JP2011520248A5 - - Google Patents

Download PDF

Info

Publication number
JP2011520248A5
JP2011520248A5 JP2011504098A JP2011504098A JP2011520248A5 JP 2011520248 A5 JP2011520248 A5 JP 2011520248A5 JP 2011504098 A JP2011504098 A JP 2011504098A JP 2011504098 A JP2011504098 A JP 2011504098A JP 2011520248 A5 JP2011520248 A5 JP 2011520248A5
Authority
JP
Japan
Prior art keywords
flexible substrate
adhesive layer
rigid support
assembly
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011504098A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011520248A (ja
JP5555226B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2009/039577 external-priority patent/WO2009126544A1/en
Publication of JP2011520248A publication Critical patent/JP2011520248A/ja
Publication of JP2011520248A5 publication Critical patent/JP2011520248A5/ja
Application granted granted Critical
Publication of JP5555226B2 publication Critical patent/JP5555226B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011504098A 2008-04-08 2009-04-06 半導体加工中のフレキシブル基板のｗａｒｐおよびｂｏｗを減少させるアセンブリおよび方法 Expired - Fee Related JP5555226B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US4322308P 2008-04-08 2008-04-08
US61/043,223 2008-04-08
PCT/US2009/039577 WO2009126544A1 (en) 2008-04-08 2009-04-06 Assemblies and methods for reducing warp and bow of a flexible substrate during semiconductor processing

Publications (3)

Publication Number Publication Date
JP2011520248A JP2011520248A (ja) 2011-07-14
JP2011520248A5 true JP2011520248A5 (https=) 2012-05-24
JP5555226B2 JP5555226B2 (ja) 2014-07-23

Family

ID=41011823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011504098A Expired - Fee Related JP5555226B2 (ja) 2008-04-08 2009-04-06 半導体加工中のフレキシブル基板のｗａｒｐおよびｂｏｗを減少させるアセンブリおよび方法

Country Status (8)

Country Link
US (1) US8685201B2 (https=)
EP (1) EP2274162A1 (https=)
JP (1) JP5555226B2 (https=)
KR (1) KR101517263B1 (https=)
CN (1) CN101980861B (https=)
SG (1) SG188921A1 (https=)
TW (1) TWI488750B (https=)
WO (1) WO2009126544A1 (https=)

