JP2011516626A5 - - Google Patents
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- Publication number
- JP2011516626A5 JP2011516626A5 JP2010549716A JP2010549716A JP2011516626A5 JP 2011516626 A5 JP2011516626 A5 JP 2011516626A5 JP 2010549716 A JP2010549716 A JP 2010549716A JP 2010549716 A JP2010549716 A JP 2010549716A JP 2011516626 A5 JP2011516626 A5 JP 2011516626A5
- Authority
- JP
- Japan
- Prior art keywords
- sio
- average
- silicon
- per molecule
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001296 polysiloxane Polymers 0.000 claims description 30
- 229920005989 resin Polymers 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 25
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 17
- 229910052739 hydrogen Inorganic materials 0.000 claims description 17
- 239000001257 hydrogen Substances 0.000 claims description 17
- -1 polysiloxane Polymers 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 17
- 239000003431 cross linking reagent Substances 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 14
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 13
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims description 12
- 125000006657 (C1-C10) hydrocarbyl group Chemical group 0.000 claims description 7
- 125000001931 aliphatic group Chemical group 0.000 claims description 7
- 125000001183 hydrocarbyl group Chemical class 0.000 claims description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 7
- 125000003342 alkenyl group Chemical group 0.000 claims description 6
- 239000003054 catalyst Substances 0.000 claims description 6
- 150000002894 organic compounds Chemical class 0.000 claims description 6
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 4
- 239000013464 silicone adhesive Substances 0.000 claims 7
- 239000011248 coating agent Substances 0.000 claims 6
- 238000000576 coating method Methods 0.000 claims 6
- 238000010438 heat treatment Methods 0.000 claims 3
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 238000004132 cross linking Methods 0.000 claims 2
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 claims 2
- 239000011521 glass Substances 0.000 claims 2
- 229920002050 silicone resin Polymers 0.000 claims 2
- 239000004971 Cross linker Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US3344608P | 2008-03-04 | 2008-03-04 | |
| US61/033,446 | 2008-03-04 | ||
| PCT/US2009/034835 WO2009111196A1 (en) | 2008-03-04 | 2009-02-23 | Silicone composition, silicone adhesive, coated and laminated substrates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011516626A JP2011516626A (ja) | 2011-05-26 |
| JP2011516626A5 true JP2011516626A5 (cg-RX-API-DMAC7.html) | 2013-10-24 |
Family
ID=40875049
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010549719A Expired - Fee Related JP5331825B2 (ja) | 2008-03-04 | 2009-02-23 | シリコーン組成物、シリコーン接着剤、塗装基板及び積層基板 |
| JP2010549716A Pending JP2011516626A (ja) | 2008-03-04 | 2009-02-23 | シリコーン組成物、シリコーン接着剤、被覆基板及び積層基板 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010549719A Expired - Fee Related JP5331825B2 (ja) | 2008-03-04 | 2009-02-23 | シリコーン組成物、シリコーン接着剤、塗装基板及び積層基板 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20110027584A1 (cg-RX-API-DMAC7.html) |
| EP (2) | EP2265674A1 (cg-RX-API-DMAC7.html) |
| JP (2) | JP5331825B2 (cg-RX-API-DMAC7.html) |
| KR (2) | KR101502312B1 (cg-RX-API-DMAC7.html) |
| CN (2) | CN101925656A (cg-RX-API-DMAC7.html) |
| WO (2) | WO2009111199A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100273011A1 (en) * | 1996-12-20 | 2010-10-28 | Bianxiao Zhong | Silicone Composition, Silicone Adhesive, Coated and Laminated Substrates |
| WO2009111199A1 (en) * | 2008-03-04 | 2009-09-11 | Dow Corning Corporation | Silicone composition, silicone adhesive, coated and laminated substrates |
| KR101169032B1 (ko) | 2010-01-19 | 2012-07-26 | (주)에버텍엔터프라이즈 | 페이스-다운 실장형 반도체에 적용 가능한 다이본딩용 실리콘 조성물 |
| US20110283562A1 (en) * | 2010-05-21 | 2011-11-24 | George Shrum | Insole for footwear |
