JP2011517367A5 - - Google Patents
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- JP2011517367A5 JP2011517367A5 JP2010548862A JP2010548862A JP2011517367A5 JP 2011517367 A5 JP2011517367 A5 JP 2011517367A5 JP 2010548862 A JP2010548862 A JP 2010548862A JP 2010548862 A JP2010548862 A JP 2010548862A JP 2011517367 A5 JP2011517367 A5 JP 2011517367A5
- Authority
- JP
- Japan
- Prior art keywords
- raised surface
- surface shape
- inked
- micrometers
- visible light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims 9
- 239000002184 metal Substances 0.000 claims 7
- 238000000034 method Methods 0.000 claims 5
- 238000005530 etching Methods 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 2
- 238000000059 patterning Methods 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 125000001741 organic sulfur group Chemical group 0.000 claims 1
- 239000002094 self assembled monolayer Substances 0.000 claims 1
- 239000013545 self-assembled monolayer Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US3227308P | 2008-02-28 | 2008-02-28 | |
| US61/032,273 | 2008-02-28 | ||
| PCT/US2009/035271 WO2009108771A2 (en) | 2008-02-28 | 2009-02-26 | Methods of patterning a conductor on a substrate |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014036362A Division JP2014131071A (ja) | 2008-02-28 | 2014-02-27 | 基材上に導電体をパターン化する方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011517367A JP2011517367A (ja) | 2011-06-02 |
| JP2011517367A5 true JP2011517367A5 (cg-RX-API-DMAC7.html) | 2012-04-12 |
Family
ID=41012369
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010548862A Withdrawn JP2011517367A (ja) | 2008-02-28 | 2009-02-26 | 基材上に導電体をパターン化する方法 |
| JP2014036362A Pending JP2014131071A (ja) | 2008-02-28 | 2014-02-27 | 基材上に導電体をパターン化する方法 |
| JP2016084407A Active JP6321716B2 (ja) | 2008-02-28 | 2016-04-20 | 基材上に導電体をパターン化する方法 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014036362A Pending JP2014131071A (ja) | 2008-02-28 | 2014-02-27 | 基材上に導電体をパターン化する方法 |
| JP2016084407A Active JP6321716B2 (ja) | 2008-02-28 | 2016-04-20 | 基材上に導電体をパターン化する方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (4) | US8425792B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2257969B1 (cg-RX-API-DMAC7.html) |
| JP (3) | JP2011517367A (cg-RX-API-DMAC7.html) |
| CN (1) | CN102017071B (cg-RX-API-DMAC7.html) |
| TW (1) | TWI440094B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2009108771A2 (cg-RX-API-DMAC7.html) |
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-
2009
- 2009-02-26 JP JP2010548862A patent/JP2011517367A/ja not_active Withdrawn
- 2009-02-26 US US12/393,201 patent/US8425792B2/en not_active Expired - Fee Related
- 2009-02-26 EP EP09713944.8A patent/EP2257969B1/en not_active Not-in-force
- 2009-02-26 WO PCT/US2009/035271 patent/WO2009108771A2/en not_active Ceased
- 2009-02-26 CN CN2009801150751A patent/CN102017071B/zh not_active Expired - Fee Related
- 2009-02-27 TW TW098106538A patent/TWI440094B/zh not_active IP Right Cessation
-
2013
- 2013-03-21 US US13/848,162 patent/US8932475B2/en not_active Expired - Fee Related
-
2014
- 2014-02-27 JP JP2014036362A patent/JP2014131071A/ja active Pending
- 2014-12-04 US US14/560,748 patent/US9487040B2/en not_active Expired - Fee Related
-
2016
- 2016-04-20 JP JP2016084407A patent/JP6321716B2/ja active Active
- 2016-10-06 US US15/286,723 patent/US20170024041A1/en not_active Abandoned
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