JP2011520245A5 - - Google Patents

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Publication number
JP2011520245A5
JP2011520245A5 JP2011503375A JP2011503375A JP2011520245A5 JP 2011520245 A5 JP2011520245 A5 JP 2011520245A5 JP 2011503375 A JP2011503375 A JP 2011503375A JP 2011503375 A JP2011503375 A JP 2011503375A JP 2011520245 A5 JP2011520245 A5 JP 2011520245A5
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JP
Japan
Prior art keywords
chuck
stage
array
stress
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011503375A
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English (en)
Japanese (ja)
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JP2011520245A (ja
JP5372136B2 (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/EP2009/002577 external-priority patent/WO2009124732A1/en
Publication of JP2011520245A publication Critical patent/JP2011520245A/ja
Publication of JP2011520245A5 publication Critical patent/JP2011520245A5/ja
Application granted granted Critical
Publication of JP5372136B2 publication Critical patent/JP5372136B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011503375A 2008-04-10 2009-04-07 リソグラフィ装置のための剪断層チャック Active JP5372136B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US7105908P 2008-04-10 2008-04-10
US61/071,059 2008-04-10
PCT/EP2009/002577 WO2009124732A1 (en) 2008-04-10 2009-04-07 Shear-layer chuck for lithographic apparatus

Publications (3)

Publication Number Publication Date
JP2011520245A JP2011520245A (ja) 2011-07-14
JP2011520245A5 true JP2011520245A5 (enExample) 2012-05-31
JP5372136B2 JP5372136B2 (ja) 2013-12-18

Family

ID=40752516

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011503375A Active JP5372136B2 (ja) 2008-04-10 2009-04-07 リソグラフィ装置のための剪断層チャック

Country Status (7)

Country Link
US (3) US20110013164A1 (enExample)
JP (1) JP5372136B2 (enExample)
KR (1) KR101602367B1 (enExample)
CN (1) CN101990652B (enExample)
NL (1) NL1036735A1 (enExample)
TW (1) TWI429018B (enExample)
WO (1) WO2009124732A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1036735A1 (nl) 2008-04-10 2009-10-13 Asml Holding Nv Shear-layer chuck for lithographic apparatus.
WO2012110144A1 (en) * 2011-02-18 2012-08-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method.
JP5911959B2 (ja) * 2011-09-09 2016-04-27 マッパー・リソグラフィー・アイピー・ビー.ブイ. ウェーハテーブル用支持構造体
KR20170016547A (ko) 2015-08-03 2017-02-14 삼성전자주식회사 척 테이블 및 그를 포함하는 기판 제조 장치
US11040705B2 (en) 2016-05-19 2021-06-22 Pylon Manufacturing Corp. Windshield wiper connector
US10761435B2 (en) 2017-02-10 2020-09-01 Asml Holding N.V. Reticle clamping device
JP7408683B2 (ja) * 2019-04-30 2024-01-05 エーエスエムエル ネザーランズ ビー.ブイ. 構造体に耐摩耗材料を提供するための方法、及び複合体
US11650512B2 (en) * 2021-06-25 2023-05-16 Taiwan Semiconductor Manufacturing Company, Ltd. Reticle cleaning device and method of use
WO2025242380A1 (en) * 2024-05-20 2025-11-27 Asml Netherlands B.V. Split chuck

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6335989U (enExample) * 1986-08-25 1988-03-08
US5401973A (en) 1992-12-04 1995-03-28 Atomic Energy Of Canada Limited Industrial material processing electron linear accelerator
KR100443277B1 (ko) * 2000-02-07 2004-08-04 티디케이가부시기가이샤 복합기판, 이를 사용한 박막발광소자 및 그 제조방법
JP2003007602A (ja) * 2001-06-26 2003-01-10 Nikon Corp 計測装置及び計測方法、露光装置及び露光方法
JP2002050560A (ja) 2000-08-02 2002-02-15 Nikon Corp ステージ装置、計測装置及び計測方法、露光装置及び露光方法
JP2002134599A (ja) * 2000-10-24 2002-05-10 Ngk Insulators Ltd 静電吸着装置
US6513796B2 (en) * 2001-02-23 2003-02-04 International Business Machines Corporation Wafer chuck having a removable insert
JP2002299228A (ja) 2001-04-03 2002-10-11 Nikon Corp レチクル、それを用いた露光装置及び露光方法
JP4103385B2 (ja) * 2001-12-27 2008-06-18 住友金属工業株式会社 真空チャック
JP2003332411A (ja) * 2002-05-17 2003-11-21 Nikon Corp 基板保持装置及び露光装置
TWI254841B (en) * 2002-12-23 2006-05-11 Asml Netherlands Bv Lithographic apparatus
EP1434100A2 (en) * 2002-12-23 2004-06-30 ASML Netherlands B.V. Lithographic apparatus
EP1576637A2 (en) 2002-12-27 2005-09-21 Matsushita Electric Works, Ltd. Field emission-type electron source and method of producing the same
JP4315420B2 (ja) * 2003-04-18 2009-08-19 キヤノン株式会社 露光装置及び露光方法
JP2005039155A (ja) * 2003-07-18 2005-02-10 Matsushita Electric Ind Co Ltd 半導体装置の製造方法及びそれに用いる半導体基板の製造方法
US7119884B2 (en) * 2003-12-24 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7786607B2 (en) 2004-02-19 2010-08-31 Asml Holding N.V. Overlay correction by reducing wafer slipping after alignment
US7824498B2 (en) * 2004-02-24 2010-11-02 Applied Materials, Inc. Coating for reducing contamination of substrates during processing
JP4298547B2 (ja) * 2004-03-01 2009-07-22 キヤノン株式会社 位置決め装置およびそれを用いた露光装置
KR101585310B1 (ko) * 2004-12-15 2016-01-14 가부시키가이샤 니콘 기판 유지 장치, 노광 장치 및 디바이스 제조방법
JP4708876B2 (ja) * 2005-06-21 2011-06-22 キヤノン株式会社 液浸露光装置
US7372549B2 (en) 2005-06-24 2008-05-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7564536B2 (en) * 2005-11-08 2009-07-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7733463B2 (en) 2006-05-05 2010-06-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20070268476A1 (en) 2006-05-19 2007-11-22 Nikon Corporation Kinematic chucks for reticles and other planar bodies
WO2007136123A1 (en) * 2006-05-19 2007-11-29 Nikon Corporation Chucks for reticles and other planar bodies
US7722256B2 (en) * 2006-11-17 2010-05-25 Corning Incorporated Flat surface air bearing assembly
NL1036735A1 (nl) 2008-04-10 2009-10-13 Asml Holding Nv Shear-layer chuck for lithographic apparatus.

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