Families Citing this family (90)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10702293B2 (en) 2008-06-13 2020-07-07 Shockwave Medical, Inc. Two-stage method for treating calcified lesions within the wall of a blood vessel
US8956371B2 (en) 2008-06-13 2015-02-17 Shockwave Medical, Inc. Shockwave balloon catheter system
US9752022B2 (en) 2008-07-10 2017-09-05 Avery Dennison Corporation Composition, film and related methods
US9044618B2 (en) 2008-11-05 2015-06-02 Shockwave Medical, Inc. Shockwave valvuloplasty catheter system
US9721825B2 (en) 2008-12-02 2017-08-01 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Method of providing a flexible semiconductor device and flexible semiconductor device thereof
WO2015057719A1 (en) * 2013-10-14 2015-04-23 Arizona Board Of Regents For And On Behalf Of Arizona State University Method of providing a flexible semiconductor device and flexible semiconductor device thereof
US9991311B2 (en) 2008-12-02 2018-06-05 Arizona Board Of Regents On Behalf Of Arizona State University Dual active layer semiconductor device and method of manufacturing the same
EP2366270A4 (en) * 2008-12-02 2013-04-10 Univ Arizona METHOD FOR PRODUCING A FLEXIBLE SUBSTRATE DEPARTMENT AND FLEXIBLE SUBSTRATE APPEARANCE THEREFOR
US9601530B2 (en) 2008-12-02 2017-03-21 Arizona Board Of Regents, A Body Corporated Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Dual active layer semiconductor device and method of manufacturing the same
TWI505410B (zh) * 2008-12-30 2015-10-21 財團法人工業技術研究院 應用於軟性電子元件之基板結構及其製造方法
KR101362025B1 (ko) 2009-05-29 2014-02-13 아리조나 보드 오브 리젠츠 퍼 앤 온 비하프 오브 아리조나 스테이트 유니버시티 고온에서 가요성 반도체 장치를 제공하는 방법 및 그 가요성 반도체 장치
RU2571140C2 (ru) 2010-03-04 2015-12-20 Авери Деннисон Корпорейшн Не содержащая пвх пленка и не содержащая пвх многослойная пленка
US8233280B2 (en) 2010-03-15 2012-07-31 Lincoln Global, Inc. Electronic module with center mounting fasteners
WO2012021196A2 (en) 2010-05-21 2012-02-16 Arizona Board Of Regents, For And On Behalf Of Arizona State University Method for manufacturing electronic devices and electronic devices thereof
WO2012021197A2 (en) 2010-05-21 2012-02-16 Arizona Board Of Regents, For And On Behalf Of Arizona State University Method of manufacturing electronic devices on both sides of a carrier substrate and electronic devices thereof
CN102637575B (zh) * 2011-02-09 2015-07-01 群康科技(深圳)有限公司 元件基板的制造方法
US8574247B2 (en) 2011-11-08 2013-11-05 Shockwave Medical, Inc. Shock wave valvuloplasty device with moveable shock wave generator
US10543662B2 (en) 2012-02-08 2020-01-28 Corning Incorporated Device modified substrate article and methods for making
US9642673B2 (en) 2012-06-27 2017-05-09 Shockwave Medical, Inc. Shock wave balloon catheter with multiple shock wave sources
US8888788B2 (en) 2012-08-06 2014-11-18 Shockwave Medical, Inc. Low profile electrodes for an angioplasty shock wave catheter
EP2882357A1 (en) 2012-08-08 2015-06-17 Shockwave Medical, Inc. Shockwave valvuloplasty with multiple balloons
US9522012B2 (en) 2012-09-13 2016-12-20 Shockwave Medical, Inc. Shockwave catheter system with energy control
US9333000B2 (en) 2012-09-13 2016-05-10 Shockwave Medical, Inc. Shockwave catheter system with energy control
CN110435253A (zh) 2012-10-05 2019-11-12 康宁股份有限公司 玻璃/金属层合结构和制造层合结构的方法
US10014177B2 (en) 2012-12-13 2018-07-03 Corning Incorporated Methods for processing electronic devices
US9340443B2 (en) 2012-12-13 2016-05-17 Corning Incorporated Bulk annealing of glass sheets
TWI617437B (zh) 2012-12-13 2018-03-11 康寧公司 促進控制薄片與載體間接合之處理
US10086584B2 (en) 2012-12-13 2018-10-02 Corning Incorporated Glass articles and methods for controlled bonding of glass sheets with carriers
EP2941347B1 (en) * 2013-01-07 2021-06-02 Corning Incorporated Strengthened laminated glass structures
KR102130547B1 (ko) * 2013-03-27 2020-07-07 삼성디스플레이 주식회사 가요성 기판 및 이를 포함하는 가요성 표시 장치
US10510576B2 (en) 2013-10-14 2019-12-17 Corning Incorporated Carrier-bonding methods and articles for semiconductor and interposer processing
BR112016014704A8 (pt) 2013-12-30 2020-05-26 Avery Dennison Corp película protetora, laminado de película, gráfico de publicidade ou informativo, método de produção de uma película protetora, uso de uma película protetora ransparente e rolo ou folha de gráfico de publicidade
US10381224B2 (en) 2014-01-23 2019-08-13 Arizona Board Of Regents On Behalf Of Arizona State University Method of providing an electronic device and electronic device thereof
WO2017034644A2 (en) 2015-06-09 2017-03-02 ARIZONA BOARD OF REGENTS a body corporate for THE STATE OF ARIZONA for and on behalf of ARIZONA STATE UNIVERSITY Method of providing an electronic device and electronic device thereof
WO2015156891A2 (en) 2014-01-23 2015-10-15 Arizona Board Of Regents, Acting For And On Behalf Of Arizona State University Method of providing a flexible semiconductor device and flexible semiconductor device thereof
WO2015112958A1 (en) 2014-01-27 2015-07-30 Corning Incorporated Articles and methods for controlled bonding of thin sheets with carriers
CN106457758B (zh) 2014-04-09 2018-11-16 康宁股份有限公司 装置改性的基材制品及其制备方法
KR102466741B1 (ko) 2014-05-13 2022-11-15 아리조나 보드 오브 리젠츠 온 비하프 오브 아리조나 스테이트 유니버시티 전자 디바이스를 제공하는 방법
US10249741B2 (en) 2014-05-13 2019-04-02 Joseph T. Smith System and method for ion-selective, field effect transistor on flexible substrate
CN106573448A (zh) * 2014-08-20 2017-04-19 康宁股份有限公司 大且薄的玻璃/金属层压件
USD761820S1 (en) 2014-08-28 2016-07-19 Samsung Electronics Co., Ltd. Display screen or portion thereof with graphical user interface
