JP2011516626A5 - - Google Patents

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Publication number
JP2011516626A5
JP2011516626A5 JP2010549716A JP2010549716A JP2011516626A5 JP 2011516626 A5 JP2011516626 A5 JP 2011516626A5 JP 2010549716 A JP2010549716 A JP 2010549716A JP 2010549716 A JP2010549716 A JP 2010549716A JP 2011516626 A5 JP2011516626 A5 JP 2011516626A5
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JP
Japan
Prior art keywords
sio
average
silicon
per molecule
resin
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Pending
Application number
JP2010549716A
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English (en)
Japanese (ja)
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JP2011516626A (ja
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Priority claimed from PCT/US2009/034835 external-priority patent/WO2009111196A1/en
Publication of JP2011516626A publication Critical patent/JP2011516626A/ja
Publication of JP2011516626A5 publication Critical patent/JP2011516626A5/ja
Pending legal-status Critical Current

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JP2010549716A 2008-03-04 2009-02-23 シリコーン組成物、シリコーン接着剤、被覆基板及び積層基板 Pending JP2011516626A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US3344608P 2008-03-04 2008-03-04
US61/033,446 2008-03-04
PCT/US2009/034835 WO2009111196A1 (en) 2008-03-04 2009-02-23 Silicone composition, silicone adhesive, coated and laminated substrates

Publications (2)

Publication Number Publication Date
JP2011516626A JP2011516626A (ja) 2011-05-26
JP2011516626A5 true JP2011516626A5 (OSRAM) 2013-10-24

Family

ID=40875049

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2010549716A Pending JP2011516626A (ja) 2008-03-04 2009-02-23 シリコーン組成物、シリコーン接着剤、被覆基板及び積層基板
JP2010549719A Expired - Fee Related JP5331825B2 (ja) 2008-03-04 2009-02-23 シリコーン組成物、シリコーン接着剤、塗装基板及び積層基板

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2010549719A Expired - Fee Related JP5331825B2 (ja) 2008-03-04 2009-02-23 シリコーン組成物、シリコーン接着剤、塗装基板及び積層基板

Country Status (6)

Country Link
US (1) US20110027584A1 (OSRAM)
EP (2) EP2265674A1 (OSRAM)
JP (2) JP2011516626A (OSRAM)
KR (2) KR20100137423A (OSRAM)
CN (2) CN101959961B (OSRAM)
WO (2) WO2009111196A1 (OSRAM)

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KR101169032B1 (ko) 2010-01-19 2012-07-26 (주)에버텍엔터프라이즈 페이스-다운 실장형 반도체에 적용 가능한 다이본딩용 실리콘 조성물
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KR20130097732A (ko) 2010-08-23 2013-09-03 다우 코닝 코포레이션 포스포실록산 수지와, 포스포실록산 수지를 포함하는 경화성 실리콘 조성물, 자립 필름 및 라미네이트
JP2014500897A (ja) 2010-11-09 2014-01-16 ダウ コーニング コーポレーション 有機リン酸化合物により可塑化されたヒドロシリル化硬化シリコーン樹脂
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KR102168052B1 (ko) * 2014-06-24 2020-10-21 헨켈 아게 운트 코. 카게아아 1k uv 및 열 경화성 고온 탈결합가능한 접착제
JP6613682B2 (ja) 2015-07-28 2019-12-04 セイコーエプソン株式会社 電子デバイス、液体吐出ヘッド。
FR3056444A1 (fr) 2016-09-27 2018-03-30 Compagnie Generale Des Etablissements Michelin Roue elastique non pneumatique incorporant un stratifie a base de caoutchouc silicone et de composite fibre-resine
FR3056442A1 (fr) * 2016-09-27 2018-03-30 Compagnie Generale Des Etablissements Michelin Produit stratifie a base de caoutchouc silicone et de composite fibre-resine
TWI747956B (zh) * 2016-09-30 2021-12-01 美商道康寧公司 橋接聚矽氧樹脂、膜、電子裝置及相關方法
TWI742160B (zh) 2016-09-30 2021-10-11 美商道康寧公司 橋接聚矽氧樹脂、膜、電子裝置及相關方法
CN110088207B (zh) * 2016-11-11 2022-10-14 陶氏东丽株式会社 可固化硅酮组合物和使用其的光学半导体装置
TW201829672A (zh) 2017-02-10 2018-08-16 美商道康寧公司 可固化組成物及經塗佈基材
CN111615544A (zh) * 2018-02-19 2020-09-01 陶氏东丽株式会社 硅酮压敏粘合剂组合物和层状产物
JP7203196B2 (ja) * 2018-08-17 2023-01-12 ワッカー ケミー アクチエンゲゼルシャフト 架橋性オルガノシロキサン組成物
TWI844552B (zh) * 2018-09-10 2024-06-11 美商陶氏有機矽公司 用於生產光學聚矽氧總成之方法、及藉其生產之光學聚矽氧總成
CN119875379A (zh) * 2025-03-28 2025-04-25 广东双利电缆有限公司 一种耐火硅橡胶及其制备方法和电缆

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