JP2011514519A - 高周波数介在器をもったテストシステム - Google Patents

高周波数介在器をもったテストシステム Download PDF

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Publication number
JP2011514519A
JP2011514519A JP2010547635A JP2010547635A JP2011514519A JP 2011514519 A JP2011514519 A JP 2011514519A JP 2010547635 A JP2010547635 A JP 2010547635A JP 2010547635 A JP2010547635 A JP 2010547635A JP 2011514519 A JP2011514519 A JP 2011514519A
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JP
Japan
Prior art keywords
conductive
interposer
conductive housing
housing
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010547635A
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English (en)
Japanese (ja)
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JP2011514519A5 (enExample
Inventor
マーク ビー． カルティエ、
Original Assignee
テラダイン、 インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by テラダイン、 インコーポレイテッド filed Critical テラダイン、 インコーポレイテッド
Publication of JP2011514519A publication Critical patent/JP2011514519A/ja
Publication of JP2011514519A5 publication Critical patent/JP2011514519A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
JP2010547635A 2008-02-21 2009-02-19 高周波数介在器をもったテストシステム Pending JP2011514519A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/070,864 US7816932B2 (en) 2008-02-21 2008-02-21 Test system with high frequency interposer
PCT/US2009/001045 WO2009105222A2 (en) 2008-02-21 2009-02-19 Test system with high frequency interposer

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015235356A Division JP2016053588A (ja) 2008-02-21 2015-12-02 高周波数介在器を備えた試験システム

Publications (2)

Publication Number Publication Date
JP2011514519A true JP2011514519A (ja) 2011-05-06
JP2011514519A5 JP2011514519A5 (enExample) 2013-09-05

Family

ID=40801937

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2010547635A Pending JP2011514519A (ja) 2008-02-21 2009-02-19 高周波数介在器をもったテストシステム
JP2015235356A Pending JP2016053588A (ja) 2008-02-21 2015-12-02 高周波数介在器を備えた試験システム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2015235356A Pending JP2016053588A (ja) 2008-02-21 2015-12-02 高周波数介在器を備えた試験システム

Country Status (7)

Country Link
US (1) US7816932B2 (enExample)
JP (2) JP2011514519A (enExample)
KR (1) KR101547890B1 (enExample)
CN (1) CN102027380B (enExample)
DE (1) DE112009000415B4 (enExample)
TW (1) TWI438438B (enExample)
WO (1) WO2009105222A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160087820A (ko) * 2013-11-19 2016-07-22 테라다인 인코퍼레이티드 장치와 테스터 사이에서 신호를 전송하는 인터커넥트

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* Cited by examiner, † Cited by third party
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US7977583B2 (en) * 2007-12-13 2011-07-12 Teradyne, Inc. Shielded cable interface module and method of fabrication
CN102540004A (zh) * 2010-12-08 2012-07-04 鸿富锦精密工业（深圳）有限公司 测试装置
CH705740B1 (de) 2011-11-14 2015-08-14 Huber+Suhner Ag Kabelinterface für Koaxialkabel.
CN102809696B (zh) * 2012-08-17 2015-04-15 福建南平南孚电池有限公司 金属夹具、具有该金属夹具的设备及其使用方法
US9899757B2 (en) * 2015-09-03 2018-02-20 Apple Inc. Surface connector with silicone spring member
US9876307B2 (en) * 2015-09-03 2018-01-23 Apple Inc. Surface connector with silicone spring member
US20190045632A1 (en) * 2018-08-01 2019-02-07 Intel Corporation Connector, board assembly, computing system, and methods thereof
WO2021261285A1 (ja) * 2020-06-22 2021-12-30 株式会社ヨコオ 検査装置
US11394154B1 (en) 2022-03-09 2022-07-19 Jeffrey G. Buchoff Pliant electrical interface connector and its associated method of manufacture