US10446582B2 (en) 2014-12-22 2019-10-15 Arizona Board Of Regents On Behalf Of Arizona State University Method of providing an imaging system and imaging system thereof
US9741742B2 (en) 2014-12-22 2017-08-22 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Deformable electronic device and methods of providing and using deformable electronic device
CN104559852B (zh) * 2014-12-31 2018-02-27 深圳市化讯半导体材料有限公司 一种用于薄晶圆加工的临时键合胶及其制备方法
CN107431059B (zh) 2015-01-02 2020-03-17 亚利桑那州立大学董事会 用于可变形电子装置的阿基米德螺线设计
US10890669B2 (en) 2015-01-14 2021-01-12 General Electric Company Flexible X-ray detector and methods for fabricating the same
CN106133025B (zh) * 2015-03-05 2019-03-12 株式会社Lg化学 用于生产光电器件的柔性板的聚酰亚胺膜的组合物
CN107635769B (zh) 2015-05-19 2020-09-15 康宁股份有限公司 使片材与载体粘结的制品和方法
WO2016196458A2 (en) * 2015-06-03 2016-12-08 3M Innovative Properties Company Assembly layer for flexible display
JP7106276B2 (ja) 2015-06-26 2022-07-26 コーニング インコーポレイテッド シート及び担体を有する物品及び方法
CN105093615B (zh) * 2015-07-29 2018-01-26 合肥鑫晟光电科技有限公司 曲面显示面板及其制备方法、显示装置
WO2017087195A1 (en) 2015-11-18 2017-05-26 Shockwave Medical, Inc. Shock wave electrodes
US10226265B2 (en) 2016-04-25 2019-03-12 Shockwave Medical, Inc. Shock wave device with polarity switching
TW202216444A (zh) 2016-08-30 2022-05-01 美商康寧公司 用於片材接合的矽氧烷電漿聚合物
TWI810161B (zh) 2016-08-31 2023-08-01 美商康寧公司 具以可控制式黏結的薄片之製品及製作其之方法
EP3777723B1 (en) 2016-10-06 2024-01-17 Shockwave Medical, Inc. Aortic leaflet repair using shock wave applicators
US10357264B2 (en) 2016-12-06 2019-07-23 Shockwave Medical, Inc. Shock wave balloon catheter with insertable electrodes
US10068787B2 (en) * 2016-12-30 2018-09-04 Sunpower Corporation Bowing semiconductor wafers
US11342563B2 (en) 2017-05-16 2022-05-24 Arizona Board Of Regents On Behalf Of Arizona State University Three-dimensional soft electrode for lithium metal batteries
US10966737B2 (en) 2017-06-19 2021-04-06 Shockwave Medical, Inc. Device and method for generating forward directed shock waves
JP7260523B2 (ja) 2017-08-18 2023-04-18 コーニング インコーポレイテッド ポリカチオン性高分子を使用した一時的結合
US10709462B2 (en) 2017-11-17 2020-07-14 Shockwave Medical, Inc. Low profile electrodes for a shock wave catheter
US11331692B2 (en) 2017-12-15 2022-05-17 Corning Incorporated Methods for treating a substrate and method for making articles comprising bonded sheets
CN108282960A (zh) * 2018-01-08 2018-07-13 苏州群策科技有限公司 一种超薄板的制造方法
WO2019152643A1 (en) 2018-02-02 2019-08-08 Arizona Board Of Regents On Behalf Of Arizona State University Origami-based collapsible and watertight cases
WO2019245746A1 (en) 2018-06-21 2019-12-26 Shockwave Medical, Inc. System for treating occlusions in body lumens
JP7515576B2 (ja) 2019-09-24 2024-07-12 ショックウェーブ メディカル， インコーポレイテッド 身体管腔内の血栓を治療するためのシステム
EP4034005B1 (en) 2019-09-24 2024-12-18 Shockwave Medical, Inc. Lesion crossing shock wave catheter
ES3018918T3 (en) 2019-09-24 2025-05-19 Shockwave Medical Inc Low profile electrodes for a shock wave catheter
US11076491B2 (en) * 2019-10-16 2021-07-27 Compass Technology Company Limited Integrated electro-optical flexible circuit board
CN112203402B (zh) * 2020-10-27 2022-08-26 中国科学院深圳先进技术研究院 印制电路板及其制备方法
US11992232B2 (en) 2020-10-27 2024-05-28 Shockwave Medical, Inc. System for treating thrombus in body lumens
US12232755B2 (en) 2020-12-11 2025-02-25 Shockwave Medical, Inc. Lesion crossing shock wave catheter
US12469725B2 (en) 2021-06-27 2025-11-11 Delta Design, Inc. Method for determining corrective film pattern to reduce semiconductor wafer bow
US12089861B2 (en) 2021-08-05 2024-09-17 Nextern Innovation, Llc Intravascular lithotripsy system and device
US12023098B2 (en) 2021-10-05 2024-07-02 Shockwave Medical, Inc. Lesion crossing shock wave catheter
DE112022005004T5 (de) 2021-10-19 2024-08-01 Shockwave Medical, Inc. Intravaskulärer lithotripsie-katheter mit interferierenden stosswellen
WO2024029759A1 (ko) * 2022-08-02 2024-02-08 삼성전자 주식회사 플렉서블 디스플레이를 포함하는 전자 장치
US12290268B2 (en) 2023-03-31 2025-05-06 Shockwave Medical, Inc. Shockwave catheters for treating rhinosinusitis
US12035932B1 (en) 2023-04-21 2024-07-16 Shockwave Medical, Inc. Intravascular lithotripsy catheter with slotted emitter bands
US12220141B2 (en) 2023-06-29 2025-02-11 Shockwave Medical, Inc. Catheter system with independently controllable bubble and arc generation
US12496078B2 (en) 2023-08-24 2025-12-16 Shockwave Medical, Inc. Lithotripsy catheters having electrodes formed in metallization layers
US12426904B2 (en) 2023-11-17 2025-09-30 Shockwave Medical, Inc. Intravascular lithotripsy catheter with oscillating impactor
US12594085B2 (en) 2023-11-30 2026-04-07 Shockwave Medical, Inc. Shock wave catheter with shock absorber
US12402899B2 (en) 2023-11-30 2025-09-02 Shockwave Medical, Inc. Systems, devices, and methods for generating shock waves in a forward direction
US12433620B2 (en) 2024-02-23 2025-10-07 Shockwave Medical, Inc. Locus emitter shock wave catheter devices with increased longevity and higher sonic output
US12471939B2 (en) 2024-03-05 2025-11-18 Shockwave Medical, Inc. Shock wave catheter with retractable enclosure
US12178458B1 (en) 2024-05-16 2024-12-31 Shockwave Medical, Inc. Guidewireless shock wave catheters
US12502188B2 (en) 2024-05-31 2025-12-23 Shockwave Medical, Inc. Systems, devices, and methods for shock wave generation utilizing catheters with multi-metal joints
US12453565B1 (en) 2024-11-18 2025-10-28 Shockwave Medical, Inc. Shock wave catheters and methods of use thereof for treating, imaging, and characterizing body lumens

