JP2011044715A5 - - Google Patents

Download PDF

Info

Publication number
JP2011044715A5
JP2011044715A5 JP2010185136A JP2010185136A JP2011044715A5 JP 2011044715 A5 JP2011044715 A5 JP 2011044715A5 JP 2010185136 A JP2010185136 A JP 2010185136A JP 2010185136 A JP2010185136 A JP 2010185136A JP 2011044715 A5 JP2011044715 A5 JP 2011044715A5
Authority
JP
Japan
Prior art keywords
embossing
substrate
structural material
applying
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010185136A
Other languages
English (en)
Japanese (ja)
Other versions
JP5693090B2 (ja
JP2011044715A (ja
Filing date
Publication date
Priority claimed from EP20090010779 external-priority patent/EP2287666B1/de
Application filed filed Critical
Publication of JP2011044715A publication Critical patent/JP2011044715A/ja
Publication of JP2011044715A5 publication Critical patent/JP2011044715A5/ja
Application granted granted Critical
Publication of JP5693090B2 publication Critical patent/JP5693090B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2010185136A 2009-08-22 2010-08-20 基板のエンボス加工用装置 Active JP5693090B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP09010779.8 2009-08-22
EP20090010779 EP2287666B1 (de) 2009-08-22 2009-08-22 Vorrichtung zum Prägen von Substraten

Publications (3)

Publication Number Publication Date
JP2011044715A JP2011044715A (ja) 2011-03-03
JP2011044715A5 true JP2011044715A5 (enExample) 2013-06-13
JP5693090B2 JP5693090B2 (ja) 2015-04-01

Family

ID=41429335

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010185136A Active JP5693090B2 (ja) 2009-08-22 2010-08-20 基板のエンボス加工用装置

Country Status (3)

Country Link
US (2) US9116424B2 (enExample)
EP (1) EP2287666B1 (enExample)
JP (1) JP5693090B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4814682B2 (ja) * 2006-04-18 2011-11-16 株式会社日立ハイテクノロジーズ 微細構造パターンの転写方法及び転写装置
CN103558801A (zh) * 2013-11-08 2014-02-05 无锡英普林纳米科技有限公司 一种纳米压印设备
SG11201608362TA (en) * 2014-04-22 2016-11-29 Ev Group E Thallner Gmbh Method and device for embossing of a nanostructure
JP6489309B2 (ja) * 2015-05-14 2019-03-27 パナソニックＩｐマネジメント株式会社 インプリント方法およびインプリント装置
CN115812179B (zh) 2020-07-06 2026-02-27 Ev集团E·索尔纳有限责任公司 制造微结构及/或奈米结构之方法及装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0741001B1 (de) * 1995-05-04 2002-02-06 Gietz AG Präge-Druck- und Stanzmaschine
US20050160934A1 (en) * 2004-01-23 2005-07-28 Molecular Imprints, Inc. Materials and methods for imprint lithography
FI20030919A7 (fi) * 2003-06-19 2004-12-20 Avantone Oy Menetelmä ja laitteisto elektronisen ohutkalvokomponentin valmistamiseksi sekä elektroninen ohutkalvokomponentti
JP2005101201A (ja) * 2003-09-24 2005-04-14 Canon Inc ナノインプリント装置
JP4069081B2 (ja) * 2004-01-13 2008-03-26 東京エレクトロン株式会社 位置調整方法及び基板処理システム
JP4481698B2 (ja) * 2004-03-29 2010-06-16 キヤノン株式会社 加工装置
JP4574240B2 (ja) * 2004-06-11 2010-11-04 キヤノン株式会社 加工装置、加工方法、デバイス製造方法
US8011916B2 (en) 2005-09-06 2011-09-06 Canon Kabushiki Kaisha Mold, imprint apparatus, and process for producing structure
US7316554B2 (en) * 2005-09-21 2008-01-08 Molecular Imprints, Inc. System to control an atmosphere between a body and a substrate
US7491049B2 (en) * 2005-09-30 2009-02-17 Hon Hai Precision Industry Co., Ltd. Apparatus for hot embossing lithography
WO2007067469A2 (en) * 2005-12-08 2007-06-14 Molecular Imprints, Inc. Method for expelling gas positioned between a substrate and a mold
JPWO2007094213A1 (ja) 2006-02-14 2009-07-02 パイオニア株式会社 インプリント装置及びインプリント方法
US7462028B2 (en) * 2006-04-03 2008-12-09 Molecular Imprints, Inc. Partial vacuum environment imprinting
JP4995478B2 (ja) * 2006-04-18 2012-08-08 株式会社日立ハイテクノロジーズ ナノインプリント用スペーサ、及びこれを用いた電子顕微鏡調整用試料の製造方法、並びに電子顕微鏡調整用試料、及びこれを備えた電子顕微鏡
JP4908369B2 (ja) 2007-10-02 2012-04-04 株式会社東芝 インプリント方法及びインプリントシステム
NL1036034A1 (nl) * 2007-10-11 2009-04-15 Asml Netherlands Bv Imprint lithography.

Similar Documents

Publication Publication Date Title
WO2009135078A3 (en) Method and apparatus for fabricating optoelectromechanical devices by structural transfer using re-usable substrate
SG140481A1 (en) A method for fabricating micro and nano structures
WO2008105531A1 (ja) ペリクルフレーム装置、マスク、露光方法及び露光装置並びにデバイスの製造方法
WO2010036051A3 (en) Structure and manufacture method for multi-row lead frame and semiconductor package
JP2007509769A5 (enExample)
JP2009532245A (ja) リソグラフィ・インプリント・システム
WO2018163941A9 (ja) 印刷物の製造方法および印刷機
JP2011018915A5 (enExample)
WO2011122439A1 (ja) 微細凹凸パターンの形成方法及び形成装置並びに転写用基板の製造方法及び転写用基板
JP2016201485A (ja) インプリント装置、インプリント方法、および物品の製造方法
WO2009122113A3 (fr) Procede de production de nanostructures sur un substrat d'oxyde metallique, et dispositif forme de couches minces
JP2013519228A5 (enExample)
JP2012507859A5 (enExample)
EP2369412A3 (en) Imprint apparatus and method of manufacturing an article
WO2012121534A3 (ko) 2 이상의 패턴화된 기판의 제조방법 및 제조장치
WO2010018029A3 (de) Herstellungsverfahren für ein mikromechanisches bauteil mit elektroden in zwei ebenen und mikromechanisches bauteil
JP5822597B2 (ja) インプリント装置、及びそれを用いた物品の製造方法
WO2010117201A3 (ko) 금속 촉매를 이용한 폴리 실리콘 마스크의 제조방법 및 이를 이용한 반도체 소자의 제조방법
TW200604022A (en) A method of manufacturing a nozzle plate
CN102253597B (zh) 一种压缩式气体施压方式的纳米压印装置
TW200626374A (en) Method for manufacturing droplet ejection head, droplet ejection head, and droplet ejection apparatus
TW200744860A (en) Method for producing nozzle substrate, method for producing droplet-discharging head, head for discharging droplets, and apparatus for discharging droplets
EP2149817A3 (en) Method of producing mold
JP5693090B2 (ja) 基板のエンボス加工用装置
TW200744858A (en) Method and apparatus for manufacturing a pattern on a substrate and a liquid crystal display