JP2011520248A5 - - Google Patents

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Publication number
JP2011520248A5
JP2011520248A5 JP2011504098A JP2011504098A JP2011520248A5 JP 2011520248 A5 JP2011520248 A5 JP 2011520248A5 JP 2011504098 A JP2011504098 A JP 2011504098A JP 2011504098 A JP2011504098 A JP 2011504098A JP 2011520248 A5 JP2011520248 A5 JP 2011520248A5
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JP
Japan
Prior art keywords
flexible substrate
adhesive layer
rigid support
assembly
adhesive
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JP2011504098A
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English (en)
Japanese (ja)
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JP2011520248A (ja
JP5555226B2 (ja
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Priority claimed from PCT/US2009/039577 external-priority patent/WO2009126544A1/en
Publication of JP2011520248A publication Critical patent/JP2011520248A/ja
Publication of JP2011520248A5 publication Critical patent/JP2011520248A5/ja
Application granted granted Critical
Publication of JP5555226B2 publication Critical patent/JP5555226B2/ja
Expired - Fee Related legal-status Critical Current
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JP2011504098A 2008-04-08 2009-04-06 半導体加工中のフレキシブル基板のｗａｒｐおよびｂｏｗを減少させるアセンブリおよび方法 Expired - Fee Related JP5555226B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US4322308P 2008-04-08 2008-04-08
US61/043,223 2008-04-08
PCT/US2009/039577 WO2009126544A1 (en) 2008-04-08 2009-04-06 Assemblies and methods for reducing warp and bow of a flexible substrate during semiconductor processing

Publications (3)

Publication Number Publication Date
JP2011520248A JP2011520248A (ja) 2011-07-14
JP2011520248A5 true JP2011520248A5 (https=) 2012-05-24
JP5555226B2 JP5555226B2 (ja) 2014-07-23

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Family Applications (1)

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JP2011504098A Expired - Fee Related JP5555226B2 (ja) 2008-04-08 2009-04-06 半導体加工中のフレキシブル基板のｗａｒｐおよびｂｏｗを減少させるアセンブリおよび方法

Country Status (8)

Country Link
US (1) US8685201B2 (https=)
EP (1) EP2274162A1 (https=)
JP (1) JP5555226B2 (https=)
KR (1) KR101517263B1 (https=)
CN (1) CN101980861B (https=)
SG (1) SG188921A1 (https=)
TW (1) TWI488750B (https=)
WO (1) WO2009126544A1 (https=)

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