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2113288A (en) 1987-09-08 1989-03-09 Dow Chemical Company, The Aqueous latex laminating adhesives which improve adherence between various substrates
TW422874B (en) 1996-10-08 2001-02-21 Hitachi Chemical Co Ltd Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film
JPH10242086A (ja) 1997-02-26 1998-09-11 Nitto Denko Corp 半導体ウエハ保持シート
KR100320983B1 (ko) * 1997-08-22 2002-06-20 포만 제프리 엘 칩조립체및직접적인개방열전도성경로의제공방법
US6108210A (en) * 1998-04-24 2000-08-22 Amerasia International Technology, Inc. Flip chip devices with flexible conductive adhesive
JP4034911B2 (ja) 1999-07-22 2008-01-16 三菱樹脂株式会社 合わせガラス用中間膜及び合わせガラス
JP3878386B2 (ja) * 2000-02-23 2007-02-07 三菱樹脂株式会社 中間膜用粘着シート及び合わせガラス積層体
US6784555B2 (en) * 2001-09-17 2004-08-31 Dow Corning Corporation Die attach adhesives for semiconductor applications utilizing a polymeric base material with inorganic insulator particles of various sizes
JP2003174125A (ja) * 2001-09-26 2003-06-20 Nitto Denko Corp 半導体装置の製造法及びこれに用いるシート状樹脂組成物
US20030068841A1 (en) * 2001-09-26 2003-04-10 Nitto Denko Corporation Process of producing semiconductor device and resin composition sheet used therefor
DE10162676B4 (de) * 2001-12-19 2005-06-02 Infineon Technologies Ag Elektronisches Bauteil mit einem Halbleiterchip und einer Umverdrahtungsplatte und Systemträger für mehrere elektronische Bauteile sowie Verfahren zur Herstellung derselben
JP2004300231A (ja) 2003-03-31 2004-10-28 Nitto Denko Corp 熱剥離性両面粘着シート、被着体の加工方法および電子部品
US20040248488A1 (en) * 2003-06-05 2004-12-09 Tebbetts Carly P. Wallcovering backing fabric
US20060154546A1 (en) * 2003-06-25 2006-07-13 Andover Coated Products, Inc. Air permeable pressure-sensitive adhesive tapes
JP2005026547A (ja) * 2003-07-04 2005-01-27 Hitachi Chem Co Ltd 半導体装置およびその製造方法、ならびに半導体装置に用いられる接着シート
JP4566527B2 (ja) * 2003-08-08 2010-10-20 日東電工株式会社 再剥離型粘着シート
CN2679972Y (zh) * 2003-12-16 2005-02-16 上海华仕德电路技术有限公司 刚挠多层板
JP2005280172A (ja) 2004-03-30 2005-10-13 Nisshin Steel Co Ltd ヘアライン調ラミネート金属板
JP4103116B2 (ja) 2004-06-09 2008-06-18 日東電工株式会社 積層シート、プラズマディスプレイパネル用背面基板の製造方法、プラズマディスプレイパネル用背面基板、及びプラズマディスプレイパネル
TWI260065B (en) * 2005-01-03 2006-08-11 Unimicron Technology Corp Substrate and method for fabricating the same
JP2007146121A (ja) * 2005-11-01 2007-06-14 Hitachi Chem Co Ltd 粘弾性樹脂組成物、これを用いた金属箔張積層板、プリプレグ、樹脂付き金属箔及び樹脂フィルム。
US20100297829A1 (en) * 2006-07-05 2010-11-25 The Arizona Board Of Regents, A Body Corporate Acting For And On Behalf Of Arizona State Unversit Method of Temporarily Attaching a Rigid Carrier to a Substrate
CN101641773B (zh) * 2007-04-10 2011-08-17 住友电木株式会社 用于半导体的粘合膜和使用该粘合膜的半导体器件

