジシクロペンタジエン変性フェノール型エポキシ樹脂よりなる群から選択された1つ以上である、請求項3に記載のエポキシ系組成物。
- (b)エポキシ樹脂は、(a)熱可塑性樹脂100重量部に対して10重量部乃至200重量部の量で含まれる、請求項3に記載のエポキシ系組成物。
- (c)硬化剤は、水酸基当量が100乃至1,000の多官能性フェノール樹脂である、請求項3に記載のエポキシ系組成物。
- (c)硬化剤は、軟化点が50℃乃至150℃である、請求項12に記載のエポキシ系組成物。
- 多官能性フェノール樹脂がビスフェノールA樹脂、フェノールノボラック樹脂、クレゾールノボラック樹脂、ビスフェノールAノボラック樹脂、フェノールアラルキル樹脂、多官能ノボラック樹脂、ジシクロペンタジエンフェノールノボラック樹脂、アミノトリアジンフェノールノボラック樹脂、ポリブタジエンフェノールノボラック樹脂及びビフェニルタイプ樹脂よりなる群から選択された1つ以上である、請求項12に記載のエポキシ系組成物。
- (c)硬化剤は、(b)エポキシ樹脂のエポキシ当量に対して0.4当量比乃至2当量比の量で含まれる、請求項1に記載のエポキシ系組成物。
- 基材フィルム;及び
上記基材フィルム上に形成され、請求項1に記載のエポキシ系組成物の硬化物を含有する接着層を含む接着フィルム。 - 接着層は、厚さが5μm乃至200μmである、請求項16に記載の接着フィルム。
- ダイシングテープ;及び
上記ダイシングテープの一面に形成され、請求項1に記載のエポキシ系組成物の硬化物を含有する接着部を含むダイシングダイボンディングフィルム。 - 請求項18に記載のダイシングダイボンディングフィルムの接着部がウエハの一面に付着されていて、
ダイシングテープがウエハリングフレームに固定されている半導体ウエハ。 - 配線基板;
配線基板のチップ搭載面に付着されていて、請求項1に記載のエポキシ系組成物の硬化物を含有する接着層;及び
上記接着層上に搭載された半導体チップを含む半導体装置。
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WO2022186229A1 (ja) * | 2021-03-05 | 2022-09-09 | 昭和電工マテリアルズ株式会社 | 接着フィルム及びその評価方法、並びに、半導体装置の製造方法及びダイシング・ダイボンディング一体型フィルム |
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Publication number | Publication date |
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EP2270112A4 (en) | 2013-07-24 |
JP5757625B2 (ja) | 2015-07-29 |
EP2270112B1 (en) | 2014-08-13 |
WO2009131405A3 (ko) | 2010-01-21 |
CN102015953A (zh) | 2011-04-13 |
TW201009009A (en) | 2010-03-01 |
EP2270112A2 (en) | 2011-01-05 |
CN102015953B (zh) | 2015-01-14 |
US20110111218A1 (en) | 2011-05-12 |
TWI401290B (zh) | 2013-07-11 |
US20130281571A1 (en) | 2013-10-24 |
WO2009131405A2 (ko) | 2009-10-29 |
US9793103B2 (en) | 2017-10-17 |
JP5818931B2 (ja) | 2015-11-18 |
JP2014169442A (ja) | 2014-09-18 |
US9659763B2 (en) | 2017-05-23 |
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