| CN103068886A (zh) | 2010-08-23 | 2013-04-24 | 道康宁公司 | 磷硅氧烷树脂以及包含磷硅氧烷树脂的可固化有机硅组合物、自立式膜和层合物 |
| JP2014500897A (ja) | 2010-11-09 | 2014-01-16 | ダウ コーニング コーポレーション | 有機リン酸化合物により可塑化されたヒドロシリル化硬化シリコーン樹脂 |
| CN103370360A (zh) * | 2010-12-08 | 2013-10-23 | 道康宁公司 | 适合形成封装物的硅氧烷组合物 |
| JP2013544949A (ja) * | 2010-12-08 | 2013-12-19 | ダウ コーニング コーポレーション | 封止材を形成するのに好適な二酸化チタンナノ粒子を含むシロキサン組成物 |
| KR101973826B1 (ko) * | 2011-10-18 | 2019-08-26 | 에이지씨 가부시키가이샤 | 적층체, 적층체의 제조 방법 및 전자 디바이스용 부재가 부착된 유리 기판의 제조 방법 |
| JP2014534324A (ja) * | 2011-11-08 | 2014-12-18 | ダウ コーニング コーポレーションDow Corning Corporation | 硬化性シリコーンエラストマーのオルガノポリシロキサン組成物及び表面改質 |
| CN103666367B (zh) * | 2012-09-19 | 2015-06-17 | 广东恒大新材料科技有限公司 | 一种led有机硅灌封胶及其应用 |
| WO2015000150A1 (en) * | 2013-07-03 | 2015-01-08 | Henkel IP & Holding GmbH | High temperature debondable adhesive |
| GB2520535A (en) * | 2013-11-25 | 2015-05-27 | Essex Safety Glass Ltd | Laminated glazings |
| CN105980150B (zh) * | 2014-02-07 | 2018-01-30 | 旭硝子株式会社 | 玻璃层叠体 |
| CN103821008B (zh) * | 2014-03-12 | 2016-09-07 | 李江群 | 三层结构的有机硅合成革及其制备方法 |
| WO2015196345A1 (en) * | 2014-06-24 | 2015-12-30 | Henkel (China) Company Limited | 1k uv and thermal cure high temperature debondable adhesive |
| JP6613682B2 (ja) * | 2015-07-28 | 2019-12-04 | セイコーエプソン株式会社 | 電子デバイス、液体吐出ヘッド。 |
| FR3056442A1 (fr) * | 2016-09-27 | 2018-03-30 | Compagnie Generale Des Etablissements Michelin | Produit stratifie a base de caoutchouc silicone et de composite fibre-resine |
| FR3056444A1 (fr) | 2016-09-27 | 2018-03-30 | Compagnie Generale Des Etablissements Michelin | Roue elastique non pneumatique incorporant un stratifie a base de caoutchouc silicone et de composite fibre-resine |
| TWI747956B (zh) * | 2016-09-30 | 2021-12-01 | 美商道康寧公司 | 橋接聚矽氧樹脂、膜、電子裝置及相關方法 |
| TWI742160B (zh) | 2016-09-30 | 2021-10-11 | 美商道康寧公司 | 橋接聚矽氧樹脂、膜、電子裝置及相關方法 |
| JPWO2018088316A1 (ja) * | 2016-11-11 | 2019-10-03 | ダウ・東レ株式会社 | 硬化性シリコーン組成物およびそれを用いた光半導体装置 |
| TW201829672A (zh) * | 2017-02-10 | 2018-08-16 | 美商道康寧公司 | 可固化組成物及經塗佈基材 |
| WO2019159611A1 (ja) * | 2018-02-19 | 2019-08-22 | 東レ・ダウコーニング株式会社 | シリコーン感圧接着剤組成物および積層体 |
| US12110393B2 (en) * | 2018-08-17 | 2024-10-08 | Wacker Chemie Ag | Crosslinkable organopolysiloxane compositions |
| TWI844552B (zh) * | 2018-09-10 | 2024-06-11 | 美商陶氏有機矽公司 | 用於生產光學聚矽氧總成之方法、及藉其生產之光學聚矽氧總成 |
| CN119875379A (zh) * | 2025-03-28 | 2025-04-25 | 广东双利电缆有限公司 | 一种耐火硅橡胶及其制备方法和电缆 |
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| JP5043317B2 (ja) * | 2005-08-05 | 2012-10-10 | 東レ・ダウコーニング株式会社 | 環状ジハイドロジェンポリシロキサン、ハイドロジェンポリシロキサン、それらの製造方法、シリカ系ガラス成形体およびその製造方法、光学素子およびその製造方法 |
| JP2007091935A (ja) * | 2005-09-29 | 2007-04-12 | Fujifilm Corp | ポリマー、膜形成用組成物、絶縁膜およびその製造方法 |
| TWI398487B (zh) * | 2005-12-06 | 2013-06-11 | Shinetsu Chemical Co | A polysiloxane composition and a hardened product thereof |
| WO2009111199A1 (en) * | 2008-03-04 | 2009-09-11 | Dow Corning Corporation | Silicone composition, silicone adhesive, coated and laminated substrates |
-
2009
- 2009-02-23 WO PCT/US2009/034841 patent/WO2009111199A1/en not_active Ceased
- 2009-02-23 JP JP2010549719A patent/JP5331825B2/ja not_active Expired - Fee Related
- 2009-02-23 JP JP2010549716A patent/JP2011516626A/ja active Pending
- 2009-02-23 EP EP20090718020 patent/EP2265674A1/en not_active Withdrawn
- 2009-02-23 CN CN2009801030054A patent/CN101925656A/zh active Pending
- 2009-02-23 US US12/918,353 patent/US20110027584A1/en not_active Abandoned
- 2009-02-23 EP EP20090718476 patent/EP2250221A1/en not_active Withdrawn
- 2009-02-23 WO PCT/US2009/034835 patent/WO2009111196A1/en not_active Ceased
- 2009-02-23 KR KR1020107019784A patent/KR101502312B1/ko not_active Expired - Fee Related
- 2009-02-23 CN CN2009801076236A patent/CN101959961B/zh not_active Expired - Fee Related
- 2009-02-23 KR KR1020107018286A patent/KR20100137423A/ko not_active Ceased
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