Similar Documents

Publication Publication Date Title
JP2011520248A5 (https=)
CN107768404B (zh) 柔性显示装置
JP4834758B2 (ja) フレキシブル電子デバイスに適用される基板構造およびその作製方法
JP5555226B2 (ja) 半導体加工中のフレキシブル基板のｗａｒｐおよびｂｏｗを減少させるアセンブリおよび方法
US7575983B2 (en) Method for fabricating a device with flexible substrate and method for stripping flexible-substrate
CN102496683B (zh) 可挠式有机发光装置及其制作方法
JP2004297084A5 (https=)
JP2009010356A5 (https=)
TWI610431B (zh) 柔性封裝襯底及其製造方法和使用該襯底的ｏｌｅｄ封裝方法
JP2019528480A5 (https=)
CN108597376B (zh) 预拉伸基底及其制作方法、电子器件及其制作方法
CN109817831B (zh) 显示基板及其制造方法、显示装置
CN103311455A (zh) 制造薄膜晶体管基板及使用它的有机发光显示装置的方法
CN107845740B (zh) 一种柔性基板的制备方法及柔性基板
CN106711348A (zh) 一种有机发光显示面板及其制备方法、显示装置
WO2007142865A3 (en) Thin film photovoltaic structure and fabrication
CN108470849A (zh) 一种柔性基板及其制作方法
US10355228B2 (en) Method of manufacturing flexible substrate and flexible substrate
CN110518143A (zh) Oled显示面板及其制备方法
JP2005178363A5 (https=)
US11307688B2 (en) Thermal transfer substrate, touch display panel and manufacturing methods therefor, and display device
CN108139823A (zh) 薄膜触控传感器及其制造方法
US20200185628A1 (en) Device and method for manufacturing flexible substrate
JP2005078064A (ja) フレキシブルパネルの製造方法
JP2006237542A (ja) 半導体装置の製造方法