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JPH11248748A (ja) * 1998-03-05 1999-09-17 Advantest Corp プローブカード
JP2003121468A (ja) * 2001-10-17 2003-04-23 Anritsu Corp 電極プローバー
JP2004138405A (ja) * 2002-10-15 2004-05-13 Renesas Technology Corp 半導体装置測定用プローブ
JP2004139801A (ja) * 2002-10-16 2004-05-13 Japan Electronic Materials Corp 接続介在体
JP2004325305A (ja) * 2003-04-25 2004-11-18 Yokowo Co Ltd Ｉｃソケット
JP2005149854A (ja) * 2003-11-13 2005-06-09 Nec Electronics Corp プローブ及びｉｃソケット並びに半導体回路
JP2005156530A (ja) * 2003-11-05 2005-06-16 Nhk Spring Co Ltd 導電性接触子ホルダ、導電性接触子ユニット
JP2006349692A (ja) * 2006-08-01 2006-12-28 Japan Electronic Materials Corp プローブカード
JP2007178165A (ja) * 2005-12-27 2007-07-12 Yokowo Co Ltd 検査ユニット
JP2008039768A (ja) * 2006-07-10 2008-02-21 Tokyo Electron Ltd プローブカード

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US5178549A (en) * 1991-06-27 1993-01-12 Cray Research, Inc. Shielded connector block
US5302923A (en) * 1992-07-16 1994-04-12 Hewlett-Packard Company Interconnection plate having high frequency transmission line through paths
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US6264476B1 (en) 1999-12-09 2001-07-24 High Connection Density, Inc. Wire segment based interposer for high frequency electrical connection
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Publication number Priority date Publication date Assignee Title
JPH11248748A (ja) * 1998-03-05 1999-09-17 Advantest Corp プローブカード
JP2003121468A (ja) * 2001-10-17 2003-04-23 Anritsu Corp 電極プローバー
JP2004138405A (ja) * 2002-10-15 2004-05-13 Renesas Technology Corp 半導体装置測定用プローブ
JP2004139801A (ja) * 2002-10-16 2004-05-13 Japan Electronic Materials Corp 接続介在体
JP2004325305A (ja) * 2003-04-25 2004-11-18 Yokowo Co Ltd Ｉｃソケット
JP2005156530A (ja) * 2003-11-05 2005-06-16 Nhk Spring Co Ltd 導電性接触子ホルダ、導電性接触子ユニット
JP2005149854A (ja) * 2003-11-13 2005-06-09 Nec Electronics Corp プローブ及びｉｃソケット並びに半導体回路
JP2007178165A (ja) * 2005-12-27 2007-07-12 Yokowo Co Ltd 検査ユニット
JP2008039768A (ja) * 2006-07-10 2008-02-21 Tokyo Electron Ltd プローブカード
JP2006349692A (ja) * 2006-08-01 2006-12-28 Japan Electronic Materials Corp プローブカード

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160087820A (ko) * 2013-11-19 2016-07-22 테라다인 인코퍼레이티드 장치와 테스터 사이에서 신호를 전송하는 인터커넥트
JP2016538718A (ja) * 2013-11-19 2016-12-08 テラダイン、 インコーポレイテッド デバイスとテスターとの間で信号を送信するための相互配線
KR102249099B1 (ko) 2013-11-19 2021-05-10 테라다인 인코퍼레이티드 장치와 테스터 사이에서 신호를 전송하는 인터커넥트

Also Published As

Publication number Publication date
DE112009000415B4 (de) 2024-07-11
US20090212802A1 (en) 2009-08-27
JP2016053588A (ja) 2016-04-14
WO2009105222A3 (en) 2009-12-17
US7816932B2 (en) 2010-10-19
TWI438438B (zh) 2014-05-21
WO2009105222A2 (en) 2009-08-27
TW200937017A (en) 2009-09-01
CN102027380B (zh) 2014-03-12
KR20100122086A (ko) 2010-11-19
CN102027380A (zh) 2011-04-20
KR101547890B1 (ko) 2015-08-27
DE112009000415T5 (de) 2011-01-13

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